TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1007 Series SP1007 Series 3.5pF 8kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1007 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 0201 Flipchip 1 2 • ESD, IEC61000-4-2, ±8kV contact, ±15kV air • Low capacitance of 5pF (TYP @ VR=5V) • EFT, IEC61000-4-4, 40A (5/50ns) • Low leakage current of 0.1μA at 5V • Lightning, IEC61000-4-5, 2A (tP=8/20μs) • Space efficient 0201 and 0402 footprint SOD882 Applications 1 2 • Mobile Phones • MP3/PMP • Smart Phones • Camcorders • Portable Navigation Devices • Portable Medical • Tablets • Digital Cameras • Point of Sale Terminals Functional Block Diagram Application Example 2 1 I/O Controller Keypads P1 Additional Information P2 Outside World Datasheet Resources P3 IC P4 SP1007 (x4) Samples GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1007 Series Absolute Maximum Ratings Symbol Parameter Value Units 2.0 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Rating Units –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 6.0 V Breakdown Voltage VBR IR=1mA 8.5 9.5 V Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 0.5 μA IPP=1A, tp=8/20µs, Fwd 11.2 V IPP=2A, tp=8/20µs, Fwd 13.1 V (VC2 - VC1) / (IPP2 - IPP1) 1.9 Ω Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance 1 IEC61000-4-2 (Contact Discharge) ±8 kV IEC61000-4-2 (Air Discharge) ±15 kV CD Note: Parameter is guaranteed by design and/or device characterization. 1 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 Reverse Bias=0V 5 6 pF TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1007 Series Capacitance vs. Reverse Bias Pulse Waveform 7.0 110% 100% 6.0 90% SP1007-01ETG 80% Percent of IPP Capacitance (pF) 5.0 4.0 SP1007-01WTG 3.0 2.0 70% 60% 50% 40% 30% 20% 1.0 10% 0% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 5.0 10.0 Insertion Loss (S21) I/O to GND -5 Attenuation (dB) -10 -15 -20 -25 -30 -35 -40 25.0 30.0 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. -45 100 20.0 Product Characteristics of SOD-882 Package 0 10 15.0 Time (μs) Bias Voltage (V) 1000 Frequency (MHz) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time °C Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1007 Series Part Numbering System Ordering Information SP 1007 – 01 x T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Part Number Package Marking Min. Order Qty. SP1007-01WTG 0201 Flipchip •• 10,000 SP1007-01ETG SOD882 •b 10,000 Series Package W: 0201 Flipchip E: SOD882 Number of Channels Part Marking System b SP1007-01ETG SP1007-01WTG Package Dimensions — 0201 Flip Chip A 0201 Flipchip Symbol B F D E D Inches Min Typ Max Min Typ Max A 0.595 0.620 0.645 0.0234 0.0244 0.0254 B 0.295 0.320 0.345 0.0116 0.0126 0.0136 C 0.245 0.275 0.305 0.0096 0.0108 0.0120 C G Millimeters D 0.145 0.150 0.155 0.0057 0.0059 0.0061 E 0.245 0.250 0.255 0.0096 0.0098 0.0100 F 0.245 0.250 0.255 0.0096 0.0098 0.0100 G 0.005 0.010 0.015 0.0002 0.0004 0.0006 Package Dimensions — SOD882 Symbol 0.325 0.325 0.650 0.650 0.975 Recommended Soldering Pad Layout © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 Package SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1007 Series Embossed Carrier Tape & Reel Specification — 0201 Flipchip P1 P2 D P0 0.30 E 0.28 F W 0.75 0.19 D1 T *Sizes in mm A0 K0 B0 Recommended Solder Pad Footprint Symbol Millimeters A0 0.41±0.03 B0 0.70±0.03 D ø 1.50 + 0.10 D1 ø 0.20 ± 0.05 E 1.75±0.10 F 3.50±0.05 K0 0.38±0.03 P0 2.00±0.05 P1 2.00±0.05 P2 4.00±0.10 W 8.00 + 0.30 -0.10 T 0.23±0.02 Embossed Carrier Tape & Reel Specification — SOD882 D evice Orientation in Tape Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10 Pin 1 Location © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15