Catalog - Hamamatsu Photonics

X-ray TDI camera
C10650 series
High speed readout
Large field of view
High resolution
High sensitivity
High quality image output with high resolution
achieved by TDI technology
Max.
Horizontal spatial
resolution
Max.
10.7
586
m/min.
mm
6144×2
High speed readout
Detection area
pixels
X-ray TDI camera C10650 series is useful for in-line
applications requiring high-speed operation with high
sensitivity. TDI imaging is appropriate for applications where
it is desired to record a linear movement, or where the aspect
ratio of the subject being imaged is significantly asymmetric.
Low brightness under high resolution usage, a problem with
conventional line sensor cameras, is improved with this X-ray
TDI camera, making it suitable for applications which require
high resolution. Vertical X-ray TDI cameras that can be
installed in narrow spaces are new additions to the series.
Printed circuit board (PCB) inspection
Surface-mounted component inspection
Lithium-ion battery inspection
High-resolution in-line non-destructive inspection
TDI technology
Time Delay Integration is a scanning technology in
which a frame transfer device produces a continuous
video image of a moving object by means of a stack
of linear arrays aligned with and synchronized to the
motion of the object to be imaged in such a way that,
as the image moves from one line to the next, the
integrated charge moves along with it, providing
higher resolution at lower light levels than is possible
with a line-scan camera.
Shield box
X-ray source
Object Motion
Object
X-ray TDI camera
Conveyor belt
TDI sensor
Signal intensity
Features
High S/N ratio with 12 bit / 16 bit output
Camera Link interface (Base configuration)
Single power supply (+15 V) operation
Real time dark current / shading correction function
Frame readout mode for easy installation alignment
High-resolution, High-speed Camera with a Large Field of View for In-line
100 % X-ray Inspection
High speed readout
Large field of view
High resolution
High sensitivity
TDI technology offers all four simultaneously.
High resolution
image acquisition
X-ray Source
Large field of view
Object
Detect dark sample with high sensitivity
X-ray
TDI Camera
High speed readout
PRODUCT LINEUP
Standard type
Type number
Sensor number
X-ray sensitive area
C10650-221
2
145 mm
C10650-321
3
221 mm
C10650-261
2
146 mm
C10650-361
3
220 mm
C10650-461
4
293 mm
C10650-261V
2
146 mm
C10650-361V
3
220 mm
C10650-461V
4
293 mm
C10650-361W
7
513 mm
C10650-461W
8
586 mm
Horizontal chassis / Overlap type
Type number
Sensor number
X-ray sensitive area
Vertical chassis / Overlap type
Type number
Sensor number
X-ray sensitive area
Vertical chassis / Overlap type (2 cameras output)
Type number
Sensor number
X-ray sensitive area
C10650-261W
6
439 mm
SPECIFICATIONS
Type number
CCD pixel number
Active CCD pixel number
CCD pixel size
X-ray sensitive area
X-ray receiving surface
Scintillator type
Recommended use range
CCD pixel clock
TDI line rate
1×1
binning 2 × 2
A/D converter
Data output
Interface (Camera Link)
Pixel clock (Camera Link)
A/D gain value *3
Power requirements
Power consumption
C10650-221
3072(H) × 128(V)
3040(H) × 128(V)
C10650-321
4608(H) × 128(V)
4608(H) × 128(V)
C10650-461V
C10650-461
6144(H) × 128(V)
6144(H) × 128(V) *1
48 μm × 48 μm
145 mm(H) × 6 mm(V) 221 mm(H) × 6 mm(V)
293 mm(H) × 6 mm(V) *1
FOS (Fiber optic plate with scintillator)
CsI
Approx. 25 kV to 90 kV *2
4.0 MHz
62 Hz to 2.109 kHz (0.178 m/min to 6.073 m/min)
62 Hz to 1.858 kHz (0.357 m/min to 10.702 m/min)
12 bit
16 bit
12 bit
16 bit
Base Configuration
16.0 MHz
0 dB to 20 dB (64 steps)
DC +15 V (±1 V)
25 VA
30 VA
C10650-461W
6144 × 2(H) ×128(V)
6144 × 2(H) × 128(V) *1
586 mm(H) × 6 mm(V)*1
30 VA + 30 VA *4
*1 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary.
*2 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.
*3 Multiple gain option (M8815-01) is optional.
*4 2 units of the power supply unit and the power cable are necessary for C10650-461W.
MEASUREMENT EXAMPLES
Inspection of a solder's back fillet
If the back fillet of the solder on a PCB has a defect, a
connection error will occur even with small vibrations. For
observation of the back fillet part, X-ray transmission
technique has been applied but only with an off-line system.
Our X-ray TDI camera realizes in-line inspection because it
can acquire high speed profile data with high sensitivity. 3D
brightness level can be displayed using software.
Soldering failure
Normal soldering
Line scan
Line scan
Lithium-ion battery inspection
In case of 2D sensor, the dimensional measurement cannot
be implemented correctly because the image is distorted
on the corner areas of the X-ray irradiation. The long length
sample needs to be located on center of X-ray source, so
the sample has to be relocated each time. X-ray TDI
camera can capture the image with no distortion by line
scan method, so it is not necessary to relocate the
samples and it enables the continuous inspection for long
length object without stopping.
Not necessary to relocate
the samples and possible
to inspect the long length
object with no distortion.
Inspection by 2D sensor
Inspection by X-ray TDI camera
Profile
X-ray image intensifier (I.I.) camera :
X-ray TDI camera:
The image is distorted on the corner areas
in thickness direction, and the dimensional
measurement cannot be implemented
correctly.
The non-distortion image can be realized
since X-ray is radiated vertically to the
object and the dimensional measurement
can be implemented correctly.
Slack of rolling
3D display
Defect point
Short of the solution
Condition of the connection on electrode
Dead space between chips
Wide detection width with no dead areas
Standard type have dead space between chips as shown below. The effect
of the dead space on an X-ray image depends on the measurement
conditions such as X-ray magnification ratio and X-ray source's focus size.
The overlapped type offers a wide detection area with no dead areas
due to its staggered sensors.
10 pixels
C10650-321
C10650-461
Center chip
Edge pixel
Dead space 1:
250 μm min.
350 μm max.
±50 μm MAX.
Left chip
Dead space 2
Center chip
Edge pixel
Dead space 2:
130 μm min.
200 μm max.
Right chip
±50 μm MAX.
Dead space 1
(Min. 4 pixels,
Max. 16 pixels)
Overlapped type measurement example
15.1±0.5
(Unit: mm)
C10650-221
DIMENSIONAL OUTLINES (Unit: mm)
C10650-221 (Approx. 5 kg)
C10650-261V, -361V, -461V (Approx. 7 kg)
360±0.5
300
32.9±0.5
15.1
10.6
65±0.2
80
16
130±1
10.7±0.3
146 (Sensor range : C10650-261V)
220 (Sensor range : C10650-361V)
293 (Sensor range : C10650-461V)
6±0.2
5±0.2
73.764±0.5
360±0.5
300
221 (Sensor range)
175±1
C10650-321 (Approx. 5 kg)
30
32.9
371±1
5.5
112±0.5
6(Sensor range)
64
123
134±0.5
11±0.5
2-φ8.2
39±0.5 (Sensor position)
5.5
112±0.5
50±0.5
4-φ4.5
407±1
17
6(Sensor range)
64±0.5
123
134±0.5
11±0.5
441±1
30
145 (Sensor range)
10.7
50±0.5
4-φ4.5
C10650-261, -361, -461 (Approx. 7 kg)
(15.1)
10.6
(38.264±0.5)
65±0.2
80
(Sensor position)
664±1
A8206-35 (Option) (Approx. 2 kg)
147
66
32.5
270±0.5
302.2
175±1
42.4±0.5
(Sensor position)
50±0.5
6-φ4.5
6±0.2
8.3
5±0.2
73.764±0.5
439 (Sensor range : C10650-261W)
513 (Sensor range: C10650-361W)
586 (Sensor range : C10650-461W)
22
239±0.5
250±0.5
293 (Sensor range : C10650-461)
2-φ8.2
130±1
39±0.5 (Sensor position)
50.05±0.5
10.6
220 (Sensor range : C10650-361)
734±1
700±1
1
15.1±0.3
146 (Sensor range : C10650-261)
228±0.5
C10650-261W, -361W, -461W (Approx. 16 kg)
(Sensor position)
160±0.5
11±0.5
160±0.5
5.5±0.3
370±0.5
25±0.5
16.1
2-M4 D=6
OPTIONS
Power supply unit : A8206-35
Power cable 5 m : A10847-05
Software API Support (Microsoft Windows) : DCAM-API (http://www.dcamapi.com)
Additional function module 64 gain : M8815-01
★ Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.
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Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice.
© 2015 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected]
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected]
Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected]tsu.co.uk
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected]
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6 20020 Arese (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741 E-mail: [email protected]
China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected]
Cat. No. SFAS0025E07
MAR/2015 HPK
Created in Japan