Qualification-IXD_602 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-003 Reliability Report IXD_602 Series VIS Foundry; Process CU05UMS12010 ( ASSEMBLY IN SOIC STYLE PACKAGES) Report Title: Reliability Summary Report IXD_602 Series VIS Foundry Process CU05UMS12010 SOIC Style Package Assembly Report Number: 2011-003 Date: 2/7/13 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.IXYSIC.COM Page 1 of 5 Qualification-IXD_602 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-003 Introduction: This report summarizes the Reliability data of IXYS IC Division IXD_602 product family in SOIC style packages. The Reliability data presented here were collected from multiple sources including internal product qualifications, external subcontracted test and reliability facilities and internal reliability monitors. The IXD_602 family of Gate Driver products is foundered at Vanguard International Semiconductor, Corp. (VIS) and assembled at CEI in Thailand and/or Atec in the Philippines. The VIS process is CU05UMS12010. Reliability Tests: Table 1 below provides the reliability tests that were performed, the referenced industry specification and details on number of devices/lots per test. IXD_602SI/SIA Product Reliability Tests Stress Test Applicable Specs Stress Conditions Number Sample Total of Lots Size (SS) SS HTOL JESD22-A104-C 1000hrs, 150°C 6 HTOL HAST Mil-Std-883 JESD22A110-C 1000hrs. 125°C 130°C, 85% 18.8PSI, 96hrs 2 6/2 Thermal Shock Mil-Std-883, M1011 0 to 100°C, 10/10 dwells, 15 cycles Temp Cycle JESD22-A104-C (T/C) 80 480 77 80/76 154 632 1 55 55 -65 to 150°C, 10/10 dwells, 250 cycles 1 55 55 High Temp JESD22-A103C Storage 150°C, 1000hrs 3 50 150 Autoclave J-STD-020D.1, JESD22A102 T=121°C, RH=100%, t=96hrs unbiased 6 80 480 Latch Up AECQ100003 J-Std-020 T=125°C, 35v, 100mA IR reflow; Level 1 3x 1 8 8 1 50 50 MSL IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.IXYSIC.COM Page 2 of 5 Qualification-IXD_602 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-003 Stress Test ELFR PTC ESD HBM Applicable Specs Stress Conditions Gate T=RT Leakage AECQ100T=150°C, t=48hrs 008-REV A With bias JESD22T=-40°C/+125°C, A105-C 1000 cycles t=45 min JESD221.5kΩ, 100pF A114-E Number Sample Total of Lots Size (SS) SS 1 8 8 2 800 1600 1 48 48 9/25 43 2/1 Reliability Test Results: The stress tests and associated results for the reliability analysis of product IXDx602SI/SIA are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Products selected for the data summary share identical wafer fabrication processes, the same subcontractor assembly locations and all materials related to assembly are identical. Then reliability stresses were conducted and electrically tested to datasheet limits at each interval and final readpoint. Table 2: Product IXD_602 Family Reliability Test Results Stress Test Readpoint / (Reject/ SS) HTOL 150°C 1000 hrs/ 0 / 480 HTOL 125°C 1000 hrs/ 0 / 154 HAST 96 hrs/ 0 /632 Thermal Shock 15 cycles/ 0 /55 Temp Cycle 250 Cycles/ 0 / 55 High Temp Storage Autoclave 1000 hrs/ 0 / 150 96 hrs / 0 / 480 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.IXYSIC.COM Page 3 of 5 Qualification-IXD_602 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-003 Stress Test MSL; IR Reflow 3X Readpoint / (Reject/ Level 1, 3x/ 0 / 50 Latch-Up Trigger Pulse ELFR 0/8 Neg./Pos. Potential 0/8 48 hrs. PTC 0/1600 1000 cycles Gate Leakage SS) 0/48 ESD Testing Results: As part of this reliability testing, the IXD_602 product family was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/-3000V testing. Table3: Product IXDI602SIA ESD Characterization Results ESD Package Model HBM SOIC – 8L ESD Test Spec JESD22, A114-E RC Network 1.5kΩ, 100pF Highest Passed 3000V Class 2 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.IXYSIC.COM Page 4 of 5 Qualification-IXD_602 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-003 FIT (Failure in Time) Rate on the IXD_602 Product Family Table 4 summarizes the number of devices used for IXD_602 product family reliability stress. Using the HTOL data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy for 150°C test temperature and 40°C use temperatures. Using the HAST data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy for 130°C test temperature and 40°C use temperatures. Table 4: Product Family IXD_602SI (SOIC style package data) FIT Rate Summary (HTOL results were calculated using the higher temperature results at 150 degrees only) Stress # of # of Hours Act. Acceleration Equivalent Devices Fails Tested Energy Factor Dev. Hours FIT Rate @ 60% CL HTOL 480 0 1000 0.7 853.34 409,605,288 2.25 HAST 632 0 96 0.7 1.4318E+03 904,888,485 1.02 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.IXYSIC.COM Page 5 of 5