Q2L Series - 3.3x3.3 QFN

SIDACtor ® Protection Thyristors
Broadband Optimized™ Protection
Q2L Series - 3.3x3.3 QFN
Pb e3
RoHS
Description
Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor®
devices designed to protect high density broadband equipment from damaging overvoltage transients.
The series provides a low profile, chip scale surface mount
solution that enables broadband equipment to comply
with global regulatory standards while limiting the impact
to broadband signals and board space.
Features and Benefits
•
•
•
•
•
•
Agency Approvals
Agency
Agency File Number
E133083
Pinout Designation
•F
ails short circuit when
surged in excess of ratings
•2
nd level interconnect is
Pb-free per IPC/JEDEC
J-STD-609A.01
Low profile
Small footprint
Low capacitance
Low voltage overshoot
Low on-state voltage
Does not degrade surge
capability after multiple
surge events within limit.
Applicable Global Standards
Not Applicable
Schematic Symbol
• TIA-968-A
• GR 1089 Intra-building
• TIA-968-B
• IEC 61000-4-5
• ITU K.20/21 Enhanced
Level
• YD/T 1082
• ITU K.20/21 Basic Level
• YD/T 950
• YD/T 993
• GR 1089 Inter-building
Electrical Characteristics
Part Number
P0080Q22CLRP
P0300Q22CLRP
P0640Q22CLRP
P0720Q22CLRP
P0900Q22CLRP
P1100Q22CLRP
P1300Q22CLRP
P1500Q22CLRP
P1800Q22CLRP
P2300Q22CLRP
P2600Q22CLRP
P3100Q22CLRP
P3500Q22CLRP
P4500Q22CLRP
Marking
P-8C
P03C
P06C
P07C
P09C
P11C
P13C
P15C
P18C
P23C
P26C
P31C
P35C
P45C
VDRM
VS
@lDRM=5µA
@100V/µs
V min
V max
6
25
58
65
75
90
120
140
170
190
220
275
320
400
25
40
77
88
98
130
160
180
220
260
300
350
400
530
IH
IS
mA min mA max
50
50
150
150
150
150
150
150
150
150
150
150
150
150
800
800
800
800
800
800
800
800
800
800
800
800
800
800
Capacitance
@1MHz, 2V bias
IT
[email protected] = 2.2 Amps
A max
V max
pF min
pF max
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
5
5
5
5
5
5
5
5
5
5
5
5
5
5
35
25
55
50
45
45
40
35
35
30
30
30
25
25
75
45
85
75
70
70
60
55
50
50
45
45
40
45
Notes:
- Absolute maximum ratings measured at TA= 25ºC (unless otherwise noted).
- Devices are bi-directional (unless otherwise noted).
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/11/14
Q2L Series - 3.3x3.3 QFN
SIDACtor ® Protection Thyristors
Broadband Optimized™ Protection
Series
Surge Ratings
C
ITSM
50/60 Hz
di/dt
A min
A min
A/µs max
200 3
30
500
2x10 1
2x10 2
8x20 1
1.2x50 2
10x160 1
10x160 2
10x560 1
10x560 2
10x1000 1
10x1000 2
5x310 1
10x700 2
A min
A min
A min
A min
A min
500
400
200
150
100
- Peak pulse current rating (IPP) is repetitive and guaranteed for the life of the product.
- IPP ratings applicable over temperature range of -40ºC to +85ºC
- The device must initially be in thermal equilibrium with -40°C < TJ < +150°C
Notes:
1 Current waveform in µs
2 Voltage waveform in µs
3 for surge rating of P4500Q22CLRP 10x700µs min=150A & typical=180A
Thermal Considerations
Package
Symbol
Parameter
Value
Unit
3.3 x 3.3 QFN
TJ
Operating Junction Temperature Range
-40 to +150
°C
TS
Storage Temperature Range
-65 to +150
°C
R0JA
Thermal Resistance: Junction to Ambient
120
°C/W
V-I Characteristics
tr x td Pulse Waveform
IPP – Peak Pulse Current – %IPP
+I
IT
IS
IH
IDRM
-V
+V
VT
VDRM
VS
tr = rise time to peak value
td = decay time to half value
Peak
Value
100
Waveform = tr x td
50
Half Value
0
td
tr
0
t – Time (µs)
-I
Normalized DC Holding Current vs. Case Temperature
10
IH
8
6
25 °C
4
IH (TC = 25ºC)
2.0
14
12
Ratio of
Percent of VS Change – %
Normalized VS Change vs. Junction Temperature
2
0
-4
-6
1.8
1.6
1.4
1.0
0.8
0.6
0.4
-8
-40 -20
0
-40
20 40 60 80 100 120 140 160
-20
0
20
40
60
80
100 120 140
160
Case Temperature (TC) - ºC
Junction Temperature (TJ) – °C
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/07/14
25°C
1.2
2
Q2L Series - 3.3x3.3 QFN
SIDACtor ® Protection Thyristors
Broadband Optimized™ Protection
Soldering Parameters
Pb-Free assembly
(see Fig. 1)
+150°C
+200°C
60-180 secs.
- Temperature Min (Ts(min))
- Temperature Max (Ts(max))
Pre Heat
- Time (Min to Max) (ts)
Average ramp up rate (Liquidus Temp (TL)
to peak)
3°C/sec. Max.
TS(max) to TL - Ramp-up Rate
3°C/sec. Max.
Reflow
- Temperature (TL) (Liquidus)
+217°C
- Temperature (tL)
60-150 secs.
Peak Temp (TP)
+260(+0/-5)°C
Time within 5°C of actual Peak Temp (tp)
30 secs. Max.
Ramp-down Rate
6°C/sec. Max.
Time 25°C to Peak Temp (TP)
8 min. Max.
Do not exceed
+260°C
Figure 1
TL
TS(max)
tL
Ramp-down
Preheat
TS(min)
tS
25
time to peak temperature
(t 25ºC to peak)
100% Matte-Tin Plated
Body Material
UL recognized epoxy meeting flammability
classification 94V-0
Time
Environmental Specifications
High Temp Voltage
Blocking
80% Rated VDRM (VAC Peak ) +125°C or +150°C,
504 or 1008 hrs. MIL-STD-750 (Method 1040)
JEDEC, JESD22-A-101
Temp Cycling
-65°C to +150°C, 15 min. dwell, 10 up to 100
cycles. MIL-STD-750 (Method 1051) EIA/JEDEC,
JESD22-A104
Biased Temp &
Humidity
52 VDC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/
JEDEC, JESD22-A-101
High Temp Storage
+150°C 1008 hrs. MIL-STD-750 (Method 1031)
JEDEC, JESD22-A-101
Low Temp Storage
-65°C, 1008 hrs.
Thermal Shock
0°C to +100°C, 5 min. dwell, 10 sec. transfer,
10 cycles. MIL-STD-750 (Method 1056) JEDEC,
JESD22-A-106
Resistance to Solder
Heat
+260°C, 30 secs. MIL-STD-750 (Method 2031)
Moisture Sensitivity
Level
85%RH, +85°C, 168 hrs., 3 reflow cycles
(+260°C Peak). JEDEC-J-STD-020, Level 1
Copper Alloy
Terminal Finish
Critical Zone
TL to TP
Ramp-up
Physical Specifications
Lead Material
tP
TP
Temperature
Reflow Condition
Can be A or B
Dimensions — 3.3x3.3 QFN
BOTTOM VIEW
TOP VIEW
Dimensions
C
A
E
J
B
END VIEW
A
B
C
E
F
H
J
K1
K2
M1
M2
N1
N2
F
H
1.50
(.059”)
SIDE VIEW
2.54
(.100”)
1.27
(.050”)
N2
N1
M1
K1
M2
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/07/14
K2
Recommended
Soldering Pad Outline
(Reference Only)
3
Inches
Millimeters
Min
Max
Min
Max
0.126
0.126
0.075
0.011
0.088
0.035
0.000
0.004
0.004
0.063
0.045
0.095
0.082
0.134
0.134
0.083
0.019
0.096
0.043
0.008
0.012
0.012
0.071
0.053
0.103
0.090
3.200
3.200
1.900
0.285
2.230
0.900
0.000
0.100
0.100
1.610
1.153
2.420
2.080
3.400
3.400
2.100
0.485
2.430
1.100
0.200
0.300
0.300
1.810
1.353
2.620
2.280
Q2L Series - 3.3x3.3 QFN
SIDACtor ® Protection Thyristors
Broadband Optimized™ Protection
Part Numbering
Part Marking
P xxx 0 Q22 C L RP
Terminals on Back
TYPE
P=SIDACtor
REEL PACK
MEDIAN VOLTAGE
RoHS COMPLIANT
CONSTRUCTION
VARIABLE
IPP RATING
XXXX
XXXXX
Part Marking Code
(Refer to Electrical Characteristics Table)
Date code
PACKAGE TYPE
Packing Options
Package Type
Description
Quantity
Added Suffix
Industry Standard
Q22
3.3x3.3 QFN Tape and Reel Pack
5000
RP
EIA-481-D
Tape and Reel Specifications — 3.3x3.3 QFN
Reel Dimension
C
A
D
N
W1
B
Tape Leader and Trailer Dimensions
END
CARRIER TAPE
START
COVER TAPE
Symbols
Description
A
B
C
D
N
W1
A0
B0
D0
D1
E1
E2
Reel Diameter
Drive Spoke Width
Arbor Hole Diameter
Drive Spoke Diameter
Hub Diameter
Reel Inner Width at Hub
Pocket Width at Bottom
Pocket Length at Bottom
Feed Hole Diameter
Pocket Hole Diameter
Feed Hole Position 1
Feed Hole Position 2
Feed Hole Center Pocket Hole Center 2
Pocket Depth
Feed Hole Pitch
Component Spacing
Feed Hole Center Pocket Hole Center 1
Carrier Tape Thickness
Embossed Carrier
Tape Width
Cover Tape Width
F
TRAILER
160mm MIN
LEADER
400mm MIN
K0
P0
P1
Tape Dimension Items
D0
P0
P2
T
CARRIER TAPE
D1
T
W
B0 F
E2 W
W0
K0
P2
E1
P1
W0
Inches
Millimeters
Min
Max
Min
N/A 12.992 N/A
0.059
N/A
1.50
0.504 0.531 12.80
0.795
N/A
20.20
1.969
N/A
50.00
0.488 0.567 12.40
0.138 0.146 3.50
0.138 0.146 3.50
0.059 0.063 1.50
0.059
N/A
1.50
0.065 0.073 1.65
0.400 0.408 10.15
Max
330.0
N/A
13.50
N/A
N/A
14.40
3.70
3.70
1.60
N/A
1.85
10.35
0.215
0.219
5.45
5.55
0.039
0.153
0.311
0.051
0.161
0.319
1.00
3.90
7.90
1.30
4.10
8.10
0.077
0.081
1.90
2.05
0.010
0.014
0.25
0.35
0.453
0.484
11.50
12.30
0.358
0.366
9.10
9.30
A0
COVER TAPE
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/07/14
4
Q2L Series - 3.3x3.3 QFN