TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series SP3002 Series 0.85pF Diode Array RoHS Pb GREEN Description The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 GND VCC I/O 2 I/O 3 I/O 1 1 NC 2 I/O 2 3 Gnd 6 I/O 4 5 V CC 4 I/O 3 μDFN-6 (1.6x1.6x0.5mm) SC70-6 and SOT23-6 Functional Block Diagram I/O2 • L ow capacitance of 0.85 pF (TYP) per I/O • L ow leakage current of 0.5μA (MAX) at 5V • E SD protection of ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Small packaging options saves board space • E FT protection, IEC61000-4-4, 40A (5/50ns) • L ightning Protection, IEC61000-4-5, 4.5A (8/20µs) Applications I/O4 VCC • Computer Peripherals • Network Hardware/Ports • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras Application Example GND I/O1 I/O3 +5V D2+ Additional Information D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ Datasheet Resources Samples D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/20/15 A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be floated or NC. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 4.5 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA 6.0 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 VC ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND Diode Capacitance CI/O-I/O 1 Min Typ IPP=1A, tp=8/20µs, Fwd 9.5 11.0 V IPP=2A, tp=8/20µs, Fwd 10.6 13.0 V IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.95 1.1 1.25 pF Reverse Bias=1.65V 0.7 0.85 1.0 pF Reverse Bias=0V 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 -20 1.E+06 0.50 1.E+07 1.E+08 Frequency [Hz] 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/20/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Capacitance vs. Frequency Product Characteristics 2E-12 Lead Plating SC70 & SOT23: Matte Tin μDFN: Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 1.8E-12 1.6E-12 Capacitance [F] 1.4E-12 1.2E-12 1E-12 8E-13 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/20/15 tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — SC70-6 6 Package Pins JEDEC e e 5 4 E 1 2 SC70-6 6 MO-203 Millimeters Min Max 0.80 1.10 0.00 0.10 0.70 1.00 0.15 0.30 0.08 0.25 1.85 2.25 1.15 1.35 0.65 BSC 2.00 2.40 0.26 0.46 HE 3 A A1 A2 B c D E e HE L B D A2 A A1 C Solder Pad Layout L Inches Min Max 0.031 0.043 0.000 0.004 0.028 0.039 0.006 0.012 0.003 0.010 0.073 0.089 0.045 0.053 0.026 BSC 0.079 0.094 0.010 0.018 Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-178 Millimeters Min Notes 0.900 1.450 0.035 0.057 - 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 Ref e1 1.9 Ref 0.0748 Ref a P Max A 0.100 0.600 0.004 10º 0º 6 N M Inches Min A1 L Recommended Solder Pad Layout Max 0º 0.023 6 4,5 6 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. R O © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/20/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — μDFN-6 (1.6x1.6x0.5mm) Bottom View Top View D 6 5 D2 A 0.05 C L 4 4 6 5 0.05 C E E2 Pin 1 Index Area 1 2 3 2 3 B 1 Pin 1 chamfer 0.10 x 45’ ℮ Side View 0.05 C A1 A A3 Seating plane C Package μDFN-6 (1.6x1.6x0.5mm) JEDEC MO-229 Symbol Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.127 Ref A3 0.002 0.005 Ref b 0.20 0.30 0.008 0.012 D 1.50 1.70 0.060 0.067 D2 1.05 1.30 0.042 0.052 E 1.50 1.70 0.060 0.067 E2 0.40 0.65 0.016 0.50 Ref e L 0.25 0.026 0.020 Ref 0.40 0.010 0.016 b 0.10 M C A B 0.05 M C Ordering Information Part Numbering System SP3002-04* TG TVS Diode Arrays (SPA® Diodes) G= Green Series Number of Channels Package H = SOT23-6 J = SC70-6 U = μDFN-6 T= Tape & Reel -04 = 4 channel Part Marking System E*4 E*4 Product Series Number of Channels E = SP3002 series Assembly Site (varies) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/20/15 Part Number Package Marking Min. Order Qty. SP3002-04HTG SOT23-6 E*4 3000 SP3002-04JTG SC70-6 E*4 3000 SP3002-04UTG μDFN-6 (1.6x1.6x0.5mm) E*4 3000 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Embossed Carrier Tape & Reel Specification — SC70-6 Millimetres Symbol Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0± 0.20 10P0 USER DIRECTION OF FEED PIN 1 Inches Min 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 0.27 Max t 0.318 0.010 Max Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 1.5mm DIA. HOLE ACCESS HOLE 14.4mm 4.0mm 1.75mm 2.0mm CL 8mm 4.0mm 13mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 60mm 180mm 8.4mm USER DIRECTION OF FEED PIN 1 D Embossed Carrier Tape & Reel Specification — μDFN-6 (1.6x1.6x0.5mm) t B0 F W E P2 D1 P0 K0 A0 User Feeding Direction Symbol Millimetres Min Inches Max Min Max E 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 1.00 1.25 0.04 1.50 MIN D P0 10P0 3.90 0.05 0.06 MIN 4.10 40.0± 0.20 0.15 0.16 1.57±0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 0.04 COVER TAPE t 0.25 TYP 0.01 TYP Pin 1 Location © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/20/15