CPC44055ST

CPC44055ST
AC Power Switch
INTEGRATED CIRCUITS DIVISION
Characteristics
Description
Parameter
Rating
Units
AC Operating Voltage
20-280
VAC (Vrms)
Input Voltage Range
9-16
V
Load Current
With 5°C/W Heat Sink
20
No Heat Sink
5
Arms
On-State Voltage Drop
1.1
VP (at IL=2AP)
Blocking Voltage
800
VP
Thermal Resistance,
Junction-to-Case, JC
0.35
°C/W
Features
• Load Current up to 20Arms with 5°C/W Heat Sink
• 800VP Blocking Voltage
Creepage Pin 1 to Pin 2 of 0.225 inch (5.715 mm)
• Zero-Cross Switching
• 2500Vrms Isolation, Input to Output
Creepage Pin 2 to Pin 3 of 0.375 inch (9.525 mm)
• DC Voltage Control, AC Output
• Optically Isolated
• Low EMI and RFI Generation
• High Noise Immunity
• Machine Insertable, Wave Solderable
CPC44055ST is a voltage-controlled AC Solid State
Switch utilizing dual power SCR outputs. This device
also includes zero-cross turn-on circuitry and is
specified with an 800VP blocking voltage.
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500Vrms of isolation. As a result, the
CPC44055ST is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of communications and control systems.
The unique SuperSIP package pioneered by IXYS
Integrated Circuits Division allows Solid State Relays
to achieve the highest load current currently available
in any similar-sized package. This package features a
unique process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal resistance
(0.35°C/W).
Ordering Information
Applications
• Lighting
• Tungsten Load: 4.75A (Free Air), 15A (Heat Sink)
• Electrical Ballast: 5A (Free Air), 15A (Heat Sink)
• Programmable Controls
• Process Controls
• Power Control Panels
• Remote Switching
• Gas Pump Electronics
• Contactors
• Large Relays
• Solenoids
• Motors: 1/3HP (Free Air), 1/2HP (Heat Sink)
• Heaters
Part
Description
CPC44055ST
SuperSIP Package (13 per tube)
Pin Configuration & Waveforms
ZC
1
2
AC Load
3
+V
4
–V
Control
Approvals
• UL 508 Recognized Component: File E69938
See “UL Approved Ratings” on page 4.
AC Line
Load
Current
Voltage
Across
Relay
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Reverse Input Voltage
Input Control Voltage
Input Power Dissipation 1
Total Power Dissipation 2
I2t for Fusing
(1/2 Sine Wave, 60Hz)
Isolation Voltage, Input to Output 60
Seconds
ESD, Human Body Model
Operational Temperature
Storage Temperature
1
2
Min
Max
Units
-
800
5
17
225
4.4
VP
V
V
mW
W
-
200
A2s
-
2500
Vrms
- 40
- 40
4
+85
+125
kV
°C
°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 1.33mW / °C.
Free air, no heat sink.
1.2 Recommended Operating Conditions
Parameter
Input Control Voltage 1
1
Conditions
Symbol
Min.
Typ.
Max.
Units
TA=-40°C to 85°C
VIN
9
-
16
V
For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use VIN >10V.
1.3 Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
Continuous
Continuous
Maximum Surge Current
Off-State Leakage Current
On-State Voltage Drop 1
Off-State dV/dt
Switching Speeds
Turn-On
Turn-Off
Zero-Cross Turn-On Voltage
Holding Current
Latching Current
Operating Frequency 2
Load Power Factor for Guaranteed Turn-On 3
Conditions
Symbol
No Heat Sink, VL=20-280Vrms
TC=25°C
1/2 Sine Wave, 60Hz
VL=800V
IL=2AP
VIN=0V
IL
IP
ILEAK
-
dV/dt
ton
toff
Minimum
Typical
Maximum
0.1
0.1
1000
0.85
-
5
40
150
100
1.1
-
6.8
-
0.5
0.5
20
5
50
75
500
-
Units
Arms
A
AP
VP
V/s
1st half-cycle
subsequent half-cycle
f=60Hz
IH
IL
PF
20
0.25
IL=1A Resistive, f=60Hz
VIN=10V
VR=5V
RIN
VIN
IIN
IR
0.9
0.8
7.8
-
1
8.8
-
1.1
5
10.1
10
k
V
V
mA
A
VIO=0V, f=1MHz
CIO
-
-
3
pF
VIN=10V
-
cycles
V
mA
mA
Hz
-
Input Characteristics
Input Resistor
Input Control Voltage to Activate
Input Control Voltage to Deactivate
Input Current
Reverse Input Current
Input/Output Characteristics
Capacitance, Input-to-Output
1
2
3
Tested at a peak value equivalent.
Zero-cross first half-cycle @ < 100Hz.
Snubber circuits may be required at low power factors.
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
2 Thermal Characteristics
Parameter
Conditions
Symbol
Rating
Units
-
JC
0.35
°C/W
Free Air
JA
27
°C/W
-
TJ
-40 to +100
°C
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θCA =
(TJ - TA)
PD
- θJC
TJ = Junction Temperature (°C), TJ ≤ 150°C *
TA = Ambient Temperature (°C)
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD = On-State Voltage (Vrms) • Load Current (Arms)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
2.2 Thermal Performance Data
Output Power Dissipation
vs. Ambient Temperature
Output Power Dissipation
vs. Load Current
40
40
Output Power (W)
Heat Sink
2ºC/W
5ºC/W
10ºC/W
15ºC/W
30
25
20
30
25
20
15
15
10
10
5
5
No Heat Sink
0
0
0
3
Output Power (W)
35
35
5
10
15
20
Load Current (Arms)
25
30 0
10
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20 30 40 50 60 70
Ambient Temperature (ºC)
80
90
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
3 UL Approved Ratings
3.1 General Loads
Voltage
(VAC)
Current
(A)
Surrounding Air Temperature
(°C)
20 - 280
4.75
40
20 - 280
2.5
85
51 - 150
15 (with Heat Sink*)
40
51 - 150
11.75 (with Heat Sink*)
70
Voltage
(VAC)
Current
(A)
Surrounding Air Temperature
(°C)
20 - 280
4.75
40
20 - 280
2.5
85
51 - 150
15 (with Heat Sink*)
40
51 - 150
11.75 (with Heat Sink*)
70
Voltage
(VAC)
Current
Surrounding Air Temperature
(°C)
220 - 240
1/3 HP, 3.6 FLA
40
3.2 Tungsten Lamp Load
3.3 Motor Load
220 - 240
1/6 HP, 2.2 FLA
85
110 - 120
1/2 HP, 9.8 FLA (with Heat Sink*)
40
110 - 120
1/2 HP, 9.8 FLA (with Heat Sink*)
70
Voltage
(VAC)
Current
(A)
Surrounding Air Temperature
(°C)
120
5
35
120
15 (with Heat Sink*)
40
120
10 (with Heat Sink*)
70
3.4 Electronic Ballast Load
Note: *Heat Sink Used for UL Testing: Ohmite MA-302-55E
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
4 Performance Data (@25°C Unless Otherwise Noted)
Input Voltage to Activate
Resistive Load
(N=50, IL=1A, VL=120VAC/60Hz)
25
Device Count (N)
Device Count (N)
20
15
10
5
Typical Blocking Voltage Distribution
(N=50)
20
20
Device Count (N)
25
On-State Voltage Drop
(N=50, VIN=10V, IL=2A)
15
10
5
0
0
15
10
5
0
0.856 0.859 0.862 0.865 0.868 0.871 0.874
On-State Voltage Drop (V)
3.868 3.908 3.948 3.988 4.028 4.068 4.108
LED Forward Voltage (V)
876
878 880 882 884
Blocking Voltage (VP)
886
Zero-Cross Voltage Distribution
(N=50, VIN=10V)
20
Device Count (N)
874
15
10
5
0
6.2
10
5
0
60
50
40
30
On-State Voltage Drop vs. Temperature
(VIN=10V)
IL=4AP
IL=3AP
IL=2AP
IL=1AP
0.95
0.90
0.85
0.80
-20
0
20
40
60
Temperature (ºC)
80
-40
-20
0
20
40
60
Temperature (ºC)
80
100
7.0
6.8
6.6
6.4
6.2
-40
100
Input Voltage to Activate
Resistive Load
(IL=1A, 60Hz)
6.0
5.5
5.0
4.5
4.0
-20
0
20
40
60
Temperature (ºC)
80
100
Input Voltage to Activate
Inductive Load
(IL=500mA, 60Hz, 400mH)
9.0
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
3.5
0.75
7.2
6.0
-40
20
Input Voltage to Activate (V)
10
15
Input Voltage (V)
Input Voltage to Activate (V)
On-State Voltage Drop (VP)
5
Zero-Cross vs. Temperature
(VIN=10V, RL=120Ω)
7.4
70
20
0
1.00
7.4
Zero-Cross Voltage (V)
Holding current (mA)
Input Current (mA)
80
15
6.6
6.8
7.0
7.2
Zero-Cross Voltage (V)
Holding Current vs. Temperature
(VIN=0V, RL=1.9Ω)
Input Voltage vs. Input Current
20
6.4
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
The performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
5.5
5.0
4.5
4.0
3.5
6.44
6.40
6.35
6.30
6.25
6.20
6.15
6.10
500
600
Typical Load Current
vs. On-State Voltage Drop
(VIN=10V)
100
200
300
400
Load Frequency (Hz)
500
6.40
6.38
6.36
6.34
0
600
0
-2
-4
200
300
400
Load Frequency (Hz)
500
600
100
950
900
850
VL=800V
VL=600V
VL=400V
10
1
0.1
0.01
0.001
800
-40
1.0
100
Off-State Leakage Current
vs. Temperature
1000
2
-0.5
0.0
0.5
On-State Voltage Drop (V)
6.42
Breakdown Voltage vs. Temperature
4
-6
-1.0
0
Leakage Current (μA)
200
300
400
Load Frequency (Hz)
Breakdown Voltage (VP)
6
100
Input Voltage to Activate
vs. Load Frequency - Inductive Load
(VL=200V, ZL=196mH/110Ω)
6.32
6.05
0
Load Current (A)
Input Voltage to Activate
vs. Load Frequency - Inductive Load
(VL=200V, ZL=400mH/220Ω)
Input Voltage to Activate (V)
6.45
Input Voltage to Activate (V)
Input Voltage to Activate (V)
6.0
Input Voltage to Activate
vs. Load Frequency - Resistive Load
(VL=67V, IL=4.91Arms, RL=10Ω)
300
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Maximum Surge Current
Non-Repetitive
(TJ=50ºC Prior to Surge)
Surge Current (A)
250
200
150
100
50
0
1ms
10ms
100ms
Time
1s
10s
The performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC44055ST
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC44055ST
245°C for 30 seconds
NOTE: The exposed surface of the DCB substrate is not to be soldered.
5.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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CPC44055ST
INTEGRATED CIRCUITS DIVISION
5.5 Mechanical Dimensions
3.807±0.076
(0.150±0.003)
38.100±0.254
(1.500±0.010)
TOP
35.544±0.254
(1.360±0.010)
BOTTOM
1.778±0.254
(0.070±0.010)
13.005±0.254
(0.512±0.010)
17.780±0.254
(0.700±0.010)
9.169±0.127
(0.361±0.005)
DCB Substrate
NOTE: Not
to be soldered
Pin 1
2.540±0.254
(0.100±0.010)
(4x)
3.810±0.127
(0.150±0.005)
DIMENSIONS
millimeters
(inches)
Pin 1
2.997±0.254
(0.118±0.010)
2.540±0.127
(0.100±0.005)
5.080±0.127
(0.200±0.005)
6.350±0.127
(0.250±0.005)
1.016±0.076
(0.040±0.003)
(4x)
0.635±0.025
(0.025±0.001)
10.160±0.127
(0.400±0.005)
12.700±0.127
(0.500±0.005)
1.397±0.127
(0.055±0.005)
Pin tolerances are non-cumulative
RECOMMENDED HOLE PATTERN
Hole Size 1.45 mm (0.057 in) x4
Pin 1
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC44055ST-R02
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/9/2015
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