1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 55 PMS 300 neg. Black neg. MCM multi-chip module NEW features • SMD (Hybrid IC) • Plural semiconductors in one package offers downsized system with high performance and standardization • Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance • Development with surface mounting type Hybrid IC to consolidate SMD parts • High precision modules by function trimming • Less mounting problem because of the decreasing number of the terminals construction SMD Bonding Wire Bare Chip Solder Ball Substrate Package Specifications Item Terminal Pitch modules Mountable Device Package Substrate for Package Content 0.8mm~ • SMD • Bare Chip • Printed Resistor (Trimable) • SON • BGA • LGA • FR-4 • FR-5 • Alumina • LTCC Mounting Specifications Item Substrate Dimension Substrate Thickness Bare Chip Pad Pitch Bare Chip Pad Dimension Bare Chip Thickness Molding Height Wire Length Wire Loop Height AI Wire Diameter Au Plating Substrate Unit Min. Std. Max. mm 50 x 20 120 x 100 320 x 140 mm 0.3 — 1.6 µm 100 — — µm mm mm mm µm 70 — 0.1 0.2 0.3 1.0 0.3 — 100 200 200 300 µm 20 25 Electrical/nonelectrical Au • FR-4 • FR-5 • Alumina • LTCC • FPC — — 1.2 Height from chip surface 3.0 — 500 for Power Module 40 Plating Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 250 Note 12/01/08 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com