Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
MHS Varistor Series
RoHS
Description
The Multilayer High–Speed MHS Series is a very-low
capacitance extension to the Littelfuse ML family of
transient voltage surge suppression devices available in an
0402 and 0603–size surface mount chip.
The MHS Series provides protection from ESD and EFT in
high–speed data line and other high frequency applications.
The low capacitance of the MHS Series permits usage
in analog or digital circuits where it will not attenuate or
distort the desired signal or data.
Their small size is ideal for high–density printed circuit
boards, being typically applied to protect intergrated
circuits and other sensitive components. They are
particularly well suited to suppress ESD events including
those specified in IEC 61000-4-2 or other standards used
for Electromagnetic Compliance (EMC) testing.
Size Table
Metric
EIA
1005
0402
1608
0603
The MHS Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MHS Series is also compatible with modern
reflow and wave soldering prcesses.
Additional Information
Littelfuse Inc. manufactures other multilayer varistor series
products, see the ML, MLE, MLN and AUML Series data
sheets.
Datasheet
Resources
Samples
Applications
Features
• Data, Diagnostic
I/O Ports
•Mobile
Communications
• Halogen-Free and
RoHS compliant
• Universal Serial
Bus (USB)
•Computer/DSP
Products
• Video & Audio Ports
• Industrial Instruments
Including Medical
• 3pF, 12pF, and 22pF
capacitance versions
suitable for high–speed
data rate lines
•Portable/HandHeld Products
• ESD rated to IEC
61000-4-2 (Level 4)
• EFT/B rated to IEC
61000-4-4 (Level 4)
• Low leakage currents
• -55ºC to +125ºC
operating temp. range
• Inherently bi-directional
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
MHS Series
Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) :
V0402/0603MHS03
≤ 42
V
V0402/0603MHS12
≤ 18
V
V0402/0603MHS22
≤ 09
V
Operating Ambient Temperature Range (TA)
-55 to +125
O
Storage Temperature Range (TSTG)
-55 to +150
O
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/09/15
C
C
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Ratings and Specifications
Performance Specifications (25 ºC)
Maximum
Clamping
Voltage At
1A (8X20µs)
Part
Number
Typical
Typical Leakage
Typical
Inductance
Current at Specified Capacitance at
(from Impedance
DC Voltage
1MHz (1V p-p)
Analysis)
3.5V
5.5V
C (Note 4)
L
MIN
MAX
P
IL
Maximum ESD Clamp
Voltage (Note 1)
8kV Contact (Note 2)
Clamp
15kV AIR (Note 3)
Clamp
(Vc)
(V)
(V)
(µA)
(µA)
(pF)
(pF)
(nH)
V0402MHS03N (Note 5)
135
<300
<400
0.5
1.00
2
5
<1.0
V0603MHS03N
135
<300
<400
0.5
1.00
1
6
<1.0
V0402MHS12N (Note 5)
55
<125
<160
0.5
1.00
8
16
<1.0
V0603MHS12N
55
<125
<160
0.5
1.00
8
16
<1.0
30
<125
<160
0.5
1.00
15
29
<1.0
30
<65
<100
0.5
1.00
15
29
<1.0
V0402MHS22N
(Note 5)
V0603MHS22N
NOTES:
1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
2.Direct discharge to device terminals (IEC preferred test method).
3.Corona discharge through air (represents actual ESD event).
4.Capacitance may be customized, contact your Littelfuse Sales Representative.
5.V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information.
6. The typical capacitance rating is discrete component test result.
For applications exceeding 125ºC ambient temperature, the
peak surge current and energy ratings must be reduced as
shown below.
PERCENT OF RATED VALUE
100
80
60
40
Standby Current at Normalized Varistor Voltage and
Temperature
1.2
NORMALIZED VARISTOR VOLTAGE (V)
Peak Current and Energy Derating Curve
0.8
25O
0.6
85O
0.4
125O
0.2
0.0
20
0.0001
0
-55
50
60
70
80
90
100
110
120
130 140 150
AMBIENT TEMPERATURE ( oC)
Figure FIGURE
1
1.
PEAK CURRENT AND ENERGY DERATING CURVE
V0402MHS03
V0603MHS03
50
40
30
V0402MHS22
V0603MHS22
10
0
10
100
1000
1
0
V0402MHS12
V0603MHS12
-10
V0402MHS03
V0603MHS03
-20
-30
Figure 4
1
0.1
Insertion Loss (S21) Characteristics
V0402MHS22
V0603MHS22
V0402MHS12
V0603MHS12
20
0.01
CURRENT (mA)
FIGURE 2. STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
INSERTION LOSS (dB)
NOMINAL VOLTAGE AT 1mADC
60
0.001
Figure 2
Nominal Voltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
Figure 3
1.0
10
100
1000
10000
FREQUENCY (MHz)
FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS
10000
Number of Pulses
FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/09/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Characteristics
Speed of Response
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
Typical Temperature Dependance of the Characteristic
Curve in the Leakage Region
The Multilayer Suppressor is a leadless device. Its response
time is not limited by the parasitic lead inductances found
in other surface mount packages. The response time of the
ZNO dielectric material is less than 1ns and the MLE can
clamp very fast dV/dT events such as ESD. Additionally,
in “real world” applications, the associated circuit wiring
is often the greatest factor effecting speed of response.
Therefore, transient suppressor placement within a circuit
can be considered important in certain instances.
Multilayer Internal Construction
FIRED CERAMIC
DIELECTRIC
VNOM VALUE AT 25 oC (%)
SUPPRESSOR VOLTAGE IN PERCENT OF
100%
METAL
ELECTRODES
METAL END
TERMINATION
DEPLETION
10%
1E -9
Figure 5
25
1E -8
o
50o 75o
1E -7
REGION
100o 125 oC
1E -6
1E -5
1E -4
1E -3
DEPLETION
1E -2
SUPPRESSOR CURRENT (ADC)
REGION
Figure 6
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
GRAINS
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
230
The recommended solder for the MHS suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
230
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MHS chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Figure 7
5.
5.
Wave Solder Profile
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Figure 8
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/09/15
6.
6.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
6.
Lead–free Re-flow Profile
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
60 - 150 SEC
> 217˚C
PREHEAT ZONE
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
5.0
6.0
7.0
Figure 10
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
CHIP LAYOUT DIMENSIONS
E
D
L
W
Note:
Avoid
metal
runs
in this
area,
parts
Note:
Avoid
metal
runs
in this
area,
partsare
arenot
recommended
for usefor
in use
applications
using using
silver
not recommended
in applications
(Ag)Silver
expoxy
(Ag)paste.
epoxy paste.
Dimension
DIMENSION
C
A
mm
A
B
TABLE 1: PAD LAYOUT
DIMENSIONS
0402 Size
0402
1.70
0603
2.54
B
IN
0603 Size
C
MM
mm
in
in
mm
0.067
0.510
0.020
0.610
0.024
0.100
0.760
0.030
0.890
0.035
0.067
0.020
0.024
in
1.700
0.510
0.610
IN
MM
0.100
2.540
0.030
0.760
0.035
0.890
D (max.)
0.024
0.600
0.040
1.000
E
0.01 +/- 0.006
0.25 +/- 0.15
0.015 +/- 0.008
0.4 +/- 0.2
L
0.039 +/- 0.004
1.00 +/- 0.10
0.063 +/- 0.006
1.6 +/- 0.15
W
0.020 +/- 0.004
0.50 +/- 0.10
0.032 +/- 0.006
0.8 +/- 0.15
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/09/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Part Numbering System
V 0402 MHS 03 N R
PACKING OPTIONS (See quantities in Packaging section)
T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape
H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape
R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape
DEVICE FAMILY
Littelfuse TVSS Device
DEVICE SIZE
0402 = .04 inch x .02 inch
(1.0 mm x 0.5 mm)
0603 = .063 inch x .031 inch
(1.6 mm x 0.8 mm)
END TERMINATION OPTION
N = Nickel Barrier (Ni/Sn)
CAPACITANCE DESIGNATION
03 = 3pF
12 = 12pF
22 = 22pF
SERIES DESIGNATOR
MHS = Multilayer Hi-Speed
Packaging*
Quantity
Device Size
13 Inch Reel
("T" Option)
7 Inch Reel
("H" Option)
7 Inch Reel
("R" Option)
0603
10,000
2,500
4,000
0402
not available
not available
10,000
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
Tape and Reel Specifications
D0
T
P0
P2
E
F
K0
W
B0
T1
D1
P1
Symbol
A0
Description
Dimensions in Millimeters
0402 Size
0603 Size
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
8 -/+ 0.2
8 -/+ 0.3
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+.05
3.5 -/+.05
E
Distance Between Drive Hole Centers and Tape Edge
1.75 -/+ 0.1
1.75 -/+ 0.1
P1
Distance Between Cavity Centers
2 -/+ 0.05
4 -/+ 0.1
2 -/+ 0.1
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
2 -/+ 0.1
P0
Axial Drive Distance Between Drive Hole Centers
4 -/+ 0.1
4 -/+ 0.1
D0
Drive Hole Diameter
1.55 -/+ 0.05
1.55 -/+ 0.05
D1
Diameter of Cavity Piercing
T1
Top Tape Thickness
T
Nominal Carrier Tape Thickness
Notes:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/09/15
N/A
1.05 -/+ 0.05
0.1 Max
0.1 Max
1.1
1.1