MAX8968

MAX8968
RELIABILITY REPORT
FOR
MAX8968EWL+T
WAFER LEVEL PRODUCTS
January 10, 2012
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Richard Aburano
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
Page 1
MAX8968
Conclusion
The MAX8968EWL+T successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX8968 is a simple step-up converter that can be used to power a Class D loud speaker amplifier. The IC is designed to limit transient voltage
to less than 100mV above nominal output voltage as well as providing input under voltage lockout, built-in protection under short circuit, and high
temperature conditions. The IC transitions to SKIP mode seamlessly under light load conditions to improve efficiency. Under these conditions,
switching occurs only as needed, hence reducing switching frequency and supply current to maintain high efficiency. When the input voltage is
sufficient to drive the load, the IC can be operated in automatic track mode (ATM) or track mode. In track mode, the p-channel MOSFET acts as a
current limited load switch and quiescent current is a low 30ìA under a no load condition. In ATM mode, the p-channel MOSFET acts as a current
limited load switch and quiescent current is a low 60ìA under a no load condition. In ATM mode, the internal boost circuitry is enabled allowing for fast
transitions into boost mode. The IC is available in a small 1.25mm x 1.25mm, 9-bump WLP (0.4mm pitch).
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MAX8968
II. Manufacturing Information
A. Description/Function:
Step-Up Converter for Handheld Applications
B. Process:
S18
C. Number of Device Transistors:
10097
D. Fabrication Location:
Taiwan
E. Assembly Location:
Japan and Thailand
F. Date of Initial Production:
September 30, 2011
III. Packaging Information
A. Package Type:
9-bump WLP 3x3 array
B. Lead Frame:
N/A
C. Lead Finish:
N/A
D. Die Attach:
N/A
E. Bondwire:
N/A (N/A mil dia.)
F. Mold Material:
None
G. Assembly Diagram:
#05-9000-4345
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
°C/W
K. Single Layer Theta Jc:
°C/W
L. Multi Layer Theta Ja:
83°C/W
M. Multi Layer Theta Jc:
°C/W
IV. Die Information
A. Dimensions:
50 X 50 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.23 / Metal2-3 = 0.28 / Metal 4 = 2.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.23 / Metal2-3 = 0.28 / Metal 4 = 3.0 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX8968
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (
=
1
MTTF
=
= 8.8 x 10
) is calculated as follows:
1.83
(Chi square value for MTTF upper limit)
500 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 8.8 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S18 Process results in a FIT Rate of 0.06 @ 25C and 1.04 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot VX2YBA006A, D/C 1139)
The PQ86-1 die type has been found to have all pins able to withstand a transient pulse of:
ESD-HBM:
ESD-CDM:
+/- 2000V per JEDEC JESD22-A114
+/- 750V per JEDEC JESD22-C101
Latch-Up testing has shown that this device withstands a current of +/- 250mA and overvoltage per JEDEC JESD78.
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Page 4
MAX8968
Table 1
Reliability Evaluation Test Results
MAX8968EWL+T
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135C
Biased
Time = 500 hrs.
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
48
0
VX2YBA006A, D/C 1139
Note 1: Life Test Data may represent plastic DIP qualification lots.
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