RENESAS R1RW0408D

R1RW0408D Series
4M High Speed SRAM (512-kword × 8-bit)
REJ03C0111-0100Z
Rev. 1.00
Mar.12.2004
Description
The R1RW0408D is a 4-Mbit high speed static RAM organized 512-kword × 8-bit. It has realized high
speed access time by employing CMOS process (6-transistor memory cell) and high speed circuit
designing technology. It is most appropriate for the application which requires high speed, high density
memory and wide bit width configuration, such as cache and buffer memory in system. The R1RW0408D
is packaged in 400-mil 36-pin SOJ for high density surface mounting.
Features
• Single supply: 3.3 V ± 0.3 V
• Access time: 12 ns (max)
• Completely static memory
 No clock or timing strobe required
• Equal access and cycle times
• Directly TTL compatible
 All inputs and outputs
• Operating current: 100 mA (max)
• TTL standby current: 40 mA (max)
• CMOS standby current : 5 mA (max)
: 0.8 mA (max) (L-version)
• Data retention current: 0.4 mA (max) (L-version)
• Data retention voltage: 2 V (min) (L-version)
• Center VCC and VSS type pin out
Rev.1.00, Mar.12.2004, page 1 of 12
R1RW0408D Series
Ordering Information
Type No.
Access time
Package
R1RW0408DGE-2PR
12 ns
400-mil 36-pin plastic SOJ (36P0K)
R1RW0408DGE-2LR
12 ns
Pin Arrangement
36-pin SOJ
A0
1
36
NC
A1
2
35
A18
A2
3
34
A17
A3
4
33
A16
A4
5
32
A15
CS#
6
31
OE#
I/O1
7
30
I/O8
I/O2
8
29
I/O7
VCC
9
28
VSS
VSS
10
27
VCC
I/O3
11
26
I/O6
I/O4
12
25
I/O5
WE#
13
24
A14
A5
14
23
A13
A6
15
22
A12
A7
16
21
A11
A8
17
20
A10
A9
18
19
NC
(Top View)
Rev.1.00, Mar.12.2004, page 2 of 12
R1RW0408D Series
Pin Description
Pin name
Function
A0 to A18
Address input
I/O1 to I/O8
Data input/output
CS#
Chip select
OE#
Output enable
WE#
Write enable
VCC
Power supply
VSS
Ground
NC
No connection
Rev.1.00, Mar.12.2004, page 3 of 12
R1RW0408D Series
Block Diagram
(LSB)
A14
A13
A12
A5
A6
A7
A11
A10
A3
A1
(MSB)
VCC
Row
decoder
1024-row × 32-column ×
16-block × 8-bit
(4,194,304 bits)
VSS
CS
Column I/O
I/O1
.
.
.
I/O8
Input
data
control
Column decoder
A8 A9 A18 A16 A17 A0 A2 A4 A15
(LSB)
(MSB)
WE#
CS#
OE#
CS
Rev.1.00, Mar.12.2004, page 4 of 12
CS
R1RW0408D Series
Operation Table
CS#
OE#
WE#
Mode
VCC current
I/O
Ref. cycle
H
×
×
Standby
ISB, ISB1
High-Z

L
H
H
Output disable
ICC
High-Z

L
L
H
Read
ICC
DOUT
Read cycle (1) to (3)
L
H
L
Write
ICC
DIN
Write cycle (1)
L
L
L
Write
ICC
DIN
Write cycle (2)
Parameter
Symbol
Value
Supply voltage relative to VSS
VCC
−0.5 to +4.6
Voltage on any pin relative to VSS
VT
−0.5* to VCC + 0.5*
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
−55 to +125
°C
Storage temperature under bias
Tbias
−10 to +85
°C
Note: H: VIH, L: VIL, ×: VIH or VIL
Absolute Maximum Ratings
Unit
V
1
2
V
Notes: 1. VT (min) = −2.0 V for pulse width (under shoot) ≤ 6 ns.
2. VT (max) = VCC + 2.0 V for pulse width (over shoot) ≤ 6 ns.
Recommended DC Operating Conditions
(Ta = 0 to +70°C)
Parameter
Symbol
Supply voltage
Min
Typ
Max
Unit
3
3.0
3.3
3.6
V
4
0
0
0
VIH
2.0

VCC + 0.5*
VIL
−0.5*

0.8
VCC*
VSS*
Input voltage
Notes: 1.
2.
3.
4.
1
VIL (min) = −2.0 V for pulse width (under shoot) ≤ 6 ns.
VIH (max) = VCC + 2.0 V for pulse width (over shoot) ≤ 6 ns.
The supply voltage with all VCC pins must be on the same level.
The supply voltage with all VSS pins must be on the same level.
Rev.1.00, Mar.12.2004, page 5 of 12
V
2
V
V
R1RW0408D Series
DC Characteristics
(Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)
Parameter
Symbol Min
Max
Unit
Test conditions
Input leakage current
IILII

2
µA
VIN = VSS to VCC
Output leakage current
IILOI

2
µA
VIN = VSS to VCC
Operation power supply current
ICC

100
mA
Min cycle
CS# = VIL, lOUT = 0 mA
Other inputs = VIH/VIL
Standby power supply current
ISB

40
mA
Min cycle
CS# = VIH,
Other inputs = VIH/VIL
ISB1

5
mA
f = 0 MHz
VCC ≥ CS# ≥ VCC − 0.2 V,
(1) 0 V ≤ VIN ≤ 0.2 V or
(2) VCC ≥ VIN ≥ VCC − 0.2 V
*
Output voltage
Note:
1
0.8*
1
mA
VOL

0.4
V
IOL = 8 mA
VOH
2.4

V
IOH = −4 mA
1. This characteristics is guaranteed only for L-version.
Capacitance
(Ta = +25°C, f = 1.0 MHz)
Parameter
Input capacitance*
1
Input/output capacitance*
Note:
1
Symbol
Min
Max
Unit
Test conditions
CIN

6
pF
VIN = 0 V
CI/O

8
pF
VI/O = 0 V
1. This parameter is sampled and not 100% tested.
Rev.1.00, Mar.12.2004, page 6 of 12
R1RW0408D Series
AC Characteristics
(Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, unless otherwise noted.)
Test Conditions
• Input pulse levels: 3.0 V/0.0 V
• Input rise and fall time: 3 ns
• Input and output timing reference levels: 1.5 V
• Output load: See figures (Including scope and jig)
1.5 V
3.3 V
RL=50 Ω
DOUT Zo=50 Ω
319Ω
DOUT
30 pF
Output load (A)
353Ω
5 pF
Output load (B)
(for tCLZ, tOLZ, tCHZ, tOHZ, tWHZ, and tOW)
Read Cycle
R1RW0408D
-2
Parameter
Symbol
Min
Max
Unit
Read cycle time
tRC
12

ns
Notes
Address access time
tAA

12
ns
Chip select access time
tACS

12
ns
Output enable to output valid
tOE

6
ns
Output hold from address change
tOH
3

ns
Chip select to output in low-Z
tCLZ
3

ns
1
Output enable to output in low-Z
tOLZ
0

ns
1
Chip deselect to output in high-Z
tCHZ

6
ns
1
Output disable to output in high-Z
tOHZ

6
ns
1
Rev.1.00, Mar.12.2004, page 7 of 12
R1RW0408D Series
Write Cycle
R1RW0408D
-2
Parameter
Symbol
Min
Max
Unit
Notes
Write cycle time
tWC
12

ns
Address valid to end of write
tAW
8

ns
Chip select to end of write
tCW
8

ns
9
Write pulse width
tWP
8

ns
8
Address setup time
tAS
0

ns
6
Write recovery time
tWR
0

ns
7
Data to write time overlap
tDW
6

ns
Data hold from write time
tDH
0

ns
Write disable to output in low-Z
tOW
3

ns
1
Output disable to output in high-Z
tOHZ

6
ns
1
Write enable to output in high-Z
tWHZ

6
ns
1
Notes: 1. Transition is measured ±200 mV from steady voltage with output load (B). This parameter is
sampled and not 100% tested.
2. Address should be valid prior to or coincident with CS# transition low.
3. WE# and/or CS# must be high during address transition time.
4. If CS# and OE# are low during this period, I/O pins are in the output state. Then, the data input
signals of opposite phase to the outputs must not be applied to them.
5. If the CS# low transition occurs simultaneously with the WE# low transition or after the WE#
transition, output remains a high impedance state.
6. tAS is measured from the latest address transition to the later of CS# or WE# going low.
7. tWR is measured from the earlier of CS# or WE# going high to the first address transition.
8. A write occurs during the overlap of a low CS# and a low WE#. A write begins at the latest
transition among CS# going low and WE# going low. A write ends at the earliest transition
among CS# going high and WE# going high. tWP is measured from the beginning of write to the
end of write.
9. tCW is measured from the later of CS# going low to the end of write.
Rev.1.00, Mar.12.2004, page 8 of 12
R1RW0408D Series
Timing Waveforms
Read Timing Waveform (1) (WE# = VIH)
tRC
Address
Valid address
tOH
tAA
tACS
tCHZ
CS#
tOE
tOHZ
OE#
tOLZ
tCLZ
DOUT
High impedance
Valid data
Read Timing Waveform (2) (WE# = VIH, CS# = VIL, OE# = VIL)
tRC
Address
Valid address
tAA
tOH
tOH
DOUT
Rev.1.00, Mar.12.2004, page 9 of 12
Valid data
R1RW0408D Series
Read Timing Waveform (3) (WE# = VIH, CS# = VIL, OE# = VIL)*
2
tRC
CS#
tACS
tCHZ
tCLZ
DOUT
High
impedance
Valid data
High
impedance
Write Timing Waveform (1) (WE# Controlled)
tWC
Valid address
Address
tWR
tAW
OE#
tCW
CS#*3
tAS
tWP
WE#*3
tOHZ
High impedance*5
DOUT
tDW
DIN
Rev.1.00, Mar.12.2004, page 10 of 12
*4
tDH
Valid data
*4
R1RW0408D Series
Write Timing Waveform (2) (CS# Controlled)
tWC
Valid address
Address
tWR
tCW
CS# *3
tAW
tWP
WE# *3
tAS
tWHZ
tOW
High impedance*5
DOUT
tDW
DIN
Rev.1.00, Mar.12.2004, page 11 of 12
*4
tDH
Valid data
*4
R1RW0408D Series
Low VCC Data Retention Characteristics
(Ta = 0 to +70°C)
This characteristics is guaranteed only for L-version.
Parameter
Symbol
Min
Max
Unit
Test conditions
VCC for data retention
VDR
2.0

V
VCC ≥ CS# ≥ VCC − 0.2 V
(1) 0 V ≤ VIN ≤ 0.2 V or
(2) VCC ≥ VIN ≥ VCC − 0.2 V
Data retention current
ICCDR

400
µA
VCC = 3 V, VCC ≥ CS# ≥ VCC − 0.2 V
(1) 0 V ≤ VIN ≤ 0.2 V or
(2) VCC ≥ VIN ≥ VCC − 0.2 V
Chip deselect to data
retention time
tCDR
0

ns
See retention waveform
Operation recovery time
tR
5

ms
Low VCC Data Retention Timing Waveform
t CDR
Data retention mode
V CC
3.0 V
V DR
2.0 V
CS#
0V
Rev.1.00, Mar.12.2004, page 12 of 12
VCC ≥ CS# ≥ VCC − 0.2 V
tR
Revision History
Rev.
Date
R1RW0408D Series Data Sheet
Contents of Modification
Page
Description
0.01
Sep. 30, 2003

Initial issue
1.00
Mar.12.2004

Deletion of Preliminary
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