® Component Material Declaration (Less than 1A) Material information for P/N CCF1NxxxxTTE xxxx = Fusing current KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: CCF1NxxxxTTE CCF1NxxxxTTE Ceramic Chip Fuse 2310 size 140 Now Available Now Available * xxx = inductance value, y = tolerance RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0.001282 0 0.0002 PPM 12.819 0 2 0 0 0 0 0 0 % Weight 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 31.938 Gold & Gold Compounds 0 Magnesium 1.1690 Nickel & Nickel Compounds 0.030 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 0.0180 PPM 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 319380 0 11690 300 0 0 180 Materials Cu Sn 0.1050 0.0080 Yellow Phosperous Ag 0.0002 0.018 Aluminum Oxide Silica Magnesium Oxide Cu Sn Pb Epichlorohydrin-bisphenol A resin Epichlorohydrin-bisphenol F resin Epoxy Resin Degeneration Dicyandiamide Diuron Red Pigment Phenolic Resin Amino Resin Carbon Black Tributyl Phosphate Bisphenol A Blue Pigment Other Sn Zi Cu Ni Pb Cadmium Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 27-Mar-06 Signed: Michael E Griffith % Weight 55.5109 1.7530 1.1690 31.7730 0.3140 0.0003 1.5520 1.0040 0.3650 0.3650 0.0910 0.0020 0.0030 0.0010 0.0010 0.0010 0.0001 0.0004 0.0010 3.4870 2.3840 0.0600 0.0300 0.0010 0.0002 260 10 3 1 Matte Sn 6 Yes (All materials in the part) PPM Where Used 1050 Fuse Element 80 Fuse Element 2 Fuse Element 180 Fuse Element 555109 Fuse Body 17530 Fuse Body 11690 Fuse Body CAS # 7440-50-8 7440-31-5 7723-14-0 7440-22-4 1344-28-1 14808-60-7 1309-48-4 317730 3140 Termiantions Termiantions 7440-50-8 2.819 15520 10040 3650 3650 910 20 30 Termiantions Adhesives Adhesives Adhesives Adhesives Adhesives Adhesives Marking 7439-92-1 25068-38-6 9003-36-5 --461-58-5 330-54-1 --- 25085-75-0 10 10 10 0.5 4 10 34870 23840 600 300 10 2 Marking Marking Marking Marking Marking Marking Junction Junction Junction Junction Junction Junction 68002-20-0 1333-86-4 126-73-8 80-05-7 147-14-8 --7440-31-5 7440-66-6 7440-50-8 7440-02-0 7439-92-1 7440-43-9 Average 7440-31-5 ® Component Material Declaration (1A and greater) Material information for P/N CCF1NxxxxTTE xxxx = Fusing current KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: CCF1NxxxxTTE CCF1NxxxxTTE Ceramic Chip Fuse 2310 size 140 Now Available Now Available * xxx = inductance value, y = tolerance RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.001282 0 0.0002 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 31.870 Gold & Gold Compounds 0 Magnesium 1.1650 Nickel & Nickel Compounds 0.030 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 0.0070 PPM 12.819 0 2 PPM 0 0 0 0 0 0 318700 0 11650 300 0 0 70 Materials Cu Ag Aluminum Oxide Silica Magnesium Oxide Cu Sn Pb Epichlorohydrin-bisphenol A resin Epichlorohydrin-bisphenol F resin Epoxy Resin Degeneration Dicyandiamide Diuron Red Pigment Phenolic Resin Amino Resin Carbon Black Tributyl Phosphate Bisphenol A Blue Pigment Other Sn Zi Cu Ni Pb Cadmium Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 27-Mar-06 Signed: Michael E Griffith % Weight 0.1240 0.0070 55.6341 1.7480 1.1650 31.6870 0.3130 0.0003 1.5480 1.0020 0.3640 0.3640 0.0910 0.0020 0.0030 0.0010 0.0010 0.0010 0.0001 0.0004 0.0010 3.4770 2.3760 0.0590 0.0300 0.0010 0.0002 260 10 3 1 Matte Sn 6 Yes (All materials in the part) PPM Where Used 1240 Fuse Element 70 Fuse Element 556341 Fuse Body 17480 Fuse Body 11650 Fuse Body 316870 Termiantions 3130 Termiantions CAS # 7440-50-8 7440-22-4 1344-28-1 14808-60-7 1309-48-4 7440-50-8 7440-31-5 2.819 15480 Termiantions Adhesives 7439-92-1 25068-38-6 10020 3640 3640 910 20 30 10 10 Adhesives Adhesives Adhesives Adhesives Adhesives Marking Marking Marking 9003-36-5 --461-58-5 330-54-1 --- 10 0.5 4 10 34770 23760 590 300 10 2 Marking Marking Marking Marking Junction Junction Junction Junction Junction Junction Average 25085-75-0 68002-20-0 1333-86-4 126-73-8 80-05-7 147-14-8 --7440-31-5 7440-66-6 7440-50-8 7440-02-0 7439-92-1 7440-43-9