ISL76120ARTZ

DATASHEET
Automotive Grade USB 2.0 High/Full Speed Multiplexer
ISL76120
Features
The Intersil ISL76120 dual 2:1 multiplexer IC is a single supply
part that can operate from a single 2.7V to 5.5V supply. It
contains two SPDT (Single Pole/Double Throw) switches
configured as a DPDT. The part was designed for switching
between USB high-speed and USB full-speed sources in portable
battery powered products.
• High speed (480Mbps) and full speed (12Mbps) signaling
capability per USB 2.0
• 1.8V logic compatible (2.7V to +3.6V supply)
• Enable pin to open all switches, simplifies multiple USB
client management
• -3dB frequency
- HSx switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 880MHz
- FSx switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550MHz
The normally-closed (NC) FSx switches can swing rail-to-rail and
were specifically designed to pass USB full speed data signals
(12Mbps) that range from 0V to 3.6V. The normally-open (NO)
HSx switches have high bandwidth and low capacitance and
were specifically designed to pass USB high speed data signals
(480Mbps) with minimal distortion.
• Crosstalk at 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -70dB
• Off-isolation at 100kHz . . . . . . . . . . . . . . . . . . . . . . . . . . -98dB
The part can be used in a variety of automotive entertainment
and infotainment applications where consumer USB devices
such as Portable Media Players (PMPs) are to be connected to
embedded systems. The product allows switching between a
high-speed transceiver and a full-speed transceiver while
connected to a single USB host. Additionally, the part can be
used for charge control of PMPs.
• Single supply operation (VDD). . . . . . . . . . . . . . . . . 2.7V to 5.5V
The digital logic inputs are 1.8V logic compatible when operated
with a 2.7V to 3.6V supply. The part has an enable pin to open
all switches. It can be used to facilitate proper bus disconnect
and connection when switching between the USB sources.
• Pb-Free (RoHS Compliant)
• Available in TDFN package
• Robust ESD rating . . . . . . . . . . . . . . . . . . . . . . . . > 8.5kV HBM
• Ultra-low operating current . . . . . . . . . . . . . . . . . . . . . . . 60nA
• -40°C to +105°C Operation
• AEC-Q100 qualified component
Applications
• Automotive
- USB docks
- MP3 and PMP player attach kits
- Infotainment systems
The ISL76120 is available in a 10 Ld 3mmx3mm TDFN
package. It operates across a temperature range of -40°C to
+105°C.
• After market automotive options
3.3V
µCONTROLLER
VDD
IN
USB CONNECTOR
VBUS
ISL76120
LOGIC CIRCUITRY
EN
4MΩ
HSD1
HSD2
DCOMD1
D+
FSD1
COMD2
FSD2
GND
USB
HIGH-SPEED
TRANSCEIVER
USB
FULL-SPEED
TRANSCEIVER
GND
PORTABLE MEDIA DEVICE
FIGURE 1. APPLICATION BLOCK DIAGRAM
January 9, 2015
FN6711.3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2008, 2013, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL76120
Pin Configuration
ISL76120
(10 LD TDFN)
TOP VIEW
LOGIC
CONTROL
VDD
1
IN
2
9
HSD1
COMD1
3
8
HSD2
COMD2
4
7 FSD1
GND
5
6
4M
10 EN
FSD2
NOTE:
1. ISL76120 Switches Shown for IN = Logic “0” and EN = Logic “1”.
Pin Descriptions
Truth Table
ISL76120
ISL76120
EN
IN
FSD1, FSD2
HSD1, HSD2
1
0
ON
OFF
1
1
OFF
ON
0
X
OFF
OFF
Logic “0” when 0.5V, Logic “1” when 1.4V with a 2.7V to 3.6V
Supply. X = Don’t Care
PIN
NUMBER
NAME
1
VDD
2
IN
3
COMD1
USB Common Port
4
COMD2
USB Common Port
5
GND
Ground Connection
6
FSD2
Full Speed USB Differential Port
7
FSD1
Full Speed USB Differential Port
8
HSD2
High Speed USB Differential Port
9
HSD1
High Speed USB Differential Port
10
EN
FUNCTION
Power Supply
Select Logic Control Input
Bus Switch Enable
Ordering Information
PART NUMBER
(Notes 2, 3, 4)
ISL76120ARTZ
PART MARKING
6120
TEMP. RANGE
(°C)
-40 to +105
PACKAGE
(RoHS Compliant)
10 Ld 3x3 TDFN
PKG. DWG. #
L10.3x3A
NOTES:
2. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see product information page for ISL76120. For more information on MSL, please see tech brief TB363.
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ISL76120
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Input Voltages
FSD2, FSD1, HSD2, HSD1 (Note 5) . . . . . . . . . . . . . - 1V to ((VDD) +0.3V)
IN, EN (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to ((VDD) +0.3V)
Output Voltages
COMD1, COMD2 (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 5V
Continuous Current (HSD2, HSD1, FSD2, FSD1) . . . . . . . . . . . . . . . ±40mA
Peak Current (HSD2, HSD1, FSD2, FSD1)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . . . . . ±100mA
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
10 Ld 3x3 TDFN Package (Notes 6, 7). . . .
50
9
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +105°C
VDD Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. Signals on FSD1, FSD2, HSD1, HSD2, COMD1, COMD2, EN, IN exceeding VDD or GND by specified amount are clamped. Limit current to maximum
current ratings.
6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
7. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Test Conditions: VDD = +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VENH = 1.4V, VENL = 0.5V, (Note 8).
Boldface limits apply across the operating temperature range, -40°C to +105°C.
PARAMETER
TEST CONDITIONS
MAX
TEMP
MIN
(°C) (Notes 9, 10) TYP (Notes 9, 10) UNITS
ANALOG SWITCH CHARACTERISTICS
NC Switches (FSD1, FSD2)
Analog Signal Voltage Range, VANALOG
VDD = 3.3V, IN = 0V, EN = 3.3V
Full
0
-
VDD
V
ON-Resistance, rON
VDD = 3.3V, IN = 0.5V, EN = 1.4V, ICOMx = 40mA,
VFSD1 or VFSD2 = 0V to 3.3V (see Figure 5)
+25
-
7
10
Ω
Full
-
7.8
15
Ω
VDD = 3.3V, IN = 0.5V, EN = 1.4V, ICOMx = 40mA,
VFSD1 or VFSD2 = Voltage at max rON over signal range of 0V
to 3.3V (Note 12)
+25
-
0.1
1.2
Ω
Full
-
0.7
1.4
Ω
VDD = 3.3V, IN = 0.5V, EN = 1.4V, ICOMx = 40mA,
VFSD1 or VFSD2 = 0V to 3.3V (Note 11)
+25
-
4
6
Ω
Full
-
4.1
8
Ω
V+ = 3.6V, IN = 3.6V, EN = 0V and 3.6V, VCOMx = 0.3V, 3V,
VFSX = 3V, 0.3V
+25
-20
0.4
20
nA
Full
-70
0.6
70
nA
V+ = 3.6V, IN = 0V, EN = 3.6V, VCOMx = 0.3V, 3V,
VFSX = 0.3V, 3V
+25
-20
2
20
nA
Full
-70
4.7
70
nA
Analog Signal Voltage Range, VANALOG
VDD = 3.3V, IN = 3.3V, EN = 3.3V
Full
0
-
VDD
V
ON-Resistance, rON
VDD = 3.3V, IN = 1.4V, EN = 1.4V, ICOMx = 1mA,
VHSD2 or VHSD1 = 3.3V (see Figure 4)
+25
-
25
30
Ω
Full
-
29
35
Ω
VDD = 3.3V, IN = 1.4V, EN = 1.4V, ICOMx = 40mA, VHSD2 or
VHSD1 = 0V to 400mV (see Figure 4)
+25
-
4.5
6
Ω
Full
-
5.1
9
Ω
VDD = 3.3V, IN = 1.4V, EN = 1.4V, ICOMx = 40mA,
VHSD2 or VHSD1 = Voltage at max rON, Voltage at max rON
over signal range of 0V to 400mV (Note 12)
+25
-
0.2
1.3
Ω
Full
-
0.7
1.5
Ω
VDD = 3.3V, IN = 1.4V, EN = 1.4V, ICOMx = 40mA, VHSD2 or
VHSD1 = 0V to 400mV (Note 11)
+25
-
0.4
1
Ω
Full
-
0.43
1.5
Ω
rON Matching Between Channels, rON
rON Flatness, rFLAT(ON)
OFF Leakage Current, IFSX(OFF)
ON Leakage Current, IFSX(ON)
NO Switches (HSD1, HSD2)
ON-Resistance, rON
rON Matching Between Channels, rON
rON Flatness, rFLAT(ON)
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ISL76120
Electrical Specifications Test Conditions: VDD = +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VENH = 1.4V, VENL = 0.5V, (Note 8).
Boldface limits apply across the operating temperature range, -40°C to +105°C. (Continued)
PARAMETER
TEST CONDITIONS
MAX
TEMP
MIN
(°C) (Notes 9, 10) TYP (Notes 9, 10) UNITS
OFF Leakage Current, IHSD2(OFF) or
IHSD1(OFF)
VDD = 3.6V, IN = 0V, EN = 0 and 3.6V, VCOMD1 or
VCOMD2 = 3V, 0.3V, VHSD2 or VHSD1 = 0.3V, 3V
+25
-20
0.3
20
nA
Full
-70
1
70
nA
ON Leakage Current, IHSD2(ON) or
IHSD1(ON)
VDD = 3.6V, IN = 3.6V, EN = 3.6V, VCOMD1 or
VCOMD2 = 0.3V, 3.0V, VHSD2 or VHSD1 = 0.3V, 3.0V
+25
-20
4.8
20
nA
Full
-70
5
70
nA
Turn-ON Time, tON
VDD = 3.3V, RL = 45Ω, CL = 10pF (see Figure 2)
+25
-
25
-
ns
Turn-OFF Time, tOFF
VDD = 3.3V, RL = 45Ω, CL = 10pF (see Figure 2)
+25
-
15
-
ns
Break-Before-Make Time Delay, tD
VDD = 3.3V, RL = 45Ω, CL = 10pF (see Figure 3)
+25
-
7
-
ns
Skew, tSKEW
(HSx Switch)
VDD = 3.3V, IN = 3.3V, EN = 3.3V, RL = 45Ω,CL = 10pF,
tR = tF = 720ps at 480Mbps, (Duty Cycle = 50%)
(see Figure 8)
+25
-
50
-
ps
Total Jitter, tJ
(HSx Switch)
VDD =3.3V, IN = 3.3V, EN = 3.3V, RL = 45Ω,CL = 10pF,
tR = tF = 720ps at 480Mbps
+25
-
210
-
ps
Propagation Delay, tPD
(HSx Switch)
VDD = 3.3V, IN = 3.3V, EN = 3.3V, RL = 45Ω,CL = 10pF
see Figure 8)
+25
-
250
-
ps
Skew, tSKEW
(FSx Switch)
VDD = 3.3V, IN = 0V, EN = 3.3V, RL = 39Ω,CL = 50pF,
tR = tF = 12ns at 12Mbps, (Duty Cycle = 50%)
(see Figure 8)
+25
-
0.15
-
ns
Rise /Fall Time Mismatch, tM
(FSx Switch)
VDD = 3.3V, IN = 0V, EN = 3.3V, RL = 39Ω,CL = 50pF,
tR = tF = 12ns at 12Mbps, (Duty Cycle = 50%)
+25
-
10
-
%
Total Jitter, tJ
(FSx Switch)
VDD = 3.3V, IN = 0V, EN = 3.3V, RL = 39Ω,CL = 50pF,
tR = tF = 12ns at 12Mbps
+25
-
1.6
-
ns
Propagation Delay, tPD
(FSx Switch)
VDD = 3.3V, IN = 0V, EN = 3.3V, RL = 39Ω,CL = 50pF
see Figure 8)
+25
-
0.9
-
ns
Crosstalk
VDD = 3.3V, RL = 45Ω, f = 1MHz (see Figure 7)
+25
-
-70
-
dB
Off Isolation
VDD = 3.3V, RL = 45Ω, f = 100kHz
+25
-
-98
-
dB
FSx Switch -3dB Bandwidth
Signal = -10dBm, 1.0VDC offset, RL = 45Ω,CL = 5pF
+25
-
550
-
MHz
HSx Switch -3dB Bandwidth
Signal = -10dBm, 0.2VDC offset, RL = 45Ω,CL = 5pF
+25
-
880
-
MHz
HSx OFF Capacitance, CHSxOFF
f = 1MHz, VDD = 3.3V, IN = 0V, EN = 3.3V, VHSD1 or
VHSD2 = VCOMx = 0V (see Figure 6)
+25
-
6
-
pF
FSx OFF Capacitance, CFSxOFF
f = 1MHz, VDD = 3.3V, IN = 3.3V, EN = 3.3V, VFSD1 or
VFSD2 = VCOMx = 0V (see Figure 6)
+25
-
9
-
pF
COM ON Capacitance, CCOMX(ON)
f = 1MHz, VDD = 3.3V, IN = 3.3V, EN = 3.3V, VHSD1 or
VHSD2 = VCOMx = 0V (see Figure 6)
+25
-
12
-
pF
COM ON Capacitance, CCOMX(ON)
f = 1MHz, VDD = 3.3V, IN = 0V, EN = 3.3V, VFSD1 or
VFSD2 = VCOMx = 0V (see Figure 6)
+25
-
15
-
pF
Full
2.7
-
5.5
V
+25
-
20
60
nA
Full
-
114
250
nA
DYNAMIC CHARACTERISTICS
POWER SUPPLY CHARACTERISTICS
Power Supply Range, VDD
Positive Supply Current, IDD
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VDD = 3.6V, IN = 0V or 3.6V, EN = 0V or 3.6V
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ISL76120
Electrical Specifications Test Conditions: VDD = +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VENH = 1.4V, VENL = 0.5V, (Note 8).
Boldface limits apply across the operating temperature range, -40°C to +105°C. (Continued)
PARAMETER
MAX
TEMP
MIN
(°C) (Notes 9, 10) TYP (Notes 9, 10) UNITS
TEST CONDITIONS
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, VINL, VENL
VDD = 2.7V to 3.6V
+25
-
-
0.5
V
Input Voltage High, VINH, VENH
VDD = 2.7V to 3.6V
+25
1.4
-
-
V
Input Current, IINL, IENL
VDD = 3.6V, IN = 0V, EN = 0V
Full
-
10
-
nA
Input Current, IINH
VDD = 3.6V, IN = 3.6V
Full
-
10
-
nA
Input Current, IENH
VDD = 3.6V, EN = 3.6V
Full
-
1
-
µA
NOTES:
8. VLOGIC = Input voltage to perform proper function.
9. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this datasheet.
10. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
11. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal voltage range.
12. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value,
between HSD2 and HSD1 or between FSD2 and FSD1.
Test Circuits and Waveforms
VINH
LOGIC
INPUT
50%
VINL
VINPUT
tOFF
SWITCH
V
INPUT INPUT
SWITCH
INPUT
EN
VOUT
HSx or FSx
COMx
IN
VOUT
90%
SWITCH
OUTPUT
VDD
tr < 20ns
tf < 20ns
90%
VIN
GND
0V
RL
45Ω
CL
10pF
tON
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
----------------------V OUT = V
(INPUT) R + r
L
ON
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2B. TEST CIRCUIT
FIGURE 2. SWITCHING TIMES
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ISL76120
Test Circuits and Waveforms (Continued)
VDD
LOGIC
INPUT
VINH
C
EN
FSD1 or FSD2
VINPUT
VINL
HSD1 or HSD2
VOUT
COMx
SWITCH
OUTPUT
VOUT
CL
10pF
RL
45Ω
IN
90%
GND
VIN
0V
tD
Repeat test for all switches. CL includes fixture and stray
capacitance.
FIGURE 3B. TEST CIRCUIT
FIGURE 3A. MEASUREMENT POINTS
FIGURE 3. BREAK-BEFORE-MAKE TIME
VDD
VDD
C
C
rON = V1/ICOMx
rON = V1/40mA
HSx
FSx
VHSX
VFSX
IN
V1
ICOMx
EN
1.4V
Repeat test for all switches.
FIGURE 4. HSx SWITCH rON TEST CIRCUIT
6
IN
V1
40mA
COMx
GND
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1.4V
COMx
GND
Repeat test for all switches.
0.5V
EN
1.4V
FIGURE 5. FSx SWITCH rON TEST CIRCUIT
FN6711.3
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ISL76120
Test Circuits and Waveforms (Continued)
VDD
VDD
C
C
EN
EN
SIGNAL
GENERATOR
HSx OR FSx
HSx
IN
IMPEDANCE
ANALYZER
IN
VINL OR
VINH
COMx
45Ω
COMx
GND
VIN
FSx
COMx
ANALYZER
NC
GND
RL
Signal direction through switch is reversed, worst case values
are recorded. Repeat test for all switches.
Repeat test for all switches.
FIGURE 7. CROSSTALK TEST CIRCUIT
FIGURE 6. CAPACITANCE TEST CIRCUIT
tri
90%
DIN+
10%
50%
VDD
tskew_i
DIN-
90%
50%
10%
EN
VIN
tfi
tro
OUT-
10%
DIN+
50%
COMD2
DIN-
50%
15.8Ω
CL
COMD1
CL
10%
|tro-tri| Change Due to Switch for Rising Input and Rising Output
Signals.
|tfo-tfi| Change Due to Switch for Falling Input and Falling Output
Signals.
|tskew_0| Skew through the Switch for Output Signals.
|tskew_i| Skew through the Switch for Input Signals.
45Ω
OUT-
D1
143Ω
tf0
OUT+
D2
143Ω
tskew_o
90%
VIN
15.8Ω
90%
OUT+
C
45Ω
GND
FIGURE 8B. TEST CIRCUIT
FIGURE 8A. MEASUREMENT POINTS
FIGURE 8. SKEW TEST
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ISL76120
Application Block Diagram
3.3V
µCONTROLLER
VDD
IN
USB CONNECTOR
VBUS
ISL76120
LOGIC CIRCUITRY
EN
4MΩ
HSD1
D-
HSD2
COMD1
D+
TRANSCEIVER
FSD1
USB
FULL-SPEED
FSD2
TRANSCEIVER
COMD2
GND
USB
HIGH-SPEED
GND
PORTABLE MEDIA DEVICE
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ISL76120
Detailed Description
The ISL76120 device is a dual single pole/double throw (SPDT)
analog switch that operates from a single DC power supply in the
range of 2.7V to 5.5V. It was designed to function as a dual 2-to-1
multiplexer to select between a USB high-speed transceiver and
a USB full-speed transceiver in automotive applications. It is
offered in a TDFN package for use in automotive Portable Media
Player docking stations and Apple iPod type players. The device
has an enable pin to open all switches.
The part consists of two full speed (FSx) switches and two
high-speed (HSx) switches. The FSx switches can swing from 0V
to VDD. They were designed to pass USB full-speed (12Mbps)
differential data signals with minimal distortion. The HSx
switches have high bandwidth and low capacitance to pass USB
high-speed (480Mbps) differential data signals with minimal
edge and phase distortion.
The ISL76120 was designed for automotive USB applications
such as docking stations for Portable Media Players and other
general purpose USB connections that have both high-speed and
full-speed transceivers and need to multiplex between these USB
sources to a single USB host (computer). This functionality is
shown in the “Application Block Diagram” on page 8.
A detailed description of the two types of switches are provided
in the following sections.
The HSx switches can also pass USB full-speed signals (12Mbps)
with minimal distortion and meet all the USB requirements for
USB 2.0 full-speed signaling (see Figure 12).
The maximum signal range for the HSx switches is from -1V to
VDD. The signal voltage should not be allow to exceed the VDD
voltage rail or go below ground by more than -1V.
The HSx switches are active (turned ON) whenever the IN voltage
is ≥1.4V and the EN logic voltage is ≥1.4V when operated with a
2.7V to 3.6V supply.
ISL76120 Operation
The discussion that follows will discuss using the ISL76120 in the
“Application Block Diagram” on page 8.
POWER
The power supply connected at the VDD (pin 1) provides the DC
bias voltage required by the ISL76120 part for proper operation.
The ISL76120 can be operated with a VDD voltage in the range of
2.7V to 5.5V. When used in a USB application, the VDD voltage
should be kept in the range of 3.0V to 5.5V to ensure you get the
proper signal levels for good signal quality.
A 0.01µF or 0.1µF decoupling capacitor should be connected
from the VDD pin to ground to filter out any power supply noise
from entering the part. The capacitor should be located as close
to the VDD pin as possible.
FSx Switches (FSD1, FSD2)
LOGIC CONTROL
The two FSx switches (FSD1, FSD2) are bidirectional switches
that can pass rail-to-rail signals. They were specifically designed
to pass USB full-speed (12Mbps) differential signals and meet
the USB 2.0 full-speed signal quality specifications see Figure 9.
The state of the ISL76120 device is determined by the voltage at
the IN pin (pin 2) and the EN pin (pin 10). IN is only active when
the EN pin is logic “1” (High). Refer to the “Truth Table” on page 2.
The FSx switches can also pass USB high speed signals
(480Mbps) but do not quite meet the USB 2.0 high speed signal
quality eye diagram compliance requirement.
The maximum signal range for the FSx switches is from -1V to
VDD. The signal voltage should not be allowed to exceed the VDD
voltage rail or go below ground by more than -1V.
When operated with a 2.7V to 3.6V supply, the FSx switches are
active (turned ON) whenever the IN logic control voltage is ≤0.5V
and the EN logic voltage ≥1.4V.
The EN pin is internally pulled low through a 4MΩresistor to
ground. For logic “0” (Low) it can be driven low or allowed to
Float. The IN pin must be driven low or high and cannot be left
floating.
Logic Control Voltage Levels
EN = Logic “0” (Low) when VEN ≤0.5V or Floating.
EN = Logic “1” (High) when VEN ≥1.4V
IN = Logic “0” (Low) when VIN ≤0.5V.
IN = Logic “1” (High) when VIN ≥1.4V
HSx Switches (HSD1, HSD2)
The two HSx switches (HSD2, HSD1) are bidirectional switches
that can pass rail-to-rail signals. The ON-resistance is low and
well matched between the HSD1 and HSD2 switches over the
USB high-speed signal range, ensuring minimal impact by the
switches to USB high-speed signal transitions. As the signal level
increases, the rON switch resistance increases.
The HSx switches were specifically designed to pass USB 2.0
high-speed (480Mbps) differential signals typically in the range
of 0V to 400mV. They have low capacitance and high bandwidth
to pass the USB high-speed signals with minimum edge and
phase distortion to meet USB 2.0 high-speed signal quality
specifications (see Figures 10 and 11).
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ISL76120
Full-speed Mode
If the IN pin = Logic “0” and the EN pin = Logic “1”, the part will
be in the full-speed mode. In this mode, the FSD1 and FSD2
switches are ON and the HSD1 and HSD2 switches are OFF (high
impedance). In a typical application, VDD will be in the range of
2.8V to 3.6V and will be connected to the battery or LDO of the
portable media device. When a computer or USB hub is plugged
into the common USB connector and the part is in the full-speed
mode, a link will be established between the full-speed driver
section of the media player and the computer. The device will be
able to transmit and receive data from the computer at a data
rate of 12Mbps.
High-speed Mode
If the IN pin = Logic “1” and the EN pin = Logic “1”, the part will
go into high-speed mode. In high-speed mode, the HSD1 and
HSD2 switches are ON and the FSD1 and FSD2 switches are OFF
(high impedance). When a USB cable from a computer or USB
hub is connected at the common USB connector and the part is
in the high-speed mode, a link will be established between the
high-speed driver section of the media player and the computer.
The device will be able to transmit and receive data from the
computer at a data rate of 480Mbps.
All Switches OFF Mode
If the IN pin = Logic “0” or Logic “1” and the EN pin = Logic “0”, all
of the switches will turn OFF (high impedance).
The all OFF state can be used to switch between the two USB
sections of the media player. When disconnecting from one USB
device to the other USB device, you can momentarily put the
ISL76120 switch in the “all off” state in order to get the computer
to disconnect from the one device so it can properly connect to
the other USB device when that channel is turned ON.
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ISL76120
Typical Performance Curves TA = +25°C, Unless Otherwise Specified.
VDD = 3.3V
FIGURE 9. EYE PATTERN: 12MBPS USB SIGNAL WITH FSx SWITCHES IN THE SIGNAL PATH
VDD = 3.3V
FIGURE 10. EYE PATTERN WITH FAR END MASK: 480MBPS USB SIGNAL WITH HSx SWITCHES IN THE SIGNAL PATH
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ISL76120
Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)
VDD = 3.3V
FIGURE 11. EYE PATTERN WITH NEAR END MASK: 480MBPS USB SIGNAL WITH HSx SWITCHES IN THE SIGNAL PATH
VDD = 3.3V
FIGURE 12. EYE PATTERN: 12MBPS USB SIGNAL WITH HSx SWITCHES IN THE SIGNAL PATH
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ISL76120
Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)
5.5
-10
RL = 45Ω
-20 VIN = 0.2VP-P TO 2VP-P
+105°C
5.0
-30
NORMALIZED GAIN (dB)
+85°C
rON ()
4.5
+25°C
4.0
3.5
-40°C
-40
-50
-60
-70
-80
-90
3.0
-110
2.5
0
0.1
0.2
VCOM (V)
0.3
0.4
0.001M
FIGURE 13. HSx SWITCH ON-RESISTANCE vs SWITCH VOLTAGE
0.01M
0.1M
1M
FREQUENCY (Hz)
10M
100M 500M
FIGURE 14. OFF-ISOLATION
-10
RL = 45Ω
-20 VIN = 0.2VP-P TO 2VP-P
NORMALIZED GAIN (dB)
-30
-40
-50
-60
-70
-80
-90
-110
0.001M
0.01M
0.1M
1M
10M
100M
500M
FREQUENCY (Hz)
FIGURE 15. CROSSTALK
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND (TDFN Paddle Connection: Tie to GND or Float)
TRANSISTOR COUNT:
98
PROCESS:
Submicron CMOS
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ISL76120
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
CHANGE
January 9, 2015
FN6711.3
Converted to new template and implemented Intersil Standards.
Added Revision History.
In “Thermal Information” on page 3 changed theta JA from 55°C/W to 50°C/W.
Added theta JC of 9°C/W.
Revised Note 6 with new statement: Theta-JA is measured in free air with the component mounted on a high
effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379.
Added Note 7: For theta-JC, the "case temperature" location is the center of the exposed metal pad on the
package underside.
Updated POD L10.3x3A with following changes:
Added Typical Recommended Land Pattern
Converted to new format by moving dimensions from table onto drawing (no dimension changes).
About Intersil
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address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
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Reliability reports are also available from our website at www.intersil.com/support
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Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
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FN6711.3
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ISL76120
Package Outline Drawing
L10.3x3A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 3/10
3.00
A
2.0 REF
6
PIN 1
INDEX AREA
B
8X 0.50 BSC
5
1
6
PIN 1
INDEX AREA
10X 0 . 30
3.00
1.50
0.15
(4X)
10
0.10 M C A B
0.05 M C
5
4 10 X 0.25
TOP VIEW
2.30
( 2.30 )
BOTTOM VIEW
0 .80 MAX
SEE DETAIL "X"
0.10 C
C
(2.90)
SEATING PLANE
0.08 C
(1.50)
SIDE VIEW
(10 X 0.50)
0 . 2 REF
5
C
( 8X 0 .50 )
( 10X 0.25 )
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
Angular ±2.50°
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
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Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm).
FN6711.3
January 9, 2015