HD74LS247 BCD-to-Seven-Segment Decoder / Driver (with three-state outputs) REJ03D0465–0300 Rev.3.00 Jul.15.2005 The HD74LS247 is electrically and functionally identical to the HD74LS47, respectively, and has the same pin assignments as its equivalents. It can be used interchangeably in present or future designs to offer designers a choice between two indicator fonts. The HD74LS47 composes the 6 and the 9 without tails and the HD74LS247 composes the 6 and the 9 with tails. Composition of all other characters, including display patterns for BCD inputs above nine, is identical. The HD74LS247 features active-low outputs designed for driving indicators directly. All of the circuits have full rippleblanking input / output controls and a lamp test input. Segment identification and resultant displays are shown below. Display patterns for BCD input conditions. This circuit incorporates automatic leading and / or trailing-edge zero-blanking control (RBI and RBO). Lamp test (LT) of this type may be performed at any time when the BI / RBO node is at a high level. This type contains an overriding blanking input (BI) which can be used to control the lamp intensity be pulsing or to inhibit the outputs. Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS247P DILP-16 pin PRDP0016AE-B (DP-16FV) P — HD74LS247FPEL SOP-16 pin (JEITA) PRSP0016DH-B (FP-16DAV) FP EL (2,000 pcs/reel) HD74LS247RPEL SOP-16 pin (JEDEC) PRSP0016DG-A (FP-16DNV) RP EL (2,500 pcs/reel) Note: Please consult the sales office for the above package availability. Rev.3.00, Jul.15.2005, page 1 of 7 HD74LS247 Pin Arrangement B 1 C 2 LT BI/RBO 16 VCC 15 f Inputs B f 3 C g 14 g 4 LT a 13 a BI/BRO b RBI c 12 b D d 11 c A e 10 d 9 e RBI 5 D 6 A 7 GND 8 Inputs Outputs (Top view) Function Table Decimal or Function Inputs LT RBI D C B A BI/ RBO Outputs a b c d e f g Note 0 H H L L L L H ON ON ON ON ON ON OFF 1 H X L L L H H OFF ON ON OFF OFF OFF OFF 2 H X L L H L H ON ON OFF ON ON OFF ON 3 H X L L H H H ON ON ON ON OFF OFF ON 4 H X L H L L H OFF ON ON OFF OFF ON ON 5 H X L H L H H ON OFF ON ON OFF ON ON 6 H X L H H L H ON OFF ON ON ON ON ON 7 H X L H H H H ON ON ON OFF OFF OFF OFF 1 8 H X H L L L H ON ON ON ON ON ON ON 9 H X H L L H H ON ON ON ON OFF ON ON 10 H X H L H L H OFF OFF OFF ON ON OFF ON 11 H X H L H H H OFF OFF ON ON OFF OFF ON 12 H X H H L L H OFF ON OFF OFF OFF ON ON 13 H X H H L H H ON OFF OFF ON OFF ON ON 14 H X H H H L H OFF OFF OFF ON ON ON ON 15 H X H H H H H OFF OFF OFF OFF OFF OFF OFF BI X X X X X X L OFF OFF OFF OFF OFF OFF OFF 2 RBI H L L L L L L OFF OFF OFF OFF OFF OFF OFF 3 LT L X X X X X H ON ON ON ON ON ON ON 4 H; high level, L; low level, X; irrelevant Notes: 1. The blanking input (BI) must be open or held at a high logic level when output functions 0 through 15 are desired. The ripple-blanking input (RBI) must be open or high if blanking of a decimal zero is not desired. 2. When a low logic level is applied directly to the blanking input (BI), all segment outputs are off regardless of the level of any other input. 3. When ripple-blanking input (RBI) and inputs A, B, C, and D are a low level with the lamp test input high, all segment outputs go off and the ripple-blanking output (RBO) goes to a low level (response condition). 4. When a blanking input ripple blanking input (BI/RBO) is open or held high and a low is applied to the lamptest input, all segment outputs are on. Rev.3.00, Jul.15.2005, page 2 of 7 HD74LS247 Block Diagram a A B b C c Inputs D d BI/BRO Blanking Input or Ripple Blanking Output Outputs e f Lamp Test Input RBI Ripple Blanking Input g Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage VCC 7 V Input voltage VIN 7 V Output current (tw ≤ 1ms, duty cycle ≤ 10%) IO (peak) 200 mA Output current (off-state) IO (off) 1 mA Operating temperature Topr –20 to +75 °C PT 400 mW Tstg –65 to +150 °C Power dissipation Storage temperature Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Rev.3.00, Jul.15.2005, page 3 of 7 HD74LS247 Recommended Operating Conditions Item Symbol Min Typ Max Supply voltage VCC 4.75 5.00 5.25 V Operating temperature Topr –20 25 75 °C Output voltage Output current Unit a to g VO (off) — — 15 V a to g IO (on) — — 24 mA BI / RBO IOH — — -50 µA BI / RBO IOL — — 3.2 mA a f g e b c 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 d Electrical Characteristics (Ta = –20 to +75 °C) Item Symbol min. typ.* max. Unit VIH VIL 2.0 — — — — 0.8 V V BI/RBO VOH 2.4 — — V BI/RBO VOL — — — — 0.4 0.5 V — — 250 µA — — — — — — 0.4 0.5 20 — — –0.4 — — — — –1.2 0.1 Input voltage Output voltage Output current a to g IO (off) Output voltage a to g VO (on) IIH Input current Except BI/RBO BI/RBI IIL II V Condition VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = –50 µA IOL = 1.6 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 3.2 mA VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V, VO (off) = 15 V IO (on) = 12 mA VCC = 5.25 V, VIH = 2 V, IO (on) = 24 mA VIL = 0.8 V µA VCC = 5.25 V, VI = 2.7 V mA VCC = 5.25 V, VI = 0.4 V mA VCC = 5.25 V, VI = 7 V Short-circuit BI/RBO IOS –0.3 — –2 mA output current Supply current** ICC — 7 13 mA Input clamp voltage VIK — — –1.5 V Notes: * VCC = 5 V, Ta = 25°C ** ICC is measured with all outputs open and all inputs at 4.5 V. VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Symbol Turn-on time ton Turn-off time toff Rev.3.00, Jul.15.2005, page 4 of 7 Input A RBI A RBI min. — — — — typ. — — — — max. 100 100 100 100 Unit Condition ns CL = 15 pF, RL = 665 Ω ns HD74LS247 Testing Method Test Circuit VCC 4.5V RL See Testing Table a Input P.G. Zout = 50Ω Note: A B C D b Output c d CL e LT RBI f BI/RBO g CL includes probe and jig capacitance. Testing Table Item ton toff RBI 4.5V 4.5V 4.5V IN D GND GND GND GND Inputs C GND GND 4.5V GND B GND 4.5V 4.5V GND A IN IN IN GND a OUT — — OUT b — — OUT OUT c — OUT — OUT Outputs d OUT — OUT OUT e OUT OUT OUT OUT f OUT — OUT OUT Waveform tTHL tTLH 90% 1.3 V Input 3V 90% 1.3 V 10% 10% 0V ton toff VOH In phase output 1.3 V 1.3 V VOL ton toff VOH Out of phase output 1.3 V 1.3 V VOL Note: Input pulse; tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle = 50% Rev.3.00, Jul.15.2005, page 5 of 7 g — — OUT — HD74LS247 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B MASS[Typ.] 1.05g Previous Code DP-16FV D 9 E 16 1 8 b3 0.89 Z A1 A Reference Symbol L e Nom θ c e1 D 19.2 E 6.3 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV 7.4 A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.12 L 2.54 MASS[Typ.] 0.24g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D F 16 20.32 5.06 Z ( Ni/Pd/Au plating ) Max 7.62 1 A bp e Dimension in Millimeters Min 9 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 bp Nom D 10.06 E 5.50 Max 10.5 A2 8 e Dimension in Millimeters Min x A1 M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 0.80 Z L L Rev.3.00, Jul.15.2005, page 6 of 7 8° 0.50 1 0.70 1.15 0.90 HD74LS247 JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV MASS[Typ.] 0.15g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 16 9 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 9.90 10.30 E 3.95 A2 8 1 Z e *3 bp x A1 0.10 0.14 0.25 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 1.75 A M L1 bp b1 c A c A1 θ L y Detail F 1 θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z 0.40 L L Rev.3.00, Jul.15.2005, page 7 of 7 8° 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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