CPC1916

CPC1916
Single-Pole, Normally Open
OptoMOS® Power SIP Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
100
2.5
0.34
Units
VP
Arms / ADC

Features
•
•
•
•
•
•
Handle Load Currents Up to 2.5ADC/Arms
2500Vrms Input/Output Isolation
Power SIP Package
High Reliability
No Moving Parts
Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability,
and compact size to a new family of high-power,
solid state relays. As part of that family, the CPC1916
is a single-pole, normally open (1-Form-A) solid state
relay.
The CPC1916 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled
by a highly efficient GaAIAs infrared LED. The
combination of low on-resistance and high loadcurrent handling capabilities makes the relay
suitable for a variety of high-performance switching
applications.
Approvals
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
• UL 508 Certified Component: File E69938
Ordering Information
Part #
CPC1916Y
Description
4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
1
-
2
+
3
4
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
Pb
DS-CPC1916-R06
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INTEGRATED CIRCUITS DIVISION
CPC1916
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
100
5
50
1
150
2500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
Vrms
°C
°C
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
Peak Load Current
On-Resistance 1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input/Output
1
Conditions
Symbol
Min
Typ
Max
Units
Free air
t < 10ms
IL=1A
VL=100VP
IL
ILPK
RON
ILEAK
-
-
2.5
±6
0.34
1
Arms / ADC
AP

µA
IF=10mA, VL=10V
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-
-
5
3
ms
IL=1A
IF=5mA
VR=5V
IF
IF
VF
IR
0.3
0.9
-
3.3
1.2
-
10
1.4
10
mA
mA
V
µA
-
-
-
2
-
pF
Measurement taken within 1 second of on-time.
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
2
Conditions
Symbol
Min
Typ
Max
Units
-
RJC
-
1.5
-
°C/W
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INTEGRATED CIRCUITS DIVISION
CPC1916
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=10mA, TA=25ºC)
Typical Turn-On Time
(N=50, IF=10mA, IL=5mADC, TA=25ºC)
45
Typical Turn-Off Time
(N=50, IF=10mA, IL=5mADC, TA=25ºC)
25
25
20
20
30
25
20
15
10
Device Count (N)
35
Device Count (N)
Device Count (N)
40
15
10
5
15
10
5
5
0
1.250
1.254
1.258
1.262
0
1.266
3.0
3.5
4.0
LED Forward Voltage (V)
4.5
35
30
30
Device Count (N)
Device Count (N)
35
25
20
15
10
0.216 0.220 0.224 0.228
On-Resistance (:)
15
10
1.6
1.4
IF=50mA
1.2
IF=20mA
IF=10mA
1.0
0.8
20
40
60
80
Temperature (ºC)
100
6.0
5.4
4.8
4.2
3.6
3.0
2.4
1.8
1.2
0.6
0
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Blocking Voltage (VP)
0.10
0.09
10
15
20
25
30
35
40
45
40
60
Temperature (ºC)
80
100
0.05
50
0
LED Forward Current (mA)
10 15 20 25 30 35 40
LED Forward Current (mA)
Typical Turn-On vs. Temperature
(IL=100mADC)
Typical Turn-Off vs. Temperature
(IL=100mADC)
3.5
Turn-On (ms)
20
0.06
0.02
5
5
45
50
0.14
IF=10mA
0.12
2.5
2.0
IF=20mA
1.5
1.0
0.10
IF=20mA
0.08
0.06
IF=10mA
0.04
0.02
0
0
0.07
0.03
0.5
-20
0.08
0.04
3.0
-40
Typical Turn-Off
vs. LED Forward Current
(IL=100mADC)
0.11
0
120
119.1 119.6 120.0 120.6 121.1 121.6 122.1
0.232
Turn-Off (ms)
1.8
Turn-On (ms)
LED Forward Voltage Drop (V)
20
Typical Turn-On
vs. LED Forward Current
(IL=100mADC)
Typical LED Forward Voltage Drop
vs. Temperature
LED Current (mA)
25
0
0.212
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Turn-Off (ms)
5
0
0
0.070 0.073 0.076 0.079 0.082 0.085 0.088
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
5
-20
5.5
Turn-On (ms)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1.0ADC, TA=25ºC)
-40
5.0
Turn-Off (ms)
0
0.00
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R06
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INTEGRATED CIRCUITS DIVISION
CPC1916
PERFORMANCE DATA*
Typical On-Resistance vs. Temperature
(IF=10mA, IL=1.0ADC)
Typical Load Current vs. Load Voltage
(IF=10mA, TA=25ºC)
0.24
0.20
0.16
0.12
0.08
0.04
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-0.6
131
0.07
129
0.06
127
0.05
Leakage (PA)
Blocking Voltage (VP)
Typical Blocking Voltage
vs. Temperature
125
123
121
119
3.5
Load Current (ADC/Arms)
0.28
Load Current (A)
On-Resistance (:)
0.32
-0.4
-0.2
0
0.2
0.4
115
-40
-20
0
20
40
60
Temperature (ºC)
80
100
2.5
2.0
IF=20mA
1.5
IF=10mA
1.0
0.5
0
0.6
-40
-20
0
20
40
60
80
100
Load Voltage (V)
Temperature (ºC)
Typical Leakage vs. Temperature at
Measured across Pins 3 & 4
(VL=100V)
Energy Rating Curve
(Free Air, No Heat Sink)
0.04
0.03
0.02
0
-40
120
7
0.01
117
3.0
Load Currrent (A)
0.36
Maximum Load Current
vs. Temperature
-20
0
20
40
60
Temperature (ºC)
80
100
6
5
4
3
2
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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INTEGRATED CIRCUITS DIVISION
CPC1916
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1916Y
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1916Y
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1916
MECHANICAL DIMENSIONS
CPC1916Y
21.082±0.381
(0.830±0.015)
PCB Hole Pattern
3.302±0.051
(0.130±0.002)
10.160±0.127
(0.400±0.005)
1.75
(0.069)
7º TYP
4 Places
Pin 1
1.778
(0.070)
0.762±0.076
(0.030±0.003)
2.540±0.127
(0.100±0.005)
4.572±0.127
(0.180±0.005)
10.160±0.127
(0.400±0.005)
5.080±0.127
(0.200±0.005)
1.651±0.102
(0.065±0.004)
5.080
(0.200)
10.160
(0.400)
1.016±0.127
(0.040±0.005)
Pin 1
1.150 DIA. x4
(0.045 DIA. x4)
2.540
(0.100)
0.381±0.013
(0.015±0.0005)
1.778
(0.070)
7º TYP
4 Places
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC1916-R06
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012