TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series SD-C Series 450W Discrete Bidirectional TVS Diode RoHS Pb GREEN The bidirectional SD-C series is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The SD-C series can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 30A (SD05C) of 8/20μs induced surge current (IEC61000-4-5) with very low clamping voltages. Pinout and Functional Block Diagram 1 2 Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Low clamping voltage • EFT, IEC61000-4-4, 40A (5/50ns) • Small SOD323 package fits 0805 footprints • Lightning, IEC61000-4-5, 30A (tP=8/20μs, SD05C) • AEC-Q101 qualified Applications • Switches / Buttons • Test Equipment / Instrumentation • Point-of-Sale Terminals • Medical Equipment Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 • Low leakage current • Notebooks / Desktops / Servers • Computer Peripherals • Automotive Electronics SD-C Description TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series Absolute Maximum Ratings Symbol Parameter Value Units 450 W Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C Ppk Peak Pulse Power (tp=8/20μs) TOP TSTOR Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range SD05C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA ILEAK VR=5V 1.0 μA IPP=1A, tp=8/20µs, Fwd 10.0 V IPP=10A, tP=8/20μs, Fwd 14.5 V Reverse Voltage Drop Leakage Current Clamp Voltage1 VC Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance 1 RDYN TLP, tp=100ns, I/O to Ground Ipp tp=8/20µs VESD CD Min Typ Max Units 5.0 V 6.0 V 0.31 Ω 30.0 A IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 200 pF Max Units 12.0 V SD12C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA ILEAK VR=12V Reverse Voltage Drop Leakage Current Clamp Voltage1 VC Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance 1 13.3 V 1.0 μA IPP=1A, tp=8/20µs, Fwd 18.5 V 23.0 V TLP, tp=100ns, I/O to Ground Ipp tp=8/20µs CD-GND Typ IPP=10A, tP=8/20μs, Fwd RDYN VESD Min 0.41 Ω 17.0 A IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 100 pF © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series SD15C Electrical Characteristics (TOP=25ºC) Symbol Test Conditions VRWM IR≤1μA VR IR=1mA Reverse Voltage Drop Leakage Current ILEAK VC Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 Max Units 15.0 V 16.7 V VR=15V 1.0 μA 24.0 V IPP=10A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground Ipp tp=8/20µs CI/O-GND Typ IPP=1A, tp=8/20µs, Fwd RDYN VESD Min 31.0 0.46 V Ω 12.0 A IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 75 pF Max Units 24.0 V SD24C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA ILEAK VR=24V 1.0 μA IPP=1A, tp=8/20µs, Fwd 34.0 V IPP=5A, tp=8/20µs, Fwd 42.0 V Reverse Voltage Drop Leakage Current VC Clamp Voltage1 Dynamic Resistance 2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 RDYN Test Conditions CI/O-GND Typ 26.7 TLP, tp=100ns, I/O to Ground Ipp VESD Min V 0.62 tp=8/20µs Ω 7.0 A IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 50 pF Max Units SD36C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 ILEAK VC 40.0 V V 1.0 μA 50.0 V IPP=4A, tp=8/20µs, Fwd Ipp tp=8/20µs 60.0 0.68 ±30 IEC61000-4-2 (Air Discharge) ±30 Reverse Bias=0V, f=1MHz 1. Parameter is guaranteed by design and/or device characterization. 2.Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. V Ω 5.0 IEC61000-4-2 (Contact Discharge) Note: © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 36.0 VR=36V TLP, tp=100ns, I/O to Ground CI/O-GND Typ IPP=1A, tp=8/20µs, Fwd RDYN VESD Min A kV kV 30 pF SD-C Parameter Reverse Standoff Voltage TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series Non-Repetitive Peak Pulse Power vs. Pulse Time Capacitance vs. Bias 160 10 Capacitance (pF Peak Pulse Power - P pk (kW) 140 1 0.1 120 SD05C 100 80 60 SD12C 40 SD15C SD24C 20 0.01 0.1 1 10 100 3 6 9 12 15 18 21 24 27 30 33 36 Pulse Waveform 110 110% 100 100% 90 90% 80 80% Percent of IPP 70 60 50 40 30 70% 60% 50% 40% 30% 20 20% 10 0 0 Bias Voltage (V Power Derating Curve % of Rated Power I PP 0 1000 Pulse Duration - t p (µs) SD36C 10% 0 25 50 75 100 125 150 Ambient Temperature - T A (oC) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) SD05C Transmission Line Pulsing(TLP) Plot SD12C Transmission Line Pulsing(TLP) Plot 22 22 20 20 18 18 16 16 TLP Current (A) TLP Current (A) 0% 14 12 10 14 12 10 8 8 6 6 4 4 2 2 0 0 0 2 4 6 8 10 TLP Voltage (V) 12 14 16 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 TLP Voltage (V) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series SD24C Transmission Line Pulsing(TLP) Plot 22 22 20 20 18 18 16 16 14 12 10 14 SD-C TLP Current (A) TLP Current (A) SD15C Transmission Line Pulsing(TLP) Plot 12 10 8 8 6 6 4 4 2 2 0 0 0 2 4 6 8 0 10 12 14 16 18 20 22 24 26 28 30 32 5 10 15 20 25 30 35 40 45 50 TLP Voltage (V) TLP Voltage (V) SD36C Transmission Line Pulsing(TLP) Plot 22 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 TLP Voltage (V) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 °C Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series Product Characteristics Ordering Information Part Number Package Marking Min. Order Qty. Copper Alloy SD05C-01FTG SOD323 G 3000 Lead Coplanarity 0.0004 inches (0.102mm) SD12C-01FTG SOD323 G1 3000 Substrate material Silicon SD15C-01FTG SOD323 G2 3000 Body Material Molded Epoxy SD24C-01FTG SOD323 G3 3000 Flammability UL 94 V-0 SD36C-01FTG SOD323 G4 3000 Lead Plating Matte Tin Lead Material Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Marking System Part Numbering System SD** C – 01 F T G TVS Diode Arrays (SPA® Diodes ) G* G= Green Voltage T= Tape & Reel Bidirectional Package Number of Channels Blank: SD05C-01FTG 1: SD12C-01FTG 2: SD15C-01FTG 3: SD24C-01FTG 4: SD36C-01FTG F: SOD323 Package Dimensions -SOD323 E D Symbol A E1 L1 0.45 Millimeters Inches Min Max Min Max A 0.8 1.14 0.031 0.045 A1 0.00 0.10 0.000 0.004 A2 0.80 1.04 0.031 0.014 b 0.25 0.35 0.010 0.014 c 0.08 0.15 0.003 0.006 D 1.15 1.45 0.045 0.057 Recommended Solder Pad E 1.60 1.90 0.063 0.075 1.79 E1 2.44 2.70 0.096 0.106 L1 0.25 0.45 0.010 0.018 0.49 c 0.2 SOD323 A2 b A1 1.14 2.28 2.77 Unit: mm © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD-C Series Embossed Carrier Tape & Reel Specification — SOD323 2.00 4.00 ø1.50 ø178 6 R7 5. R2 12.3 0 1.75 8. 3000 2500 2000 SD-C 54.4 500 .5 1000 5.6 R6 A 8.00 A B 3.50 1500 R2 12.3 4.00 B 9.5 0.254 1.25 2.90 1.46 Cover Tape A-A B-B © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15