TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0524P Series SP0524P Series 0.5pF Diode Array RoHS Pb GREEN Description The SP0524P integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features (AEC-Q101 qualified) 6 7 8 9 10 • ESD, IEC61000-4-2, ±12kV contact, ±25kV air • Low leakage current of 1.5μA (MAX) at 5V • EFT, IEC61000-4-4, 40A (tP=5/50ns) • Small form factor μDFN (JEDEC MO-229) package saves board space • Lightning, IEC61000-4-5, 4A (tP=8/20μs) 5 4 3 2 1 *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram • Low capacitance of 0.5pF (TYP) per I/O • AEC-Q101 qualified (µDFN-10 package) Applications Pin 1 Pin 2 Pin 4 Pin 5 • LCD/PDP TVs • Set Top Boxes • External Storages • Mobile Phones • DVD/ Blue-Ray Players • Notebooks • Desktops • Digital Cameras • MP3/PMP Application Example for USB3.0 USB Port GND (Pins 3,8) USB Controller VBUS D+ D- Additional Information SP3003 Optional NC Datasheet Resources Samples IC SSTX+ SSTXGND SP0524P SSRX+ SSRX- Life Support Note: *Package is shown as transparent Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Case GND Signal GND © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/24/14 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0524P Series Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP TSTOR Units 4.0 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions VRWM IR ≤ 1µA Reverse Breakdown Voltage VBR IR = 1mA Reverse Leakage Current ILEAK VR=5V, Any I/O to GND Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 Min Typ 6 6.5 Units 5.0 V V 1.5 µA IPP=1A, tp=8/20µs, Fwd 6.6 V IPP=2A, tp=8/20µs, Fwd 7.0 V (VC2 - VC1) / (IPP2 - IPP1) VESD Max 0.4 IEC61000-4-2 (Contact) ±12 IEC61000-4-2 (Air) ±25 Ω kV kV Diode Capacitance1 CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 Diode Capacitance1 CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 0.55 pF pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 1.0 0 -3 -6 Attenuation (dB) Capacitance (pF) 0.8 -9 -12 0.6 -15 -18 0.4 -21 -24 0.2 -27 0.0 0.0 2.0 1.0 3.0 Bias Voltage (V) 4.0 -30 5.0 Clamping Voltage vs. IPP 100 Frequency (MHz) 1000 Pulse Waveform 10.0 110% 100% 90% 8.0 Percent of IPP 80% Clamp Voltage (V) 6.0 4.0 70% 60% 50% 40% 30% 20% 2.0 10% 0.0 0% 1 2 Current (A) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/24/14 3 4 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0524P Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP 0524P U T G G= Green T= Tape & Reel Series tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Product Characteristics Part Numbering System TVS Diode Arrays (SPA® Diodes) Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition Package µDFN-10 (2.5x1.0mm) Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. V* 4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Number of Product Series Channels V = SP0524P Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP0524PUTG µDFN-10 V*4 3000 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/24/14 TVS Diode Arrays (SPA® Diodes) Top View Low Capacitance ESD Protection - SP0524P Series A D E B Package Dimensions — µDFN-10 (2.5x1.0x0.5mm) Side View 0.05 C µDFN-10 (2.5x1.0x0.5mm) A Seating PlaneMO-229 b1 C b Millimeters Inches JEDEC Top View Symbol A D B Max 0.515 0.55 A1 0.00 -- 0.05 b 0.15 0.20 0.25 b1 0.35 0.40 0.45 D 2.40 2.50 2.60 E 0.90 1.00 1.10 Side View A 0.05 C b1 0.30 0.05 M C Bottom View R0.125 M C A BMax 0.10Nom 0.020 0.021 0.05 M C 0.000 0.022 0.005 Ref View 0.012 0.006Bottom 0.008 0.014 R0.125 0.016 0.018 0.094 0.098 0.102 0.035 0.039 0.043 L 0.020 BSC 0.012 0.014 0.016 2xR0.075mm (7x) e 0.365 0.43 Recomended Soldering Pad Layout Soldering Pad Layout Dimensions b 0.10 M C A B Min 0.50 BSC L A1 A3 Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 X 0.008 0.20 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 P1 P Y (Y1) Z (C) G X X1 Alternative Soldering Pad Layout L P1 2xR0.075mm (7x) P e Y X P1 P Embossed Carrier Tape & Reel YSpecification — µDFN-10 (Y1) Z (C) G P0 0 T B0 F W X1 User Feeding Direction E D X D1 A0 K0 5º Max © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/24/14 (Y1) Z (C) G Recomended Soldering Pad Layout P1 P2 0.05 C 0.019 0.125 Ref e 0.05 C C Nom 0.48 A3 E Seating Plane Min A A1 A3 5º Max Pin 1 Location Package µDFN-10 (2.5x1.0x0.5mm) Symbol Millimeters A0 1.30 ± 0.10 B0 2.83 ± 0.10 D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 E 1.75 ± 0.10 F 3.50 ± 0.05 K0 0.65 ± 0.10 P0 4.00 ± 0.10 P1 4.00 ± 0.10 P2 2.00 ± 0.05 T 0.254 ± 0.02 W 8.00 + 0.30 /- 0.10 X1 SP3012 Package