PulseGuard ® Suppressors Surface Mount Polymeric ESD Suppressors PGB Series 0603 ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394 and InfiniBandSM can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883C). Features • Ultra-low capacitance • Low leakage current • Fast response time • Single line of protection • Bi-directional • Withstands multiple ESD strikes • Standard EIA SOCM-1608 package • Compatible with pick-and-place processes • Available in 1,000 and 5,000 piece reels (EIA-RS481) Reference Dimensions: 1.60 (.063") 0.076 (.003") MIN 1.04 (.041") REF 0.787 (.031") Typical Applications • • • • • • Servers Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage 0.254 (.010") MIN 0.356 (.014") Wave Solder Reflow Solder 0.508 (.020") 0.762 (.030") 3.30 (1.30") 3.05 (1.20") Ordering Information 1.27 (.050") CATALOG NUMBER PIECES PER REEL PGB0010603MR 1,000 PGB0010603NR 5,000 1.27 (.050") 0.762 (.030") Equivalent Circuit 1 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 208 0.762 (.030") w w w. l i t t e l f u s e . c o m 2 PulseGuard ® Suppressors Surface Mount Polymeric ESD Suppressors PGB Series 0603 ESD Suppressor Electrical Characteristics Capacitance vs. Frequency ESD Capability: IEC 61000-4-2 Direct Discharge ....................................................8kV IEC 61000-4-2 Air Discharge .......................................................15kV Trigger Voltage1 ...................................................................1,000V, typical Clamping Voltage1 ..................................................................150V, typical Rated Voltage ........................................................................24VDC, max Capacitance2 ................................................................................0.055 pF Response Time1 ...............................................................................< 1 ns Leakage Current3 ..............................................................................< 1nA ESD Pulse Withstand4 ...........................................1,000 pulses, minimum ** Note: 1,000 fF = 1 pF Capacitance (fF) 70 60 50 4 0.5 Notes: 1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct discharge method. 2. Capacitance measured at 1MHZ. 3. Leakage current measured at 6VDC. 4. Pulse Withstand- some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate. 1.0 1.5 PULSEGUARD® SUPPRESSORS 40 2.0 Frequency (GHz) Carrier Tape Specifications Parts are delivered on 7” (178mm) reel, paper carrier tape Environmental Specifications Tt Operating Temperature: -65°C to +125°C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85°C, 1000hrs. Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, 1 min. cycle, 2grs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer) Solder leach resistance and terminal adhesion: Per EIA-576 test Ds Dd + + + + Tw Pd + Ct + + Ps + Ph Pw Physical Specifications Materials: Body: Glass Epoxy Terminations: Copper/Nickel/Tin/Lead Solderability: DESCRIPTION MIL-STD-202, Method 208 (95% coverage) MEASUREMENT (MM) Soldering Parameters: Ct - Cover tape thickness 0.06 Wave Solder – 260°C, 10 seconds maximum. Reflow Solder – 260°C, 30 seconds maximum. Dd - Drive hole diameter 1.50 Ds - Drive hole spacing 4.00 Packaging Specifications Pd - Pocket depth 0.58 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR. Ph - Pocket height 1.85 Ps - Pocket spacing 4.00 Pw - Pocket width 1.02 Tt - Carrier tape thickness 0.65 Tw - Carrier tape width 8.00 w w w. l i t t e l f u s e . c o m 209