TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3004 Series SP3004 Series 0.85pF Diode Array RoHS Pb GREEN Description The SP3004 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 GND VCC I/O 2 I/O 3 • Low capacitance of 0.85pF (TYP) per I/O • Low leakage of 1nA MAX with VR=3.3V • ESD protection of ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Small SOT563 package saves board space • EFT protection, IEC61000-4-4, 40A (5/50ns) • Lightning Protection, IEC61000-4-5, 4A (8/20µs) Functional Block Diagram I/O4 VCC I/O2 Applications • Computer Peripherals • Network Hardware/Ports • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras GND I/O1 Application Example I/O3 +5V D2+ Additional Information D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ Datasheet Resources Samples D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be floated or NC. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3004 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 4 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM Reverse Leakage Current1 ILEAK VC Clamp Voltage1 ESD Withstand Voltage1 VESD Dynamic Resistance RDYN Diode Capacitance1 CI/O-GND Diode Capacitance CI/O-I/O 1 Min Typ Max Units IR ≤ 1µA 6 V VR=3.3V 1 nA IPP=1A, tp=8/20µs, Fwd 10.0 12.0 V IPP=2A, tp=8/20µs, Fwd 11.8 15.0 V IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV (VC2 - VC1) / (IPP2 - IPP1) 1.8 Ω Reverse Bias=0V 0.95 1.1 1.25 pF Reverse Bias=1.65V 0.7 0.85 1 pF Reverse Bias=0V 0.5 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 0.50 -20 1.E+06 1.E+07 1.E+08 Frequency [Hz] 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3004 Series Capacitance vs. Frequency Leakage Current vs Temperature 2E-12 1000 1.8E-12 5V Bias I/O to GND Leakage (pA) 1.6E-12 Capacitance [F] 1.4E-12 1.2E-12 1E-12 8E-13 6E-13 4E-13 3.3V Bias 100 10 2E-13 0 1.E+06 1.E+07 1.E+08 1 1.E+09 0 25 45 65 Temperature ( ºC) Frequency [Hz] Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3004 Series Package Dimensions — SOT563 A D 6 5 2 4 E 3 Package L SOT 563 Pins 6 Millimeters Solder Pad Layout HE Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A e c B 0.50 BSC e 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 G* 4 SP3004-04X T G G*4 G= Green Product Series Number of Channels Number of Channels G = SP3004 series T= Tape & Reel Series 0.020 BSC L Part Marking System Part Numbering System TVS Diode Arrays (SPA® Diodes) Inches Min Assembly Site (varies) Package X = SOT563 -04 = 4 channel Ordering Information Part Number Package Marking Min. Order Qty. SP3004-04XTG SOT563 G*4 3000 Embossed Carrier Tape & Reel Specification — SOT563 Millimetres Min Pin 1 Location User Feeding Direction Inches Max Min Max 0.073 E 1.65 1.85 0.065 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.318 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13