Enhanced ESD Protection for High Speed USB 3.0 and HDMI

SP3012-06UTG Low Capacitance TVS Diode Array
Enhanced ESD
Protection for High
Speed USB 3.0
and HDMI Chipsets
Unique electrostatic discharge (ESD)
protection with 66% greater clamping
performance now available in a 6-channel,
compact package unmatched in the industry
SP3012-06UTG offers extremely low dynamic resistance, which
provides a low clamping voltage to ensure chipset reliability. It
provides 6 channels of superior ESD protection with an ultra-low
capacitance, making it ideal for high speed applications such as
HDMI 1.3/1.4 and USB 3.0. Superior performance in the small
uDFN-14 package yields an industry-best size/performance ratio.
DataSheet
Design Guide
Samples
Applications
• Handheld - Smartphones, Tablets, Digital Cameras
• Computing - Notebooks/Ultrabooks, Desktops, Servers, HDD
• Entertainment - LCD/PDP TVs, Set Top Boxes, Blu-ray Players,
MP3/PMP Players
SP3012-06UTG Low Capacitance TVS Diode Array
Enhanced ESD protection for high speed USB 3.0 and
HDMI chipsets with up to 66% greater clamping performance
Features
Benefits
• Ultra-low capacitance of 0.5pF
• Market-leading dynamic
resistance of 0.4Ω
• ESD, IEC61000-4-2, ±12kV contact
discharge, ±25kV air discharge
• Small form factor μDFN-14 package
(3.5 x 1.35 x 0.5mm) allows straightthrough routing
• Minimizes signal degradation to preserve system
performance while providing robust ESD protection;
reduces designer’s dependency on accurate trace
impedance simulators
• Extremely low dynamic resistance provides 66%
better clamping performance than competitive
devices, ensuring chipset reliability
• Allows manufacturers to claim ESD protection above
the maximum rating in the IEC standard and ensures
product reliability in the field
• Reduces PCB footprint by 50% compared to other
fully integrated, six-channel protection devices;
allows the PCB traces to run directly underneath the
device, minimizing trace discontinuities
Low capacitance for higher signal integrity
Added capacitance, even at small levels, can cause signal
degradation in high-speed applications. Eye-diagram testing,
which involves repetitively sampling a digital signal and
displaying the resulting eye pattern on an oscilloscope, is one
way to characterize the effect of an ESD suppressor’s parasitic
capacitance on signal integrity. A mask defines acceptable signal
qualities and compliance, and in this case, demonstrates the
SP3012-06UTG’s minimal impact on signal integrity.
ESD protection for HDMI 1.3/1.4 and USB 3.0 chipsets
The SP3012-06UTG delivers enhanced ESD protection with ultralow capacitance. Its extremely low dynamic resistance provides
a clamping voltage that is 66% lower than competitive devices.
The SP3012 is ideal for protecting high-speed applications,
ensuring greater chipset reliability.
Dramatic reduction in transient energy passed
The clamping performance waveform shows the dramatic
improvement made possible when a competitive diode array is
replaced by a SP3012-06UTG. The area between the two curves
indicates how much transient energy did not reach the chipset
protected by the SP3012; this reduction in transient energy allows
sensitive, small geometry chipsets to survive severe ESD events.
Eye-diagram created using a 5Gbps USB 3.0
compliance test pattern & mask
250
Littelfuse Silicon
Competitive Silicon
200
Voltage (V)
46V @ 25ns
Compact PCB footprint
15V @ 25ns
150
150
50
0
0
10
20
30
40
50
60
70
80
90
Time (ns)
Waveform resulting from an 8kV contact discharge (per IEC 61000-4-2)
© 2013 Littelfuse • SP3012-06UTG Low Capacitance TVS Diode Array
100
The SP3012-06UTG has a small
form factor μDFN-14 package
with straight-through routing.
Its PCB footprint is less than half
the size of other fully integrated,
6-channel protection devices.
PCB traces can run directly
underneath it, minimizing trace
discontinuities.
USB Port
USB Controller
VBUS
SSTX+
SSTX-
Outside
World
IC
SSRX+
SSRXGND
SP3012
D+
D*Package is shown as transparent
Case GND
Signal GND
EC121Nv0513