SOD4001T-SH thru SOD4007T-SH Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=75°C with no thermal runaway * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE We declare that the material of product is Terminals: Plated leads, solderable per Haloggen free (green epoxy compound) MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None Electrical Characteristic 1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol Device marking code SOD40 01T-SH SOD40 02T-SH SOD40 03T-SH SOD40 04T-SH SOD40 05T-SH SOD40 06T-SH SOD40 07T-SH A1T A2T A3T A4T A5T A6T A7T Unit Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current lead length at TC= 75°C(Note 1) IF(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A reverse surger current(20mS) IRSM 18 mA Typical reverse recovery time (Note 1) Typical thermal resistance (Note 2) Operating junction temperature range storage temperature range trr 1800 ns RθJA 110 °C/W TJ –55 to +150 °C TSTG –65 to +175 °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol SOD40 01T-SH SOD40 02T-SH SOD40 03T-SH SOD40 04T-SH SOD40 05T-SH SOD40 06T-SH SOD40 07T-SH Unit VF 1.1 V Maximum DC reverse current TJ= 25°C at rated DC blocking voltage TJ = 125°C IR 5.0 50 µA Typical junction capacitance at 4.0V, 1MHz CJ 15.0 PF Maximum instantaneous forward voltage at 1.0A NOTES: 1. IF = 0.5A, IR = 1.0A, IRR = 0.25A 2. 8.0mm2 (.013mm thick) land areas SOD4001T-SH thru SOD4007T-SH 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load 1.0 0.5 0.375" (9.5mm) Lead Length 0 0 0.1 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 0.01 0.001 0.6 15 0 10 Number of Cycles at 60Hz 100 Fig 4. – Typical Reverse Characteristics 100 10 Tj=125℃ 1.0 Tj=75℃ 0.1 Tj=25℃ 0.01 0.8 1.0 1.2 1.4 1.6 Instantaneous Forward Voltage (V) Fig 5. –typical transient thermal impedance 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 100 Junction Capacitance (pF) Transient thermal impedance(°C/W) 30 1 Instantaneous Reverse Current (µA) 1.0 100 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) 25 50 75 100 125 150 175 CASE TEMPERATURE:Tc(°C) Fig 3. – Typical Instantaneous Forward Characteristics 10 Instantaneous Forward Current (A) Average Forward Rectified Current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 10 1.0 0.1 10 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1.0 0.01 0.1 1.0 10 t,Pulse duration,sec 100 0.1 1 10 Reverse Voltage (V) 100 SOD4001T-SH thru SOD4007T-SH 3. dimension: SOD123-FL MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ DIM A B C D E H J K INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout B C A Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) Title : DOC NO.： Power Diode SMD Package Pa cking Spec Version: 5 WI-258 Modification: 0 Page: 2 5.1 、SMD Packing Reel Spec & Packing Quantity 5.1.1 Reel Packing A. Reel Spec unit：mm SPEC SMA 7" reel SMA13" reel SMA-FL13" reel TO277 13" reel SOD123FL 7" reel SOD323HE 7" reel SMB-FL 13" reel A 177.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 177.0±2.0 177.0±2.0 330.0±2.0 B 54.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 50.0±0.5 50.0±0.5 75.0±0.5 C 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 W 13.2±0.2 13.2±0.2 13.2±0.2 13.2±0.2 9.4±1.5 9.4±1.5 13.2±0.2 Quantity/Reel 2K 5K 5K 5K 3K 3K 5K B. 13" reel packing box unit：mm A 335±5.0 size B 335±2.0 as per above packing Spec SMA13" reel TO277 13" reel SMB-FL 13" reel Q'ty/Box 10K 10K 10K C 40±1.0 Title : Power Diode SMD Package Packing Spec DOC NO.： WI-258 DOC NO.： WI-258 Page: 3 C. 7" reel packing box unit：mm B 188±2.0 C 138±2.0 186±2.0 139±2.0 as per above packing Q'ty/Box 16K SMA/SMA-FL SOD123FL 30K SOD323HE 30K 185±2.0 SMA/SMA-FL A 188±2.0 SOD123FL SOD323HE D. reel packing carton unit：mm A 350±2.0 size B 340±2.0 C 350±2.0 as per above packing Spec SMA/SMA-FL 7" reel SMA13"reel SMA-FL13"reel TO277 13" reel SMB-FL 13" reel Q'ty/Carton 80K 80K 80K 80K 80K unit：mm SOD123FL SOD323HE A B C 455±2.0 400±2.0 410±2.0 as per above packing Spec SOD123-FL 7" reel SOD323HE 7" reel 5.1.2 Tape Spec A. Cover Tape unit：mm A SMA /SMA-FL SMB-FL /TO277 B 9.5±0.10 SOD123FL 5.4±0.10 SOD323HE 0.062±0.007 Q'ty/Carton 360K 360K Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 4 B. Carrier Tape Do P2 Po t P1 A D1 A' Bo W F E B' B SEC.:B-B' Cathode(tape hole side） Ko Ao SEC.:A-A' Item W P1 E F D0 D1 P0 P2 10P0 A0 B0 K0 SOD323HE 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.45±0.1 2.75±0.1 0.80±0.1 SOD123FL 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.95±0.1 3.95±0.1 1.30±0.1 SMA 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.79±0.1 5.33±0.1 2.36±0.1 T 0.25±0.05 0.25±0.05 0.25±0.05 SMA-FL 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.83±0.1 4.75±0.1 1.42±0.1 SMB-FL TO277 12±0.3 12±0.3 8±0.1 8±0.1 1.75±0.1 1.75±0.1 5.5±0.05 5.5±.05 1.55±0.05 1.55±0.05 1.55±0.05 1.5±0.1 4±0.1 4±0.1 2±0.05 2±0.05 40±0.2 40±0.2 4.3±0.1 3.8±0.1 5.75±0.1 6.8±0.1 1.35±0.1 1.4±0.1 0.25±0.05 0.25±0.05 0.25±0.05 Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 5 5.2、SMD Power Diode General Packing Spec A. 7" reel all labels will be at cathode side of reel ； Ｂ C A C side front A:LRC label; B:Environment Label C:Halide free label B. 13" reel A Ｂ C Ｂ C A A:LRC label; B:Environment Labe C:Halide free label C.Tape lead: face anode side of the reel,upper side is the tape lead position. All labels are at cathode side of the reel. 标题: DOC NO.： Power Diode SMD Package Packing Spec Version: 5 Modification: 0 Page: C. Label Content ： LRC Label WI-258 6 Two-dimension code Manufacturing it P/N ` Lot No. Date code Maker Quantity lot: 140106049X: 140106---2014/1/6；049----lot number:49；X：product code Environment Label Halide-free Label Green SOD4001T-SH thru SOD4007T-SH Reel packing PACKAGE REEL SIZE SOD123-FL 7" REEL COMPONENT (PCS) BOX INNER BOX REEL DIA. (pcs) (mm) (mm) 30,000 183*183*123 178 SPACING 3,000 (mm) 4.0 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Soldering Condition Profile Feature Average ramp-up rate(T to TP) L <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate <3sec Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) Ramp-down Rate Time 25℃ to Peak Temperature 10~30sec <6℃/sec <6minutes CARTON SIZE (mm) 382*262*387 APPOX. CARTON GROSS (PCS) WEIGHT 240,000 (kg) 8.7 SOD4001T-SH thru SOD4007T-SH 6.High reliability test capabilities Item Test Condition Reference Solder Resistance at 260±5℃ for 10±2sec immerse body into solder 1/16" ± 1/32" MIL-STD-750D METHOD-2031 Solderability at 245±5℃ for 5 sec MIL-STD-202F METHOD-208 High Temperature Reverse Bias VR=80% rate at Tj=150℃ for 168hrs MIL-STD-750D METHOD-1038 Forward Operation Life Rated average rectifier current TA=25℃ for 500hrs MIL-STD-750D METHOD-1027 Intermittent Operation Life TA=25℃，IF=IO On state:power on for 5 min. Off state:power off for 5 min. on and off for 500 cycles MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles MIL-STD-750D METHOD-1051 Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃，RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 175℃ for 1000hrs MIL-STD-750D METHOD-1031 SOD4001T-SH thru SOD4007T-SH 7. Update Record 版次 更新记录 更新作者 更新日期 1 第一版 周杰 2013.07.19