® Component Material Declaration material breakdown is for the KOA P/N CCP2BzzxxxTTE zz = current rating, xxx = fusing magnification KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials CCP2BzzxxxTTE CCP2BzzxxxTTE 1206 fuse, SMD KOA Part Number: RoHS Compliant Part Number: Part Description: 16 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.0016 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight PPM 0.9988 9988 0 1.0248 0 0 0 39.7036 0 39.7036 0.9223 0 0 0 0 10248 0 0 0 397036 0 397036 9223 0 0 0 Brominated Flame Retardants (Other than PBB or PBDE) Selenium & Selenium Compounds Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds PPM 16 0 0 Materials % Weight Aluminum 0.0065 Silicon 0.0001 Cu 39.7036 Ni 0.9223 P 0.0157 Sn 1.7858 0.0016 Pb Silicon 9.3784 Si02 (fused silica) 30.9663 Sb203 (Antimonyoxide) 1.0248 ORTHO-CRESOL, POLYMER WITH 1 10.1889 PHENOL-FORMALDEHYDE RESIN, P 4.9544 Brominated Epoxy 0.9988 2-Propenoic acid, polymer with 2 0.0248 Benzonic, acid 4 0.0053 Titanium Oxide 0.0211 0.0016 Other Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 23-Mar-06 Signed: Michael E Griffith 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 65 Fuse Element 1 Fuse Element 397036 Electrode 9223 Electrode 157 Electrode 17858 Electrode 16 Electrode 93784 Buffer 309663 Molding 10248 Molding 101889 Molding 49544 Molding 9988 Molding 248 Marking 53 Marking 211 Marking 16 Marking minimum minimum CAS # 7429-90-5 7440-21-3 7440-50-8 7440-02-0 7723-14-0 7440-31-5 7440-21-3 --60676-86-0 1309-64-4 29690-82-2 9003-35-4 40039-93-8 53192-18-0 21245-01-2 13463-67-7 --- ® Component Material Declaration material breakdown is for the KOA P/N CCP2EzzxxxTTE zz = current rating, xxx = fusing magnification KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials CCP2EzzxxxTTE CCP2EzzxxxTTE 1210 fuse, SMD KOA Part Number: RoHS Compliant Part Number: Part Description: 39 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.0012 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight PPM 1.3091 13091 0 1.3432 0 0 0 30.0978 0 30.0978 0.6991 0 0 0 0 13432 0 0 0 300978 0 300978 6991 0 0 0 Brominated Flame Retardants (Other than PBB or PBDE) Selenium & Selenium Compounds Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds PPM 12 0 0 Materials % Weight Aluminum 0.002574 Silicon 0.000026 Cu 30.0978 Ni 0.6991 P 0.012 Sn 1.3536 0.0012 Pb Silicon 5.4983 Si02 (fused silica) 40.5829 Sb203 (Antimonyoxide) 1.3432 ORTHO-CRESOL, POLYMER WITH 1 12.5676 PHENOL-FORMALDEHYDE RESIN, P 6.4933 Brominated Epoxy 1.3091 2-Propenoic acid, polymer with 2 0.0185 Benzonic, acid 4 0.0039 Titanium Oxide 0.0157 0.0012 Other Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 23-Mar-06 Signed: Michael E Griffith 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 25.74 Fuse Element 0.26 Fuse Element 300978 Electrode 6991 Electrode 120 Electrode 13536 Electrode 12 Electrode 54983 Buffer 405829 Molding 13432 Molding 125676 Molding 64933 Molding 13091 Molding 185 Marking 39 Marking 157 Marking 12 Marking minimum minimum CAS # 7429-90-5 7440-21-3 7440-50-8 7440-02-0 7723-14-0 7440-31-5 7440-21-3 --60676-86-0 1309-64-4 29690-82-2 9003-35-4 40039-93-8 53192-18-0 21245-01-2 13463-67-7 ---