CPC1822 4V Output Solar Cell INTEGRATED CIRCUITS DIVISION Parameter Open Circuit Voltage Short Circuit Current Rating 4 50 * Direct sunlight (Approximately 6000 lux) Features • • • • • • • • 4V Output Triggers with Natural Sunlight Provides True Wireless Power No EMI/RFI Generation Wave Solderable Replacement of Discrete Components Solid State Reliability Small 8-Pin Surface Mount SOIC Description The CPC1822 is a monolithic photovoltaic string of solar cells with switching circuitry. When operating in sunlight or a bright artificial light environment the optical energy will activate the cell array and generate a voltage at the output. The solar cells are capable of generating a floating source voltage and current sufficient to drive and power CMOS ICs, logic gates and/or provide “trickle charge” for battery applications. Ordering Information Part # CPC1822N CPC1822NTR Portable Electronics Solar Battery Chargers Battery Operated Equipment Consumer Electronics Off-Grid Installation Wireless Sensors and Detection Flame Detection Self Powered Sunlight/ Light Detection Self Powered Products Remote Installation Pb DS-CPC1822-R03 Description 8-Pin Clear Molded SOIC Package (100/Tube) 8-Pin Clear Molded SOIC Package (2000/Reel) Pin Configuration Applications • • • • • • • • • • Units V uA 1 2 8 V+ 7 3 6 4 5 V- e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1822 Absolute Maximum Ratings Parameter Reverse Voltage Operational Temperature Storage Temperature Ratings 10 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units V °C °C Electrical absolute maximum ratings are at 25°C Electrical Characteristics Parameter Output Characteristics @ 25°C Open Circuit Voltage Short Circuit Current Conditions Symbol Min Typ Max Units Direct Sun (6000 lux) High Intensity Lamp Direct Sun (6000 lux) VOC VOC ISC - 4.2 4.5 50 - V V µA PERFORMANCE DATA* Normalized Short Circuit Output Current vs. Light Intensity 4.5 Normalized Output Current (P! .ORMALIZED/UTPUT6OLTAGE6 Normalized Open Circuit Output Voltage vs. Light Intensity 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 2 4 6 8 ,IGHT)NTENSITYLUXs 10 0 1.0 0.8 0.6 0.4 0.2 0.0 40 60 80 Incident Angle (Degrees) 4 6 8 10 Normalized Short Circuit Output Current vs. Incident Angle of Light to Photodiode Surface Normalized Output Current (PA) Normalized Output Voltage (V) 1.2 20 2 ,IGHT)NTENSITYLUXs Normalized Open Circuit Output Voltage vs. Incident Angle of Light to Photodiode Surface 0 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 100 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 Incident Angle (Degrees) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 2 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC1822 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1822N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1822N 260ºC for 30 seconds Board Wash Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1822 MECHANICAL DIMENSIONS 8-Pin SOIC Package Recommended PCB Land Pattern 0.19 - 0.25 (0.008 - 0.010) 1.55 (0.061) 0.40 - 1.27 (0.016 - 0.050) 3.80 - 4.00 (0.15 - 0.16) 5.80 - 6.20 (0.23 - 0.24) 5.40 (0.213) PIN 1 1.27 TYP (0.05 TYP) 0.33 - 0.51 (0.013 - 0.020) 0.60 (0.024) 4.80 - 5.00 (0.19 - 0.20) 1.27 (0.050) 0.10 - 0.25 (0.004 - 0.010) Dimensions mm (inches) 1.35 - 1.75 (0.053 - 0.069) 0.394 - 0.648 (0.016 - 0.026) Tape and Reel Packaging for 8-Pin SOIC-N Surface Mount Package 4.00 ± 0.10 (0.157 ± 0.004) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.75 ± 0.10 (0.069 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) W = 12.00 ± 0.30 (0.472 ± 0.012) 5.50 ± 0.10 (0.217 ± 0.004) B0 = 5.30 ± 0.10 (0.209 ± 0.004) Top Cover Tape Embossed Carrier K0= 2.10 ± 0.10 (0.083 ± 0.004) P = 8.00 ± 0.10 (0.315 ± 0.004) A0 = 6.50 ± 0.10 (0.256 ± 0.004) User Direction of Feed Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 4 Specification: DS-CPC1822-R03 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012