v81.5x5: 81 Ball Thin, Fine Pitch, Plastic Ball Grid Array

Plastic Packages for Integrated Circuits
Thin, Fine Pitch, Plastic Ball Grid Array Package (TFBGA)
V81.5x5
D
A1 CORNER
B
A
81 BALL THIN, FINE PITCH, PLASTIC BALL GRID ARRAY
PACKAGE (TFBGA)
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.75
0.91
1.07
-
A1
0.15
0.21
0.27
-
A2
0.60
0.70
0.80
-
b
0.25
0.30
0.35
-
D/E
4.90
5.00
5.10
-
E
D1/E1
TOP VIEW
4.0 BSC
-
N
81
3
e
0.5 BSC
-
MD/ME
9x9
6
Rev. 0 11/07
D1
NOTES:
1 2 3 4 5 6 7 8
9
A1 CORNER
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994.
J
H
G
F
E
D
C
B
A
3. ā€œNā€ is the total number of balls.
4. Primary datum C and seating plane are defined by the spherical
crowns of the contact balls.
e
E1
5. Pin ā€œA1ā€ is marked on the top and bottom sides adjacent to A1.
6. "MD" and "ME" are the number of balls in the matrix in the D and
E directions respectively.
b
e
0.15
0.05
M C A B
M C
BOTTOM VIEW
0.10
A
C
A2
A1
SEATING PLANE
SIDE VIEW
1
C
0.08
C