MAX14526 RELIABILITY REPORT FOR MAX14526EEWP+/ MAX14526BEEWP+/ MAX14526DEEWP+ WAFER LEVEL PRODUCTS June 6, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1 MAX14526 Conclusion The MAX14526EEWP+/ MAX14526BEEWP+/MAX14526DEEWP+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX14526E/MAX14526BE/MAX14526DE are designed to simplify interface requirements on portable devices by multiplexing common inputs (USB, UART, Microphone, Stereo Audio and Composite Video) on a single micro/mini USB connector. The USB input supports Hi-Speed USB and the audio/video inputs feature negative rail signal operation allowing simple DC coupled accessories. These devices allow a single micro/mini USB port to support all the common interfaces on Cellular phones and portable media players over the same external lines. The MAX14526E/MAX14526BE/MAX14526DE feature an I2C serial interface allowing microprocessor control for accessory detection, low-power shutdown mode, enable interrupts, enable MIC bias, and enable click-and-pop reduction for headphones/speakers. The MAX14526E/MAX14526BE/MAX14526DE operate from an independent +2.8V to +5.5V power supply (BAT) or the USB VBUS power supply (VB). The USB power supply input (VB) features an overvoltage protected LDO capable of handling up to +28V. USB charge detect is disabled by default for the MAX14526E/MAX14526DE and enabled by default for the MAX14526BE. The MAX14526E/MAX14526BE/MAX14526DE are available in a 20bump (2.5mm x 2mm) WLP package and are specified over the -40°C to +85°C extended temperature range. Maxim Integrated Products. All rights reserved. Page 2 MAX14526 II. Manufacturing Information A. Description/Function: USB Multiplexer Interface Circuits B. Process: S45 C. Number of Device Transistors: 18270 D. Fabrication Location: California, Texas or Japan E. Assembly Location: Japan F. Date of Initial Production: January 24, 2009 III. Packaging Information A. Package Type: 20-bump WLP 4x5 arrray B. Lead Frame: N/A C. Lead Finish: N/A D. Die Attach: N/A E. Bondwire: N/A (N/A mil dia.) F. Mold Material: None G. Assembly Diagram: #05-9000-3410 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: °C/W K. Single Layer Theta Jc: °C/W L. Multi Layer Theta Ja: 47°C/W M. Multi Layer Theta Jc: °C/W IV. Die Information A. Dimensions: 104 X 84 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Al/0.5%Cu with Ti/TiN Barrier D. Backside Metallization: None E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn) F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn) G. Bondpad Dimensions: H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3 MAX14526 V. Quality Assurance Information A. Quality Assurance Contacts: Richard Aburano (Manager, Reliability Engineering) Don Lipps (Manager, Reliability Engineering) Bryan Preeshl (Vice President of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 MTTF = = 22.9 x 10 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 48 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) -9 = 22.9 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor. Cumulative monitor data for the S45 Process results in a FIT Rate of 0.49 @ 25C and 8.49 @ 55C (0.8 eV, 60% UCL) B. E.S.D. and Latch-Up Testing (lot TRTYAA046F, D/C 0929) The AJ67-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/- 2500V per JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/- 250mA and overvoltage per JEDEC JESD78. Maxim Integrated Products. All rights reserved. Page 4 MAX14526 Table 1 Reliability Evaluation Test Results MAX14526xEEWP+ TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES COMMENTS DC Parameters & functionality 48 0 TRTZEA007C, D/C 0909 Note 1: Life Test Data may represent plastic DIP qualification lots. Maxim Integrated Products. All rights reserved. Page 5