data sheet

TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP2574NUTG
SP2574NUTG 2.5V 40A Diode Array
RoHS
Pb GREEN
The SP2574NUTG is a low-capacitance, TVS Diode Array
designed to provide protection against ESD (electrostatic
discharge), CDE (cable discharge events), EFT (electrical fast
transients), and lightning induced surges for high-speed,
differential data lines. It’s packaged in a µDFN package (3.0
x 2.0mm) and each device can protect up 4 channels or 2
differential pairs, up to 40A (IEC61000-4-5) and up to 30kV
ESD (IEC61000-4-2). The “flow-through” design minimizes
signal distortion, reduces voltage overshoot, and provides a
simplified PCB design.
The SP2574NUTG with its low capacitance and low
clamping voltage makes it ideal for high-speed data
interfaces such as 1GbE applications found in notebooks,
switches, etc.
Pinout
Features
10
9
8
7
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
6
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Lightning, IEC61000-4-5,
40A (tP=8/20μs)
1
2
3
4
5
Functional Block Diagram
• μDFN-10 package is
optimized for high-speed
data line routing
• Provides protection for
two differential data pairs
(4 channels) up to 40A
• Low capacitance of
[email protected] (TYP) per I/O
• Low operating and
clamping voltage
• Low leakage current of
0.1μA (TYP) at 2.5V
• AEC-Q101 qualified
Applications
LINE1 IN (Pin 1)
LINE1 OUT (Pin 10)
LINE2 IN (Pin 2)
LINE2 OUT (Pin 9)
•10/100/1000 Ethernet
• LVDS Interfaces
• WAN/LAN Equipment
• Integrated Magnetics
• Desktops, Servers and
Notebooks
• Smart TV
Application Example
GND
GND
RJ-45 Connector
LINE3 IN (Pin 4)
Ethernet PHY
TP0+
LINE3 OUT (Pin 7)
TP0LINE4_IN (Pin 5)
LINE4_OUT (Pin 6)
TP1+
TP1TP2+
TP2TP3+
TP3-
SP2574N
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
SP2574NUTG
Description
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP2574NUTG
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
40 1
A
IPP
Peak Current (tp=8/20μs)
PPk
Peak Pulse Power (tp=8/20μs)
1000
W
TOP
Operating Temperature
-40 to 125
°C
TSTOR
Storage Temperature
-55 to 150
°C
Notes:1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10,
pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1µA
Min
Reverse Leakage Current
IR
VRWM = 2.5V, T = 25°C
Breakdown Voltage
VBR
It1 = 1μA
3.0
Snap Back Voltage
VSB
IH = 1mA
3.0
Clamp Voltage
RDYN
ESD Withstand Voltage
Units
2.5
V
0.1
0.5
µA
3.7
4.5
V
V
4.5
IPP = 10A, tp = 8/20μs
Any I/O to Ground
7.5
IPP = 25A, tp = 8/20μs
Any I/O to Ground
12.0
IPP = 40A, tp = 8/20μs
Line-to-Line1, two I/O Pins
connected together on each line
20.0
TLP, tp=100ns, Any I/O to Ground
VESD
Diode Capacitance
Max
IPP = 1A, tp = 8/20μs
Any I/O to Ground
VC
Dynamic Resistance2
Typ
0.13
V
Ω
IEC61000-4-2 (Contact)
±30
kV
IEC61000-4-2 (Air)
±30
kV
CI/O to GND
Between I/O Pins and Ground
VR = 0V, f = 1MHz
3.8
CI/O to I/O
Between I/O Pins
VR = 0V, f = 1MHz
1.7
5.0
pF
pF
Notes:
1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10,
pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6)
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
Normalized Capacitance vs. Voltage
Insertion Loss (S21)
2.0
5.0
1.8
0.0
1.4
-5.0
1.2
Insertion Loss(dB)
Normalized Capacitance
1.6
1.0
0.8
0.6
-10.0
-15.0
-20.0
0.4
0.2
-25.0
0.0
0
0.5
1
1.5
Bias Voltage (V)
2
2.5
-30.0
1
10
100
1000
Frequency (MHz)
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP2574NUTG
Clamping Voltage vs. IPP (Line-to-Line, Two I/O Pins
Connected Together)
Clamping Voltage vs. IPP (I/O to GND)
16.0
14.0
14.0
10.0
8.0
6.0
12.0
SP2574NUTG
Clamp Voltage (VC)
Clamp Voltage (VC)
12.0
10.0
8.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
0
5
10
15
20
0
25
5
Peak Pulse Current-IPP (A)
15
20
25
30
35
40
Peak Pulse Current-IPP (A)
Non-Repetitive Peak Pulse Power vs. Pulse Time
Pulse Waveform
110%
10
Peak Pulse Power (kW)
100%
90%
80%
Percent of IPP
10
70%
60%
50%
40%
30%
1
20%
10%
0.1
0%
0.0
5.0
10.0
15.0
20.0
Time (μs)
25.0
30.0
Transmission Line Pulse (TLP)
20
18
16
TLP Current (A)
14
12
10
8
6
4
2
0
0
2
4
6
TLP Voltage (V)
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
8
10
1
10
100
Pulse Duration - t p (µs)
1000
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP2574NUTG
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
time to peak temperature
Time
°C
Product Characteristics
Ordering Information
Pre-Plated Frame
Lead Plating
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
25
Peak Temperature (TP)
+0/-5
tP
TP
Temperature
Reflow Condition
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Part Numbering System
Part Number
Package
Marking
Min. Order Qty.
SP2574NUTG
µDFN-10
(3.0x2.0mm)
ABR4
3000
Part Marking System
SP2574N U T G
TVS Diode Arrays
(SPA® Diodes)
Series
ABR4
G= Green
T= Tape & Reel
Package
μDFN-10 (3.0x2.0mm)
Pin 1
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP2574NUTG
Package Dimensions — µDFN-10 (3.0x2.0mm)
L
b1
Package
µDFN-10 (3.0x2.0mm)
JEDEC
E
L1
e
PIN1 INDICATOR
b
e1
e2
A
A3
A1
Recommended Solder Pads
0.25
0.95
Symbol
MO-229
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A
0.50
0.60
0.65
0.020
0.024
0.026
A1
0.00
0.03
0.05
0.000
0.001
0.002
0.15 Ref
A3
0.006 Ref
b
0.15
0.20
0.25
0.006
0.008
0.010
b1
0.25
0.35
0.45
0.010
0.014
0.018
D
2.90
3.00
3.10
0.114
0.118
0.122
E
1.90
2.00
2.10
0.075
0.079
0.083
e
0.60 BSC
0.024 BSC
e1
0.65 BSC
0.026 BSC
e2
0.95 BSC
0.037
L
0.25
0.30
0.35
0.010
0.012
0.014
L1
0.95
1.00
1.05
0.037
0.039
0.041
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
1.98
1.0
1.4
3. Dimensions are exclusive of mold flash & metal burr.
2.56
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
0.4
0.6
0.6
0.65
Tape & Reel Specification — µDFN-10 (3.0x2.0mm)
P0
T
P2
扑: 1.55±0.05
Package
Device Orientation in Tape
E
Top
Cover
Tape
5° Max
K0
W
A0
F
B0
P
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
v: 1.0±0.1
Pin1 Location
µDFN-10 (3.0x2.0mm)
Symbol
Millimeters
A0
2.30 +/- 0.10
B0
3.20 +/- 0.10
E
1.75 +/- 0.10
F
3.50 +/- 0.05
K0
1.0 +/- 0.10
P
4.00 +/- 0.10
P0
4.00 +/- 0.10
P2
2.00 +/- 0.10
T
0.3 +/- 0.05
W
8.00 + 0.30 /- 0.10
SP2574NUTG
D