CPC3708

CPC3708
350V N-Channel
Depletion Mode FET
INTEGRATED CIRCUITS DIVISION
Parameter
Drain-to-Source Voltage - V(BR)DSX
Rating
350
Max On-Resistance - RDS(on)
14
Units
V

Max Power
SOT-89 Package
1.1
SOT-223 Package
2.5
Features
• 350V Drain-to-Source Voltage
• Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• Low On-Resistance: 8 (Typical) @ 25°C
• Low VGS(off) Voltage
• High Input Impedance
• Low Input and Output Leakage
• Small Package Size SOT-89 and SOT-223
• PC Card (PCMCIA) Compatible
• PCB Space and Cost Savings
The CPC3708 is a N-channel, depletion mode Field
Effect Transistor (FET) that is available in an
SOT-223 package (CPC3708Z) and an SOT-89
package (CPC3708C). Both utilize IXYS Integrated
Circuits Division’s proprietary third-generation
vertical DMOS process that realizes world class,
high voltage MOSFET performance in an economical
silicon gate process. The vertical DMOS process
yields a highly reliable device, particularly for
use in difficult application environments such as
telecommunications, security, and power supplies.
CPC3708Z and the CPC3708C have a typical
on-resistance of 8 and a drain-to-source voltage
of 350V. As with all MOS devices, the FET structure
prevents thermal runaway and thermally induced
secondary breakdown.
Ordering Information
Part Number
CPC3708CTR
CPC3708ZTR
Applications
•
•
•
•
•
•
•
•
W
Description
LED Drive Circuits
Telecommunications
Normally On Switches
Ignition Modules
Converters
Security
Power Supplies
Regulators
Circuit Symbol
Description
SOT-89: Tape and Reel (1000/Reel)
SOT-223: Tape and Reel (1000/Reel)
Package Pinout:
D
D
G
1
4
2
3
G
D
S
S
Pin Number
Name
1
GATE
2
DRAIN
3
SOURCE
4
DRAIN
DS-CPC3708-R03
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1
INTEGRATED CIRCUITS DIVISION
CPC3708
Absolute Maximum Ratings @ 25ºC
Parameter
Ratings
Units
Drain-to-Source Voltage (V(BR)DSX)
350
V
Gate-to-Source Voltage (VGS)
±20
V
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Total Package Dissipation 1
SOT-89
1.1
SOT-223
2.5
W
Operational Temperature
-40 to +110
oC
Storage Temperature
-40 to +125
oC
1
Mounted on 1"x1" FR4 board.
Electrical Characteristics @25oC (Unless Otherwise Specified)
Symbol
Conditions
Min
Typ
Max
Units
Gate-to-Source Voltage
Gate-to-Source Off Voltage
Parameter
VGS
VGS(off)
Drain-to-Source Leakage Current
IDS(off)
RDS(on)
IGSS
CISS
ID=60mA, VDS=5V
ID=2A, VDS=10V, VDS=100V
VGS= -5V, VDS=190V
VGS= -5V, VDS=350V
VGS= -2.7V, VDS=5V, VDS=50V
VGS= -0.57V, VDS=5V
VGS= -0.35V, IDS=50mA
VGS=±20V
VDS= VGS=0V
-1.005
-2
130
-
8
-
-1.735
-3.6
20
1
5
14
100
300
V
V
nA
A
mA
mA

Symbol
Conditions
Min
Typ
-
-
-
Drain Current
ID
On-Resistance
Gate Leakage Current
Gate Capacitance
nA
pF
Thermal Resistance
Package
SOT-89
SOT-223
2
Parameter
Junction to Case
RJC
Junction to Ambient
RJA
Junction to Case
RJC
Junction to Ambient
RJA
-
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-
-
Max
Units
50
90
14
ºC/W
55
R03
INTEGRATED CIRCUITS DIVISION
CPC3708
CPC3708Z (SOT-223) PERFORMANCE DATA*
Output Characteristics
(TA=25ºC)
0.20
0.15
0.10
300
TA=-40ºC
TA=25ºC
TA=125ºC
250
15
200
10
150
100
5
50
0.05
0
0.00
250
VDS (V)
Transfer Characteristics
(VDS=10V)
VGS(off) vs. Temperature
(VDS=10V, ID=2PA)
2
3
4
0.0
5
0.1
-2.3
0.2
0.4
0.5
0.6
VGS(off) (V)
-2.6
-2.7
10
300
-1.5
-1.0
-20
0
20
40
60
Temperature (ºC)
80
7
6
-40
100
-20
0
20
40
60
Temperature (ºC)
80
100
Forward Safe Operating Bias
(VGS=0V, DC Load, TC=25ºC)
1
Limited by
Device Channel
Saturation
250
CISS
COSS
CRSS
0.1
IDS(A)
Capacitance (pF)
8
4
-40
Capacitance vs. Drain-Source Voltage
(VGS=-5V)
200
9
5
-3.0
-2.0
VGS (V)
150
11
-2.9
-2.5
100
On-Resistance vs. Temperature
(VGS=0V, ID=100mA)
12
-2.8
50
50
ID (mA)
-2.5
TA=125ºC
TA=25ºC
TA=-40ºC
100
0
-3.0
0
-2.4
200
150
0
0.3
ID (A)
1
On-Resistance (:)
0
ID (mA)
Transconductance vs Drain Current
(VDS=10V)
:
On-Resistance (:)
0.25
ID (A)
20
VGS=-0.5
VGS=-1
VGS=-1.5
VGS=-2
0.30
GFS (m)
0.35
On-Resistance vs. Drain Current
(VGS=0V)
150
Limited by
Device RDS(on)
0.01
100
50
0.001
0
0
5
10
15
VDS (V)
20
25
30
1
10
100
1000
VDS (V)
*The Performance data shown in the graphs above is typical of device performance in SOT-223 Package. For guaranteed parameters not indicated in the written
specifications, please contact our application department.
R03
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3
INTEGRATED CIRCUITS DIVISION
CPC3708
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC3708C / CPC3708Z
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC3708C / CPC3708Z
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
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R03
INTEGRATED CIRCUITS DIVISION
CPC3708
MECHANICAL DIMENSIONS
CPC3708Z
2.90 / 3.10
(0.114 / 0.122)
PCB Land Pattern
0.229 / 0.330
(0.009 / 0.013)
1.90
(0.075)
6.705 / 7.290
(0.264 / 0.287)
3.30 / 3.71
(0.130 / 0.146)
1.499 / 1.981
(0.059 / 0.078)
3.20
(0.126)
6.10
(0.24)
Pin 1
0.610 / 0.787
(0.024 / 0.031)
1.90
(0.075)
0.914 MIN
(0.036 MIN)
2.286
(0.090)
6.30 / 6.71
(0.248 / 0.264)
0.020 / 0.102
(0.0008 / 0.004)
0.90
(0.035)
1.549 / 1.803
(0.061 / 0.071)
2.286
(0.090)
0.864 / 1.067
(0.034 / 0.042)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
4.597
(0.181)
CPC3708C
1.626 / 1.829
(0.064 / 0.072)
1.397 / 1.600
(0.055 / 0.063)
R 0.254
(R 0.010)
PCB Land Pattern
1.90
(0.075)
3.937 / 4.242
(0.155 / 0.167)
2.45
(0.096)
1.40
(0.055)
Pin 1
0.889 / 1.194
(0.035 / 0.047)
0.356 / 0.483
(0.014 / 0.019)
0.432 / 0.559
(0.017 / 0.022)
0.356 / 0.432
(0.014 / 0.017)
0.864 / 1.016
(0.034 / 0.040)
4.394 / 4.597
(0.173 / 0.181)
1.118 / 1.270
(0.044 / 0.050)
50º
0.432 / 0.508
(0.017 / 0.020)
5.00
(0.197)
50º
1.90
(0.074)
0.60
(0.024)
TYP 3
2.845 / 2.997
(0.112 / 0.118)
1.422 / 1.575
(0.056 / 0.062)
2.921 / 3.073
(0.115 / 0.121)
R03
45º
2.286 / 2.591
(0.090 / 0.102)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
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5
INTEGRATED CIRCUITS DIVISION
CPC3708
MECHANICAL DIMENSIONS
CPC3708ZTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.08 ± 0.2
(0.476 ± 0.008)
B0=7.42 ± 0.1
(0.292 ± 0.004)
K0=1.88 ± 0.1
(0.074 ± 0.004)
Embossed
Carrier
A0=6.83 ± 0.1
(0.269 ± 0.004)
P=8.03 ± 0.1
(0.316 ± 0.004)
Dimensions
mm
(inches)
Embossment
CPC3708CTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.00 ± 0.3
(0.472 ± 0.012)
B0=4.60 ± 0.1
(0.181 ± 0.004)
K0=1.80 ± 0.1
(0.071 ± 0.004)
Embossed
Carrier
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
A0=4.80 ± 0.1
(0.189 ± 0.004)
P=8.00 ± 0.1
(0.315 ± 0.004)
Embossment
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC3708-R03
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
8/1/2014