TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5002 Series SP5002 Series 6 Channel Common Mode Filter with ESD Protection RoHS Pb GREEN Description The SP5002 Series can protect and filter three differential line pairs in a small RoHS-compliant TDFN-16 package, with cost and space savings over discrete solutions. Pinout Features I n 1+ 1 16 Out 1+ I n 1- 2 15 Out 1- GND 3 14 GND I n 2+ 4 13 Out 2+ I n 2- 5 12 Out 2- GND 6 11 GND I n 3+ 7 I n 3- • Large differential bandwidth > 2GHz • High Common Mode Stop Band Attenuation: > 25 dB at 700 MHz > 30 dB at 800 MHz • ±15kV ESD protection per channel (IEC 610004-2 Level 4, contact discharge) 10 Out 3+ 9 Out 3- 8 Note :This drawing is not to scale. Functional Block Diagram External (Connector) Applications Pin1 Pin16 Pin2 Pin15 Pin4 Pin13 Pin5 Pin12 Pin7 Pin10 Pin8 Pin9 Pin3, Pin14 Pin6, Pin11 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 • MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still Cameras Internal (ASIC) • TDFN-16 4.00mm × 2.00mm × 0.75mm package with 0.50mm lead pitch • RoHS-compliant, Leadfree packaging • AEC-Q101 qualified SP5002 The SP5002 Series is a highly integrated Common Mode Filter (CMF) providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5002 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Value Units IDC DC Current Per Line 100 mA Storage Temperature Range PDC DC Package Power Rating 0.5 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions RCH Pins 1−10, 2−9, 4−7 and 5−6 8.0 Total Channel Capacitance CTOTAL VI/O = 1.65VDC Reverse Bias; f=1MHz, 30mVAC 0.8 Reverse Standoff Voltage VRWM Channel Resistance Min Typ Max Units Ω 1.3 pF 5.0 V Breakdown Voltage VBR IT=1mA 6.0 8.0 10.0 V Forward Voltage at IF VF IF=1mA 0.4 0.7 1.5 V Reverse Leakage Current ILEAK VI/O=3.3V 0.01 0.10 µA Positive (tp=8/20µs) 1.3 Dynamic Resistance2 3 RDYN Negative (tp=8/20µs) 0.7 TLP, tp=100ns, I/O to GND Ω 0.36 IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 2 VESD Differential Mode Cutoff Frequency2 F3dB ZSOURCE=50 Ω, ZLOAD50 Ω 2.0 GHz Fα f=800MHz 30 dB Common Mode Stop Band Attenuation2 Notes: 1 ESD zapping at I/O pins (1,2,4,5,7,8) with respect to GND. 2 Guaranteed by design. 3 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Differential Mode Attenuation SDD21 vs. Frequency (Zdiff = 100Ω) Common Mode Attenuation SCC21 vs. Frequency (Zcomm= 50Ω) 0 0 -0.5 -5 -1 -10 Insertion Loss(dB) Inseron Loss(dB) -1.5 -2 -2.5 -3 -3.5 -15 -20 -25 -30 -4 -35 -4.5 -5 -40 1 10 100 Frequency (MHz) 1000 1 10 100 Frequency (MHz) 1000 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5002 Series 0 0 -5 -5 -10 -10 -15 -15 -20 -25 -20 -25 -30 -30 -35 -35 -40 SP5002 Differential Return Loss SDD22 vs. Frequency (Zdiff = 100Ω) Return Loss(dB) Return Loss(dB) Differential Return Loss SDD11 vs. Frequency (Zdiff = 100Ω) -40 1 10 100 Frequency (MHz) 1000 1 10 100 Frequency (MHz) 1000 Transmission Line Pulsing (TLP) Plot 22 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 TLP Voltage (V) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 217°C Peak Temperature (TP) tP TP Temperature Reflow Condition 25 tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5002 Series Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy 3. Dimensions are exclusive of mold flash & metal burr. Flammability UL 94 V-0 5. Package surface matte finish VDI 11-13. Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Ordering Information Part Number Package Size Marking Min. Order Qty. SP5002-06TTG TDFN-16 4.0x2.0mm C33**** 3000 Part Marking System Part Numbering System SP 5002 – 06 T T G TVS Diode Arrays (SPA® Diodes ) C33 **** G= Green T= Tape & Reel Series Product Series C33 = SP5002 Package Number of Channels TDFN-16 (4.0x2.0mm) 06 = 6 Channel TDFN-16 Date Code (Year / Week) Package Dimensions — TDFN-16 D A B L 2X 0.10 C TDFN-16 L JEDEC MO-229 L1 Millimeters E PIN 1 REFERENCE ALTERNATE TERMINAL CONSTRUCTIONS 2X 0.10 C TOP VIEW EXPOSED Cu Max Min Max A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.00 0.002 A1 C SIDE VIEW DETAIL A 0.15 0.25 0.008 REF 0.006 0.010 4.00 BSC 0.157 BSC DETAIL B E 2.00 BSC 0.079 BSC ALTERNATE CONSTRUCTIONS e 0.50 BSC 0.020 BSC A1 0.05 C 0.20 REF D A3 A 1 A3 b DETAIL B 0.05 C A3 MOLD CMPD Inches Min DETAIL A L 0.70 0.90 0.028 L1 0.05 0.15 0.002 0.035 0.006 8 12X L 0.10 MIN 16 e e/2 9 14X b 0.10 M C A B 0.05 M C BOTTOM VIEW © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14