CPC1333

CPC1333
Single-Pole Normally Closed
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Peak Blocking Voltage
Load Current
On-Resistance (max)
Isolation Voltage, Input to Output
Ratings
350
Units
VP
130
30
5000
mArms / mADC

Vrms
Features
•
•
•
•
•
•
•
•
5000Vrms Input/Output Isolation
350VP Blocking Voltage
100% Solid State
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 4-Pin Package
Machine Insertable, Wave Solderable
Description
The CPC1333G is a single-pole, normally closed
(1-Form-B) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• Certified to EN 60950-1: 2006
TUV Certificate B 09 07 49410 004
Ordering Information
Applications
• Telephony Switching
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part Number
CPC1333G
CPC1333GR
CPC1333GRTR
Description
4-Pin DIP (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control
– Control
1
4
2
3
Load
Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
toff
Pb
DS-CPC1333-R02
ton
e3
www.ixysic.com
1
INTEGRATED CIRCUITS DIVISION
CPC1333
Absolute Maximum Ratings @ 25ºC
Parameter
Peak Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
Maximum Soldering Temperature (10 Seconds)
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 3.00 mW / ºC
Ratings
350
5
50
1
100
550
5000
8
-40 to +85
-40 to +125
260
Units
VP
V
mA
A
mW
mW
Vrms
kV
ºC
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous
Peak
On-Resistance 1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 2
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
IL
-
-
130
t=10ms
IL=130mA
IF=2mA, VL=350V
ILPK
RON
ILEAK
-
25
-
±350
30
1
mArms / mADC
mAP

IF=2mA, VL=50V, f=1MHz
ton
toff
COUT
-
6
2
3
-
IL=130mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.18
1.26
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
1
Measurement taken within one second of on-time.
2
For high temperature operation (> 60ºC), IXYS Integrated Circuits Division recommends a LED IF ≥ 5mA.
A
ms
pF
CPC1333G Isolation Test Circuit
1
4
2
3
6kVrms
2
Test Conditions:
Voltage Ramp:
Test Time:
Leakage Current Threshold:
Test Voltage:
www.ixysic.com
2V/s
2 Seconds
50A
6kVrms
R02
INTEGRATED CIRCUITS DIVISION
CPC1333
PERFORMANCE DATA*
15
10
5
15
10
5
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
Typical IF for Switch Operation
(N=50, IL=130mA, TA=25ºC)
25
Device Count (N)
15
10
5
0
0.28 0.30 0.32 0.34
Turn-On Time (ms)
0.14
0.16
0.18
0.20
LED Current (mA)
25
10
5
1.6
Typical Turn-On Time
vs. LED Forward Current
(IL=60mA, TA=25ºC)
2.0
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
336
334
332
330
328
324
20
40
60
Temperature (ºC)
80
100
10
20
30
LED Current (mA)
40
Turn-Off Time (Ps)
LED Current (mA)
Turn-On Time (Ps)
0
20
40
60
Temperature (ºC)
80
100
1000
750
500
400
IF=10mA
IF=5mA
IF=2mA
300
200
0
-40
-20
0
20
40
60
Temperature (ºC)
10
80
100
20
30
LED Current (mA)
40
50
Typical Turn-Off Time
vs. Temperature
(IL=60mA)
2500
100
-20
Typical Turn-Off Time
vs. LED Forward Current
(IL=60mA, TA=25ºC)
0
500
0.5
460 470
1250
50
Typical Turn-On Time
vs. Temperature
(IL=60mA)
600
1.0
410 420 430 440 450
Blocking Voltage (VP)
0
0
Typical IF for Switch Operation
vs. Temperature
(IL=60mA)
1.5
0.0
-40
5
250
326
0
10
1500
Turn-Off Time (Ps)
Turn-On Time (Ps)
1.3
-20
15
400
338
1.4
1.0
-40
20
0
340
1.5
1.1
Typical Blocking Voltage Distribution
(N=50, IF=2mA, TA=25ºC)
23.75 24.50 25.25 26.00 26.75 27.50 28.25
On-Resistance (:)
Typical LED Forward Voltage Drop
vs. Temperature
1.2
5
0.295 0.305 0.315 0.325 0.335 0.345 0.355
Turn-Off Time (ms)
15
0.22
10
0.36
0
0.12
LED Forward Voltage (V)
0.26
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=130mA, TA=25ºC)
20
20
15
0
0.24
1.275
Device Count (N)
1.250
Device Count (N)
20
0
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=60mA, TA=25ºC)
20
Device Count (N)
20
Typical Turn-On Time
(N=50, IF=5mA, IL=60mA, TA=25ºC)
25
Device Count (N)
Device Count (N)
25
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
2000
IF=2mA
IF=5mA
IF=10mA
1500
1000
500
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
CPC1333
PERFORMANCE DATA*
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=60mA)
0.15
35
30
25
0.05
0.00
-0.05
-0.10
-20
0
20
40
60
Temperature (ºC)
80
500
460
400
Leakage (nA)
Blocking Voltage (VP)
Typical Blocking Voltage
vs. Temperature
465
455
450
445
440
-40
-3
-2
-1
0
1
Load Voltage (V)
2
3
0
20
40
60
Temperature (ºC)
80
70
200
Load Current (A)
1.0
50
-40
Typical Leakage vs. Temperature
Measured Between Pins 3 & 4
(IF=2mA, VL=350V)
300
0
-40
100
75
4
100
-20
100
0
-4
100
125
25
-0.15
Output Capacitance (pF)
20
-40
Load Current (mA)
40
Maximum Load Current
vs. Temperature
(IF=0mA)
150
0.10
Load Current (A)
On-Resistance (:)
45
Typical Load Current
vs. Load Voltage
(IF=0mA, TA=25ºC)
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
(IF=2mA, f=1MHz, TA=25ºC)
60
50
40
30
20
10
0
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0.1
1
10
100
Load Voltage (V)
1000
Energy Rating Curve
(TA=25ºC)
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
www.ixysic.com
R02
INTEGRATED CIRCUITS DIVISION
CPC1333
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1333G / CPC1333GR
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1333G / CPC1333GR
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R02
e3
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
CPC1333
Mechanical Dimensions
CPC1333G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1333GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
9º ± 1º
(ALL)
2.287
(0.09)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
0.254
(0.010)
0.95
(0.037)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
6
0.102 min / 0.254 max
(0.004 min / 0.010 max)
www.ixysic.com
Dimensions
mm
(inches)
R02
INTEGRATED CIRCUITS DIVISION
CPC1333
CPC1333GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P=12.00
(0.472)
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC1333-R02
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012