CPC1906

CPC1906
Single-Pole, Normally Open
Power SIP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
60
2
0.3
Units
VP
Arms / ADC

Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability,
and compact size to a new family of high-power solid
state relays. As part of that family, the CPC1906 is a
single-pole, normally open (1-Form-A) solid state relay.
The CPC1906 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED. The combination
of low on-resistance and high load current handling
capabilities makes the relay suitable for a variety of
high-performance switching applications.
Features
•
•
•
•
•
•
Handle Load Currents Up to 2Arms
2500Vrms Input/Output Isolation
Power SIP Package
High Reliability
No Moving Parts
Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Approvals
• UL 508 Certified Component: File E69938
Applications
Ordering Information
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
Part #
CPC1906Y
Description
4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
1
-
2
+
3
4
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-CPC1906-R07
toff
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1
INTEGRATED CIRCUITS DIVISION
CPC1906
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
60
5
50
1
150
2500
-40 to +85
-40 to +125
Units
V
V
mA
A
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
Peak Load Current
On-Resistance1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input/Output
1
Conditions
Symbol
Min
Typ
Max
Units
free air
t < 10ms
IL=1A
VL=60VP
IL
ILPK
RON
ILEAK
-
0.105
-
2
±6
0.3
1
ADC/Arms
AP

µA
VL=50V, f=1MHz
ton
toff
COUT
-
3.5
0.04
130
10
5
-
IL=1A
IF=5mA
VR=5V
IF
IF
VF
IR
0.6
0.9
-
3
1.2
-
10
1.4
10
mA
mA
V
µA
f=1MHz
II/O
-
2
-
pF
Conditions
Symbol
Min
Typ
Max
Units
-
RJC
-
1.5
-
°C/W
IF=10mA, VL=10V
ms
pF
Measurement taken within 1 second of on-time.
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
2
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R07
INTEGRATED CIRCUITS DIVISION
CPC1906
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=10mA, TA=25ºC)
Device Count (N)
Device Count (N)
30
25
20
15
10
5
0
25
25
20
20
Device Count (N)
35
15
10
5
1.19
1.21
1.23
LED Forward Voltage (V)
1.25
2.5
3.0
3.5
4.0
Turn-On (ms)
35
35
30
30
Device Count (N)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
25
20
15
10
0.103
4.5
0.104
0.105
0.106 0.107
1.4
IF=50mA
IF=20mA
IF=10mA
1.2
1.0
0.8
60
80
100
0.050
15
10
66
0.108
67
68
69
70
Blocking Voltage (VP)
71
Typical Turn-Off
vs. LED Forward Current
(IL=100mADC)
0.09
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
120
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
Temperature (ºC)
LED Forward Current (mA)
LED Forward Current (mA)
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Typical Turn-On vs. Temperature
(IF=10mA, IL=100 mADC)
Typical Turn-Off vs. Temperature
(IF=10mA, IL=100 mADC)
2.1
0.70
1.8
0.60
1.5
0.50
Turn-Off (ms)
Turn-On (ms)
LED Current (mA)
0.046
20
1.2
0.9
0.6
0
20
40
60
Temperature (ºC)
80
100
0.40
0.30
0.20
0
0
-20
50
0.10
0.3
-40
0.042
25
Turn-Off (ms)
1.6
Turn-On (ms)
LED Forward Voltage Drop (V)
1.8
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0.037
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
Typical Turn-On
vs. LED Forward Current
(IL=100mADC)
Typical LED Forward Voltage Drop
vs. Temperature
40
0.033 0.033
5.0
Turn-Off (ms)
On-Resistance (:)
20
5
0
0
0
10
5
5
-20
15
0
0
1.17
-40
Typical Turn-Off Time
(N=50, IF=10mA, IL=5mADC, TA=25ºC)
Typical Turn-On Time
(N=50, IF=10mA, IL=5mADC, TA=25ºC)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R07
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3
INTEGRATED CIRCUITS DIVISION
CPC1906
PERFORMANCE DATA*
3
0.18
2
0.15
0.12
0.09
0.06
1
0
-1
-2
0.03
-20
0
20
40
60
80
100
Temperature (ºC)
-0.1
0.0
0.1
Load Voltage (V)
Blocking Voltage vs. Temperature
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
(VL=60V)
72
0.035
71
0.030
70
0.025
69
68
67
66
0.2
64
-40
-20
0
20
40
60
Temperature (ºC)
80
100
2.0
1.5
1.0
0.5
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Energy Rating Curve
(Free Air, No Heat Sink)
7
6
0.020
0.015
0.010
0
-40
2.5
0.3
5
4
3
2
0.005
65
3.0
0.0
-0.2
Load Current (A)
-40
-3
-0.3
Leakage (PA)
Blocking Voltage (VP)
3.5
Load Current (ADC/Arms)
0.21
0
Maximum Load Current vs. Temperature
(IF=10mA)
Typical Load Current vs. Load Voltage
(IF=10mA, TA=25ºC)
Load Current (A)
On-Resistance (:)
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=100 mADC)
-20
0
20
40
60
Temperature (ºC)
80
100
1
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R07
INTEGRATED CIRCUITS DIVISION
CPC1906
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1906Y
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1906Y
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R07
e3
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5
INTEGRATED CIRCUITS DIVISION
CPC1906
MECHANICAL DIMENSIONS
CPC1906Y
21.082±0.381
(0.830±0.015)
PCB Hole Pattern
3.302±0.051
(0.130±0.002)
10.160±0.127
(0.400±0.005)
1.75
(0.069)
7º TYP
4 Places
Pin 1
1.778
(0.070)
0.762±0.076
(0.030±0.003)
2.540±0.127
(0.100±0.005)
4.572±0.127
(0.180±0.005)
10.160±0.127
(0.400±0.005)
5.080±0.127
(0.200±0.005)
1.651±0.102
(0.065±0.004)
5.080
(0.200)
10.160
(0.400)
1.016±0.127
(0.040±0.005)
Pin 1
1.150 DIA. x4
(0.045 DIA. x4)
2.540
(0.100)
0.381±0.013
(0.015±0.0005)
1.778
(0.070)
7º TYP
4 Places
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1906-R07
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012