CPC1008N

CPC1008N
Single-Pole, Normally Open
4-Pin SOP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
100
150
8
Units
VP
mArms / mADC

Features
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Wave Solderable
• Tape & Reel Version Available
Description
CPC1008N is a miniature, low-voltage, low
on-resistance, single-pole, normally open (1-Form-A)
solid state relay in a 4-Pin SOP package. It uses
IXYS Integrated Circuits Division’s patented, optically
coupled, OptoMOS architecture to provide 1500Vrms
of input/output
isolation.
Using IXYS Integrated Circuits Division’s state of the
art double-molded vertical construction packaging,
the CPC1008N is one of the world’s smallest relays.
It is ideal for replacing larger, less-reliable reed and
electromechanical relays.
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
• Reed Relay Replacement
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate B 13 12 82667 003
Ordering Information
Part #
CPC1008N
CPC1008NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
– Control
1
4
3
2
Load
Load
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-CPC1008N-R10
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toff
1
INTEGRATED CIRCUITS DIVISION
CPC1008N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Ratings Units
100
5
50
1
Input Power Dissipation
70
Total Power Dissipation 1
400
Isolation Voltage, Input to Output (60 Seconds)
1500
Operational Temperature
-40 to +85
Storage Temperature
-40 to +125
1
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Conditions
Symbol
Output Characteristics
Load Current
Continuous 1
IL
Peak
t=10ms
ILPK
On-Resistance 2
IL=150mA
RON
Off-State Leakage Current
VL=100VP
ILEAK
Switching Speeds
ton
Turn-On
IF=5mA, VL=10V
Turn-Off
toff
COUT
Output Capacitance
IF=0mA, VL=50V, f=1MHz
Input Characteristics
Input Control Current to Activate 3
IL=150mA
IF
Input Control Current to Deactivate
IF
Input Voltage Drop
IF=5mA
VF
IR
Reverse Input Current
VR=5V
Common Characteristics
Capacitance, Input to Output
CI/O
1
2
3
2
Min
Typ
Max
Units
-
4.8
-
150
±350
8
1
mArms / mADC
mAP

-
1
0.17
6
2
1
-
0.2
0.9
-
0.45
1.2
-
2
1.4
10
mA
mA
V
µA
-
1
-
pF
µA
ms
pF
Load current derates linearly from 150mA @ 25oC to 120mA @ 85oC.
Measurement taken within 1 second of on time.
For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended.
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INTEGRATED CIRCUITS DIVISION
CPC1008N
PERFORMANCE DATA (@ 25ºC Unless Otherwise Specified)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
15
10
5
15
10
5
0
0
1.250
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
Typical IF for Switch Operation
(N=50, IL=100mA)
5
0
0.40
0.42 0.45 0.47
LED Current (mA)
0.50
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
1.0
-40
-20
20
40
60
Temperature (ºC)
80
5
5.4
106
5.6
109
112 115 118 121
Blocking Voltage (VP)
124
Typical Turn-Off Time
vs. LED Forward Current
2.5
0.25
2.0
0.20
1.5
1.0
0.5
0.15
0.10
0.05
0.00
0
100
Typical IF for Switch Operation
vs. Temperature
(IL=120mA)
1.0
4.8
5.0
5.2
On-Resistance (:)
0.0
0
10
0
4.6
Turn-Off Time (ms)
1.3
15
Typical Turn-On Time
vs. LED Forward Current
Turn-On Time (ms)
LED Forward Voltage (V)
20
5
4.4
1.6
1.1
Typical Blocking Voltage Distribution
(N=50)
10
Typical LED Forward Voltage Drop
vs. Temperature
1.4
5
0.166 0.168 0.170 0.172 0.174 0.176 0.178
Turn-Off Time (ms)
15
0.53
1.5
10
1.15
0
0.38
1.2
0.95 1.00 1.05 1.10
Turn-On Time (ms)
Device Count (N)
Device Count (N)
Device Count (N)
10
0.90
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=150mA)
20
15
15
0
0.85
1.275
20
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
20
Device Count (N)
20
20
Device Count (N)
Device Count (N)
25
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
10
20
30
LED Current (mA)
40
50
0
10
20
30
LED Current (mA)
40
50
Typical Turn-Off Time
vs. Temperature
Typical Turn-On Time
vs. Temperature
1.0
1.6
0.6
0.4
0.2
1.2
Turn-Off Time (ms)
0.8
Turn-On Time (ms)
LED Current (mA)
1.4
IF=5mA
1.0
0.8
0.6
IF=10mA
0.4
0.8
IF=10mA
IF=5mA
0.6
0.4
0.2
0.2
0.0
0.0
0.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R10
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3
INTEGRATED CIRCUITS DIVISION
CPC1008N
PERFORMANCE DATA (@ 25ºC Unless Otherwise Specified)*
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=120mA)
10
Typical Load Current
vs. Load Voltage
(IF=2mA)
200
Maximum Load Current
vs. Temperature
(IF=5mA)
160
6
4
2
Load Current (mA)
8
Load Current (mA)
On-Resistance (:)
150
100
50
0
-50
-100
-40
-20
0
20
40
60
Temperature (ºC)
80
-200
-1.0
100
20
116
114
112
-0.5
0.0
0.5
Load Voltage (V)
15
10
0
108
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance
vs. Load Voltage
(IF=2mA, f=1MHz)
50
5
110
120
100
1.0
Output Capacitnace (pF)
118
Leakage (nA)
Blocking Voltage (VP)
25
130
Typical Leakage vs. Temperature
(VL=100V)
Typical Blocking Voltage
vs. Temperature
120
140
110
-150
0
150
40
30
20
10
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
20
40
60
Load Voltage (V)
80
100
Energy Rating Curve
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time (s)
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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INTEGRATED CIRCUITS DIVISION
CPC1008N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1008N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1008N
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R10
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5
INTEGRATED CIRCUITS DIVISION
CPC1008N
MECHANICAL DIMENSIONS
CPC1008N
4.089 ± 0.203
(0.161 ± 0.008)
Recommended PCB Land Pattern
0.200 ± 0.025
(0.008 ± 0.001)
0.60
(0.0217)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
5.60
(0.2205)
1.02 ± 0.025
(0.040 ± 0.001)
Pin 1
2.54 Typ
(0.100 Typ)
1.30
(0.0512)
2.184 Max
(0.086 Max)
2.54
(0.10)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
0.381 TYP.
(0.015 TYP.)
CPC1008NTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=12.00
(0.472)
B0=4.70
(0.185)
K0=2.70
(0.106)
K1=2.30
(0.091)
P=8.00
(0.315)
A0=6.50
(0.256)
User Direction of Feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1008N-R10
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
8/18/2014