RV-8523-C3 Real Time Clock Module with I2C Bus DIMENSIONS Package: Recommended Solder Pad: 3,70 0,8 0,8 0,8 3 4 5 10 9 8 7 6 1,4 0,8 3,0 2 0,5 2,50 1 0,8 0,8 0,3 0,6 0,8 max.0,9 0,1 3,70 100% leadfree, RoHS - compliant Ultra low power consumption 130nA Xtal integrated solution. Frequency-Offset Trimming Register Backup supply switchover circuitry Miniature SMT ceramic package Very tight frequency tolerance I2C Bus Interface (fast mode 1 MHz) Programmable Clock-output Low aging Time keeping mode down to 1.2 V Programmable alarm, timer and interrupt functions All dimensions in mm typical DESCRIPTION: This RTC IC has been specially designed to achieve an ultra-low power consumption of typically 130nA @ VDD 3.0V in time-keeping mode. The very small SMT ceramic-package combines the 32.768 kHz crystal unit with the CMOS-based oscillator and real-time-clock circuitry. The calendar function tracks year, month, date, and day-of-the-week with built-in century and leap-year flags. The clock function tracks minute and second in 24-hour format. Programmable alarm setting, dual timer functions and integrated switch-over circuitry to backup supply voltage increase flexibility. For pick-and-place equipment, the parts are available in 12 mm tape: 7” (178 mm) reel with 1'000 or 3'000 parts 13” (330 mm) reel with 10'000 parts BLOCK DIAGRAM: 32.768 kHz Xtal FREQUENCY DIVIDER and OFFSET COMPENSATION OSC CLKOUT INT_1 INT_2 VDD VBACKUP VSS 5 2 6 CLKOUT & Interrupt CONTROL 1 8 POWER CONTROL 7 2 SCL 3 I C-BUS 2-wire SDA 4 Serial Interface SYSTEM CONTROL LOGIC Control 0 Control 1 Control 2 Seconds Minutes Hours Days Weekdays Months Years Minute Alarm Hour Alarm Day Alarm Weekday Alarm Frequency Offset Timer & CLKOUT Timer A Clock Timer A Timer B Clock Timer B 00 13 ELECTRICAL CHARACTERISTICS AT 25°C: Symbol Condition Min. Typ. Max Unit 2 Supply voltage VDD I C Bus Active Supply voltage VDD Power Managm. 1.8 5.5 V Supply voltage VDD Time keeping 1.2 5.5 V Current consumption during access IDD Current consumption Time keeping mode IDDO CLKOUT frequency 1.6 5.5 V fscl=1 MHz VDD 3 V 100 200 μA fscl=100 kHz VDD 3 V 50 100 μA fscl=0 Hz, VDD 3 V 130 180 nA fscl=0 Hz, VDD 2 V 110 160 nA Programmable 32768...to...1 Hz Frequency tolerance F/F @ 25°C ±10 / ±20 1) ppm Aging first year max. F/F @ 25°C ±3 ppm Frequency vs. temp. F/FO 20 ≤ T0 ≤ 30 –0.035 ppm/ °C² (T )2 - T0 ±10% ppm 1) Tighter and wider frequency tolerances on request. ENVIRONMENTAL CHARACTERISTICS: Conditions Storage temp. range –55 to +125°C TA Operating temperature range TERMINATIONS AND PROCESSING: Max. Dev. –40 to +85°C Shock resistance F/F 5000 g, 0.3 ms, ½ sine +/-5 ppm Vibration resistance F/F 20 g / 10–2000 Hz +/-5 ppm Package-Type Termination Processing SON 10-pin For SMD mounting Au plated pads Reflow soldering 260°C / 20 s max. CURRENT CONSUMPTION vs. 200.0 POWER SUPPLY VOLTAGE: 190.0 180.0 IDD [nA] 170.0 160.0 150.0 140.0 130.0 120.0 110.0 100.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 VDD [V] PIN CONNECTIONS TOP VIEW: Product Marking #10 #6 8523 #5 #1 Pin 1 Index Pin Connection 1 VDD Power Supply Voltage 2 INT_1 Interrupt_1 Output 3 SCL Serial Clock Input 4 SDA Serial Data 5 CLKOUT Clock Frequency Output 6 INT_2 Interrupt_2 Output 7 VSS Ground 8 VBACKUP Backup Supply Voltage 9 NC not connected 10 NC not connected All specifications subject to change without notice. Micro Crystal AG Mühlestrasse 14 CH-2540 Grenchen Switzerland Tel. +41 32 655 82 82 Fax +41 32 655 82 83 [email protected] www.microcrystal.com Version 1.1/11.2011