TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP0502B Series SP0502B Series 1pF 15kV Diode Arrays RoHS Pb GREEN Description The SP0502B is a low capacitance TVS diode array designed to protect high-speed data interfaces from over-voltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). It has a typical capacitance of only 0.3pF (pin 1 to 2) making it suitable for use on circuits operating in excess of 3GHz without signal attenuation. The SP0502BXTG is in a small SOT-523 package and each device can be configured to protect 1 bidirectional line or two unidirectional lines. The combination of small size, ultra-low capacitance, and high level of ESD protection makes it an ideal solution for applications such as HDMI, USB, MDDI, antennas, and DisplayPort. Functional Block Diagram and Pinout 2 Features • E SD protection of ±15kV contact discharge, ±20kV air discharge, (IEC61000-4-2) 1 • EFT, IEC61000-4-4, 40A (5/50ns) • L ightning protection, IEC61000-4-5, 2A (tp=8/20µs) 3 Life Support Note: • Stand-off voltage of 5V Not Intended for Use in Life Support or Life Saving Applications • Low capacitance of 1pF @ VR=0V (MAX) • L ow leakage current of 0.5μA at 5V (MAX) • Small form factor (SOT523) and low profile (<1mm) • No insertion loss to >3.0GHz • AEC-Q qualified The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Applications • H igh-Definition Multimedia Interface (HDMI) • USB 2.0 • DisplayPort • M obile Display Digital Interface (MDDI) • RF/Antenna Circuits ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/17/14 SP0502B Series 1 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP0502B Series Absolute Maximum Ratings Symbol Value Units PPK Peak Pulse Power (tP=8/20µs) Parameter 25 W IPP Peak Pulse Current (tP=8/20µs) 2 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions VRWM IR≤1μA, Pin1 or Pin2 to Pin3 and Pin1 to Pin2 Max Units 5.0 V Reverse Breakdown Voltage VBR It=1mA, Pin1 or Pin2 to Pin3 Leakage Current ILEAK VR=5V 0.5 μA VC IPP=1A, tp=8/20µs, Pin 1 to Pin 2 12 V Dynamic Resistance RDYN TLP, tp=100ns, I/O to GND ESD Withstand Voltage1 VESD Reverse Standoff Voltage Clamp Voltage1 2 Typ 6 V Ω 0.45 IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±20 kV CI/O-I/O Reverse Bias=0V, f=1MHz; Pin 1 to Pin2 CI/O-GND Reverse Bias=0V, f=1MHz; Pin 1 or Pin2 to Pin 3 Diode Capacitance1 Min 0.25 0.5 pF 1.0 pF Note: 1Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/17/14 SP0502B Series 2 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP0502B Series Pulse Waveform Insertion Loss of Pin 1 to Pin 2 (I/O to I/O) 5 110% 100% 0 90% Insertion Loss S21 (dB) Percent of IPP 80% 70% 60% 50% 40% 30% 20% -5 -10 -15 -20 -25 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 -30 1.00E+06 30.0 1.00E+07 1.00E+09 1.00E+10 Capacitance vs. Reverse Bias (I/O-I/O) (Pin 1 to Pin 2) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 Capacitance (pF) Capacitance (pF) Capacitance vs. Reverse Bias (Pin 1 or Pin 2 to Pin 3) 0.6 0.5 0.4 0.3 0.2 0.6 0.5 0.4 0.3 0.2 0.1 0.1 0.0 1.00E+08 Frenqucy(Hz) Time (μs) 0.0 0 1 2 3 4 5 Bias Voltage (V) 0 1 2 3 Bias Voltage (V) 4 5 Transmission Line Pulse (TLP) 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 5 10 15 20 TLP Voltage (V) ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/17/14 SP0502B Series 519 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP0502B Series Soldering Parameters Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Reflow Condition Pre Heat Notes : tP Temperature TP Critical Zone TL to TP Ramp-up TL tL TS(max) 200°C - Time (min to max) (ts) 60 – 180 secs TS(max) to TL - Ramp-up Rate 3°C/second max 3. Dimensions are exclusive of mold flash & metal burr. 5. Package surface matte finish VDI 11-13. 150°C 3°C/second max Reflow 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. - Temperature Min (Ts(min)) - Temperature Max (Ts(max)) Average ramp up rate (Liquidus) Temp (TL) to peak 1. All dimensions are in millimeters 2. Dimensions include solder plating. Pb – Free assembly - Temperature (TL) (Liquidus) - Temperature (tL) 217°C 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Ordering Information Part Number Package Size Marking Min. Order Qty. SP0502BXTG SOT523 1.6x1.6mm 3** 3000 Part Numbering System SP 0502B Part Marking System – TVS Diode Arrays (SPA® Diodes ) Series 3 ** XTG G= Green Product Series 3 = SP0502B T= Tape & Reel Package SOT523 (1.6x1.6mm) ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/17/14 Date Code SP0502B Series 4 SP4040 Product Characteristics TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP0502B Series Package Dimensions — SOT523 Millimetres D SEE VIEW A-A b SECTION B-B b c E1 E B B BASE METAL e1 e A VIEW A-A A1 Min Typ Max Min Typ Max A 0.60 - 0.90 0.023 - 0.035 A1 0.00 - 0.10 0.000 - 0.004 A2 0.60 0.75 0.80 0.023 0.030 0.031 b 0.15 - 0.30 0.005 - 0.012 c 0.10 - 0.20 0.003 - 0.008 D 1.50 1.60 1.70 0.059 0.063 0.067 1.00 BSC e SEATING PLANE L1 0.039 BSC 0.50 BSC e1 A2 Inches E 1.45 E1 0.75 0.020 BSC 1.60 1.75 0.057 0.80 0.85 0.029 0.22 REF L1 θ 0° - 0.063 0.069 0.031 0.033 0.009 RFE 8° 0° -- 8° Embossed Carrier Tape & Reel Specification — SOT523 Millimetres Min Max 0.073 1.65 1.85 0.065 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 40.0+/- 0.20 1.574+/-0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 0.318 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t Revision: 10/17/14 Min E 10P0 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Inches Max 0.22 max 0.009 max SP0502B Series 5