Device Material Content

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
2.50%
0.0197
Mold
37.02%
0.292
D/A Epoxy
0.29%
0.77%
0.0061
Solder Balls
30.38%
0.2397
Foil
22.77%
6.27%
with SnPb Solder Balls
MSL: 3
Peak Reflow Temp: 225°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 5.05 x 4.41 mm
29.06%
5.18%
0.37%
0.93%
0.37%
0.93%
0.19%
0.229
0.0409
0.0029
0.0073
0.0029
0.0073
0.0015
Silica (Fused or Amorphous)
Epoxy/Phenol Resin
Brominated Epoxy Resin
Antimony Trioxide
Antimony Pentoxide
Siloxanes
Carbon Black
60676-86-0
68928-70-1
1309-64-4
1314-60-9
1333-86-4
0.23%
0.06%
0.0018
0.0005
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
65 to 95% Silica (LSC uses 78.5% in our calculation)
5 to 22% Epoxy/Phenol Resin (LSC uses 14% in our calculation)
0 to 2% Brominated Epoxy Resin (LSC uses 1% in our calculation)
0 to 5% Antimony Trioxide (LSC uses 2.5% in our calculation)
0 to 1.5% Antimony Pentoxide (LSC uses 1% in our calculation)
0 to 5% Siloxanes (LSC uses 2.5% in our calculation)
0 to 1% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm
0.0023
Wire
Substrate
208 fpBGA
0.79
Grams
19.14%
11.24%
0.1510
0.0887
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Solder ball composition Sn63/Pb37
15.48%
7.29%
0.1222
0.0575
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.1796
0.0495
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4