® RoHS compliant Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Breakdown of all Materials CN1E4KTTDxxxJ CN1E4KTTDxxxJ 0804 array 5%, 4 res. 2.4 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.3 3000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight PPM Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Materials Silver (Ag) Ceramic (Al2O3) Epoxy Matte Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Process Data Peak Reflow (Deg. C) Time at Peak Temp. (seconds) Number of Reflows MSL Outer Plating Material Outer Plating Material Outer plating Average thickness Middle Plating Material Middle Plating Thickness Middle plating average thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 20000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination 3000 inner termination % Weight 1.358 88.7 1.6 2 0.042 2 2 2 0.3 260 10 3 1 Matte Sn 3µm 6µm Ni 3µm 6µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): Breakdown of all Materials CND2B10LTExxxJ CND2B10TTExxxJ 6431 array 5% Materials Silver (Ag) Ceramic (Al2O3) Epoxy Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Pb in termination 38.6 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.5 5000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 18000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination&inner termination 3000 inner termination 2000 outer termination % Weight 1.358 88.7 1.6 1.8 0.042 2 2 2 0.3 0.2 260 10 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Breakdown of all Materials CND2A10YLTExxxJ CND2A10YTTExxxJ 4021 array 5% Materials Silver (Ag) Ceramic (Al2O3) Epoxy Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Pb in termination 16 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.5 5000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 18000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination&inner termination 3000 inner termination 2000 outer termination % Weight 1.358 88.7 1.6 1.8 0.042 2 2 2 0.3 0.2 260 10 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS compliant Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): Breakdown of all Materials CN1J4TTDxxxJ CN1J4TTDxxxJ 1206 array 5%, 4 res. 10.2 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.3 3000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight PPM Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Materials Silver (Ag) Ceramic (Al2O3) Epoxy Matte Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Process Data Peak Reflow (Deg. C) Time at Peak Temp. (seconds) Number of Reflows MSL Outer Plating Material Outer Plating Material Outer plating Average thickness Middle Plating Material Middle Plating Thickness Middle plating average thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 20000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination 3000 inner termination % Weight 1.358 88.7 1.6 2 0.042 2 2 2 0.3 260 10 3 1 Matte Sn 3µm 6µm Ni 3µm 6µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): Breakdown of all Materials CN1J4LTDxxxJ CN1J4TTDxxxJ 1206 array 5% Materials Silver (Ag) Ceramic (Al2O3) Epoxy Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Pb in termination 10.2 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.5 5000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 18000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination&inner termination 3000 inner termination 2000 outer termination % Weight 1.358 88.7 1.6 1.8 0.042 2 2 2 0.3 0.2 260 10 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS compliant Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): Breakdown of all Materials CN1J4KTTDxxxJ CN1J4KTTDxxxJ 1206 array 5%, 4 res. 10.2 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.3 3000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight PPM Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Materials Silver (Ag) Ceramic (Al2O3) Epoxy Matte Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Process Data Peak Reflow (Deg. C) Time at Peak Temp. (seconds) Number of Reflows MSL Outer Plating Material Outer Plating Material Outer plating Average thickness Middle Plating Material Middle Plating Thickness Middle plating average thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 20000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination 3000 inner termination % Weight 1.358 88.7 1.6 2 0.042 2 2 2 0.3 260 10 3 1 Matte Sn 3µm 6µm Ni 3µm 6µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): Breakdown of all Materials CN1J4KLTDxxxJ CN1J4KTTDxxxJ 1206 array 5% Materials Silver (Ag) Ceramic (Al2O3) Epoxy Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Pb in termination 10.2 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.5 5000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 18000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination&inner termination 3000 inner termination 2000 outer termination % Weight 1.358 88.7 1.6 1.8 0.042 2 2 2 0.3 0.2 260 10 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Breakdown of all Materials CN1J4ALTDxxxJ CN1J4ATTDxxxJ 1206 array 5% Materials Silver (Ag) Ceramic (Al2O3) Epoxy Tin (Sn) Paladium (Pd) RuO2 PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Pb in termination 7.5 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.5 5000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 13580 inner termination 887000 substrate 16000 resistive element protection 18000 outer termination 420 inner termination 20000 resistive element 20000 resistive element protection 20000 middle termination&inner termination 3000 inner termination 2000 outer termination % Weight 1.358 88.7 1.6 1.8 0.042 2 2 2 0.3 0.2 260 10 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 1.358 420 0 13580 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): Breakdown of all Materials CNZ1J4KLTD CNZ1J4KTTD 1206 array, zero-ohm 10.2 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.5 5000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Materials Silver (Ag) Ceramic (Al2O3) Epoxy Tin (Sn) Paladium (Pd) PbO-B2O3-SiO2 Glass Nickel (Ni) Chromium (Cr) Pb in termination 2 2 0.3 0.2 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable 260 10 3 1 Sn 3µm Ni 3µm Yes Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 33580 inner termination & resistive element 887000 substrate 16000 resistive element protection 18000 outer termination 420 inner termination % Weight 3.358 88.7 1.6 1.8 0.042 20000 20000 3000 2000 minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.042 0 3.358 420 0 33580 resistive element protection middle termination&inner termination inner termination outer termination