XBA170

XBA170
Dual Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Load Voltage
Load Current
On-Resistance (max)
Input Control Current
Rating
350
100
50
5
Units
V
mArms / mADC

mA
Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• VDE Compatible
• FCC Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount & Tape & Reel Version Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Description
XBA170 comprises two independent 350V, 100mA,
50 solid state relays: one single-pole, normally
open (1-Form-A) relay and one single-pole, normally
closed (1-Form-B) relay.
Featuring low on-resistance combined with enhanced
peak load current handling capabilities, XBA170
is designed to provide an ideal solution where a
complementary Form-A/Form-B relay pair is required.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Compliant
Ordering Information
Part #
XBA170
XBA170P
XBA170PTR
XBA170S
XBA170STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
AC/DC Configuration
1
8
2
7
3
6
4
5
Switching Characteristics
of Normally Open Devices
Switching Characteristics
of Normally Closed Devices
IF
IF
ILOAD
90%
ILOAD
ton
DS-XBA170-R04
Normally Open Pole
Form-B
Form-A
Pb
Normally Closed Pole
90%
10%
10%
toff
toff
ton
e3
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1
INTEGRATED CIRCUITS DIVISION
XBA170
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
350
5
50
1
Units
VP
V
mA
A
150
800
3750
-40 to +85
-40 to +125
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
AC/DC Configuration, Continuous
Peak
On-Resistance, AC/DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=100mA
VL=350VP
IL
ILPK
RON
ILEAK
-
33
-
100
±350
50
1
mArms / mADC
mAP

A
VL=50V, f=1MHz
ton
toff
COUT
-
25
5
5
-
IL=100mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
ms
pF
*NOTE: If both poles operate simultaneously, then the load current must be derated in order not to exceed the package power dissipation value.
2
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R04
INTEGRATED CIRCUITS DIVISION
XBA170
FORM-A / FORM-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.8
0.016
0.014
1.6
1.4
Leakage (PA)
Device Count (N)
30
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.012
0.010
0.008
0.006
0.004
0.002
0.8
-40
1.25
-20
0
20
40
60
80
100
0
-40
120
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
LED Forward Voltage Drop (V)
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s
100s
Time
FORM-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
FormA
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
25
15
10
5
0
0.75
0.83
0.91
0.99
1.06
15
10
5
1.14
FormA
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC)
20
15
10
5
0
0.11
0.14
0.17
0.19
0.22
0.25
29.09 29.86 30.63 31.40 32.16 32.93 33.70
0.28
Turn-On Time (ms)
Turn-Off Time (ms)
On-Resistance (:)
FormA
Typical IF for Switch Operation
(N=50, IL=100mADC)
FormA
Typical IF for Switch Dropout
(N=50, IL=100mADC)
FormA
Typical Blocking Voltage Distribution
(N=50)
15
10
5
20
15
10
5
0
0
0.44
0.50
0.56
0.62
0.69
LED Current (mA)
0.75
0.81
25
Device Count (N)
20
25
Device Count (N)
Device Count (N)
20
0
0.67
25
25
Device Count (N)
20
Device Count (N)
Device Count (N)
25
FormA
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
20
15
10
5
0
0.44
0.50
0.56
0.62
0.69
LED Current (mA)
0.75
0.81
424.0 429.3 434.5 439.7 444.9 450.1 455.4
Blocking Voltage (VP)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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3
INTEGRATED CIRCUITS DIVISION
XBA170
FormA
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
1.8
1.0
IF=10mA
0.8
IF=20mA
0.6
0.4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
15
20
25
30
35
40
45
50
5
2
-20
0
20
40
60
80
100
-40
120
-20
0
20
40
60
80
100 120
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
FormA
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mADC)
FormA
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mADC)
FormA
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
10
15
20
25
30
35
40
45
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
50
6
5
4
3
2
1
0
-20
0
20
40
60
80
-40
100 120
-20
0
20
40
60
80
100 120
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
FormA
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
FormA
Typical Load Current
vs. Load Voltage
(IF=5mA)
Form A
Maximum Load Current
vs. Temperature
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
160
140
50
40
30
20
10
0
0
20
40
60
80
100
120
Load Current (mA)
Load Current (mA)
60
-20
3
0
-40
70
-40
4
1
LED Current (mA)
5
Turn-Off Time (ms)
Turn-Off Time (ms)
1.2
0
0
On-Resistance (:)
5
1.4
0.2
0
FormA
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
6
IF=5mA
1.6
LED Current (mA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
FormA
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
Turn-On Time (ms)
Turn-On Time (ms)
FORM-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
120
100
80
IF=20mA
IF=10mA
IF=5mA
60
40
20
0
-4
-3
-2
-1
0
1
2
3
4
Load Voltage (V)
Temperature (ºC)
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
FormA
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
455
450
445
440
435
430
425
420
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R04
INTEGRATED CIRCUITS DIVISION
XBA170
FORM-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
FormB
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
25
15
10
5
0
0.14
0.17
0.19
0.22
0.25
15
10
5
0.28
FormB
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC)
20
15
10
5
0
0.67
0.75
0.83
0.91
0.99
1.06
30.59 31.36 32.13 32.90 33.66 34.43 35.20
1.14
Turn-On Time (ms)
Turn-Off Time (ms)
On-Resistance (:)
FormB
Typical IF for Switch Operation
(N=50, IL=100mADC)
FormB
Typical IF for Switch Dropout
(N=50, IL=100mADC)
FormB
Typical Blocking Voltage Distribution
(N=50)
15
10
5
20
15
10
5
0
0
0.44
0.50
0.56
0.62
0.69
LED Current (mA)
0.75
0.81
25
Device Count (N)
20
25
Device Count (N)
Device Count (N)
20
0
0.11
25
25
Device Count (N)
20
Device Count (N)
Device Count (N)
25
FormB
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
20
15
10
5
0
0.44
0.50
0.56
0.62
0.69
0.75
LED Current (mA)
0.81
424.0 429.3 434.5 439.7 444.9 450.1 455.4
Blocking Voltage (VP)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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5
INTEGRATED CIRCUITS DIVISION
XBA170
5
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10
15
20
25
30
35
40
45
50
6
5
0
20
40
60
80
-40
-20
0
20
40
60
80
100 120
Temperature (ºC)
Temperature (ºC)
FormB
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mADC)
FormB
Typical Turn-Off Time
vs. Temperature
(IL=100mADC)
FormB
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
1.8
10
15
20
25
30
35
40
45
6
5
IF=5mA
1.4
1.2
1.0
IF=10mA
0.8
IF=20mA
0.6
0.4
4
3
2
1
0
-40
50
-20
0
20
40
60
80
-40
100 120
-20
0
20
40
60
80
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
FormB
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
FormB
Typical Load Current
vs. Load Voltage
(IF=5mA)
Form B
Maximum Load Current
vs. Temperature
(IF=5mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
70
160
40
30
20
10
0
0
20
40
60
80
100
120
Load Current (mA)
50
100 120
140
Load Current (mA)
60
-20
2
100 120
0
-40
3
0
-20
0.2
5
4
1
1.6
0
FormB
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
Turn-Off Time (ms)
0
On-Resistance (:)
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
LED Current (mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
FormB
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=100mADC)
LED Current (mA)
FormB
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
Turn-On Time (ms)
Turn-On Time (ms)
FORM-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
120
100
80
60
40
20
0
-4
-3
-2
-1
0
1
2
3
4
Load Voltage (V)
Temperature (ºC)
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
FormB
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
455
450
450
440
435
430
425
420
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
6
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R04
INTEGRATED CIRCUITS DIVISION
XBA170
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
XBA170 / XBA170S / XBA170P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
XBA170 / XBA170S
250ºC for 30 seconds
XBA170P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R04
e3
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7
INTEGRATED CIRCUITS DIVISION
XBA170
Mechanical Dimensions
XBA170
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
XBA170S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
XBA170P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
8
PCB Land Pattern
Dimensions
mm
(inches)
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R04
INTEGRATED CIRCUITS DIVISION
XBA170
XBA170STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
P=12.00
(0.472)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
XBA170PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
P = 12.00
(0.472)
User Direction of Feed
Ao = 10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
9
Specification: DS-XBA170-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012