TVS Diode Arrays (SPA®® Diodes) General Purpose Protection - SP1014 Series SP1014 Series 6pF 12kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1014 includes back-to-back Zener diodes which provides protection for electronic equipment that may experience destructive electrostatic discharges (ESD). It measures 0.52 x 0.27mm permitting use of the standard 0201 footprints, but offering a 30% reduction in occupied board space. The SP1014 can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation, and the back-to-back configuration provides symmetrical standoff voltage which makes the component appropriate for use when AC signals are present on the data or signal line. Pinout Features 0201 Flipchip 1 2 Pin1 Pin2 • ESD, IEC61000-4-2, ±12kV contact, ±15kV air • Low capacitance of 6pF (@ VR=0V) • EFT, IEC61000-4-4, 40A (5/50ns) • Low leakage current of 5nA at 1.5V • Lightning, IEC61000-4-5, 2A (tP=8/20μs) Note: Drawing not to scale Functional Block Diagram 1 Applications 2 • Mobile Phones • Digital Cameras • Smart Phones • MP3/PMP • Tablets • Wearable Technology • Portable Navigation Devices • Portable Medical • Point of Sale Terminals Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 SP1014 Series 1 552 TVS Diode Arrays (SPA®® Diodes) General Purpose Protection - SP1014 Series Absolute Maximum Ratings Symbol Parameter IPP Peak Current (tp=8/20μs) TOP TSTOR Value Units 2.0 1 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C Notes: 1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Breakdown Voltage Symbol Test Conditions Min VRWM IR≤1μA with 1 pin to GND VBR IT=1mA with 1 pin at GND Typ ILEAK VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD 2 Diode Capacitance1 5.0 V V VR=1.5V with 1 pin at GND 5 nA VR=3.3V with 1 pin at GND1 10 nA VR=5V with 1 pin at GND 100 nA 1 Clamp Voltage1 Units 7.0 1 Leakage Current Max IPP=1A, tp=8/20µs, Fwd 10 V IPP=2A, tp=8/20µs, Fwd 11 V TLP tp=100ns, 1 Pin to GND 0.5 Ω IEC61000-4-2 (Contact Discharge) ±12 kV IEC61000-4-2 (Air Discharge) ±15 kV CD Reverse Bias=0V, f=1MHz 6 7 pF Note: 1Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns Pulse Waveform Capacitance vs. Reverse Bias (1 Pin to GND) 15.0 110% 100% 90% Capacitance (pF) Percent of IPP 80% 70% 60% 50% 40% 30% 10.0 5.0 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0.0 Time (μs) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Bias Voltage (V) ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 SP1014 Series 553 2 TVS Diode Arrays (SPA®® Diodes) General Purpose Protection - SP1014 Series Transmission Line Pulsing(TLP) Plot(1 Pin to GND) 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 30 TLP Volts (V) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Reflow Condition TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Part Marking System Critical Zone TL to TP Ramp-up time to peak temperature Time Part Numbering System SP 1014 – 01 W T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels Package W: Flipchip Ordering Information ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 Part Number Package SP1014-01WTG Flipchip Marking • • Min. Order Qty. 15000 SP1014 Series 3 554 TVS Diode Arrays (SPA®® Diodes) D General Purpose Protection - SP1014 Series A2 A A1 Package Dimensions — Flipchip TOP VIEW BOTTOM VIEW 0.01 0.20 0.16 F 0.41 E 0.25 G 0.20 0.14 D Stencil opening (0.20x0.16) A2 A Solder Pad (0.20x0.14) Recommended Solder Pad Footprint and Stencil opening Thickness of Stencil opening is 0.08mm A1 *Sizes in mm Flipchip 0.20 0.01 Millimeters Symbol Inches Min Typ Max 0.16 Min Typ Max A 0.183 0.211 0.239 0.0072 0.0083 0.0094 A1 0.008 0.011 A2 0.175 0.200 D 0.280 E 0.530 F G 0.0003 0.0004 0.0006 0.0069 0.0079 0.0089 0.290 0.300 0.0110 0.0114 0.0118 0.540 0.550 0.14 0.0209 0.0213 0.0217 - 0.100 - - 0.0039 - - 0.200 (0.20x0.16) - 0.0079 - 0.41 0.014 0.225 0.25 0.20 Stencil opening Solder Pad (0.20x0.14) Recommended Solder Pad Footprint and Stencil opening Thickness of Stencil opening is 0.08mm *Sizes in mm Embossed Carrier Tape & Reel Specification — Flipchip 7 ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 Symbol Millimeters A0 0.34+/-0.03 B0 0.60+/-0.03 K0 0.25 + 0.03 F 3.50 +/- 0.05 P1 2.00+/-0.10 W 8.00+/-0.10 SP1014 Series 555 4