LTCC Multilayer Substrate LTCC Package Low Temperature Co-fired Ceramics Multilayer Ceramics & Cavity Packages Enable Complex Module Creation • Optimal for Bare Chip Modules • Miniaturization & Integration - Highly controlled dimensions and flatness - Low thermal expansion enhances use of ICs • High Frequency Performance - Multilayer and multi-cavity structures - Surface and buried printed resistors • Environmental Reliability - Ceramics with low dielectric constant and loss - Low ohm silver conductor Surface Resistors - High heat and moisture resistance (zero water absorption) - No outgassing - Dust-free - Impermeable Conductive Pattern Transmission Line Cavity Buried Resistors Via Hole Inductors Thermal Via Hole Interposer Bare Chip Semiconductor Package Capacitors Multi-Chip Module Multi-Cavity Special Shapes KOA Speer Electronics, Inc. 199 Bolivar Drive • Bradford, PA 16701 • USA • 814.362.5536 • Fax: 814.362.8883 • www.KOASpeer.com Pilot to Mass Production, Module Assembly Module Assembly • Total support from design to assembly • Reliability test on request BGA Resin Sealing High Flexibility • Small to large volume production • Low initial cost Material Characteristics DC-DC Converter Sensor Module Wire Bonding PARAMETER CHARACTERISTICS Bending Strength Thermal expansion coefficient 250 MPa 5.5 ppm/K Thermal conductivity Insulation resistance 3 W/m•K >1013 Ω•cm Dielectric constant 7 at 1MHz Dielectric loss Resistivity of buried conductor Density <0.003 at 1MHz Ag : 2.5 µΩ•cm 2.8 g/cm3 Surface roughness Ra <0.4 µm Withstanding voltage Layer thickness >15 kV/mm 80/100/125 µm Design Rule SYMBOL PARAMETER STANDARD SPECIAL A B Line width Line to line spacing 0.06mm Min. 0.06mm Min. 0.05mm Min. SURFACE/INNER PATTERN Via diameter Via pad diameter 0.1mm, 0.15mm 0.6mm Min. C+0.05mm Min. E Via to via spacing 0.02mm Min. Padless 0.08mm Min. F G H Via to line spacing Part edge to conductor spacing Part edge to via pad spacing 0.125mm Min. 0.2mm Min. 0.3mm Min. 0.175mm Min. 0.10mm Min. 0.15mm Min. J1, J2 Cavity width 0.20mm Min. K1, K2 L M Cavity depth 0.6mm Min. 0.1mm Min. 0.5mm Min. 0.5mm Min. J1 M J2 A F C D Cavity wall thickness Shelf width in the cavity H 0.05mm Min. 0.08mm Min. – 0.1mm Min. B G C E D L K1 K2 KOA Speer Electronics, Inc. www.KOASpeer.com 199 Bolivar Drive • Bradford, PA 16701 • USA • 814.362.5536 • Fax: 814.362.8883