131211-AN04E-Instruction Mannual(COB LED package).ai

Instruction Manual
(COB LED Package)
CONTENTS
1. Product Description
P.2
2. Handling COB LED package
P.3
3. Soldering Process
P.6
4. Mechanical Assembly
P.7
5. Thermal Design
P.10
6. Electrical Connection
P.11
7. Chemical Incompatibility
P.14
8. Solutions
P.15
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan Tel. +81-555-23-4121 http://ce.citizen.co.jp
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
Ref.CE-P2468 03/13_R1(1213)
1, Product Description
1-1,
Introduction
Citizen Electronics has been seeking the highest level of
brightness and efficacy in the LED package industry. In
addition, we have endeavored to work out technical
solutions for many years. Through our advanced manufacturing technique and packaging technology, Citizen
Electronics COB LED package series product will bring
you a lighting space full of delight and beauty.
1-2,
Citizen Electronics COB LED Package series delivers “A
world’s best Lumen performance and efficacy”, “High
reliability and long life based on proven data by actual
measurement”, “Extensive product lineup”.
This application note provides recommendations for handling,
soldering, mechanical assembly, thermal design, electrical
connection, chemical Incompatibility, solutions.
Product Description of COB LED Package
The mechanical feature of COB LED package series shows
in Figure1. COB LED package has Anode (positive
electrode) and Cathode (negative electrode) on the
aluminum board. The resin area is composed of mounting
LED dices on the aluminum board and enclosing them by
silicone resin including fluorescent substance.
Besides it is possible for COB LED Package to be
assembled into the heatsink directly, though it is not
possible for SMD type of LED package. Therefore it is not
necessary to use the mounting flow and printed circuit
board. COB LED Package has high thermal dissipation
performance by mounting LED dies directly on the
aluminum board.
COB LED package series makes it possible to design the
LED light fixture downsized. Example application for
using the COB LED package fixture is street light, down
light, spot light, bulb.
■Figure1 COB LED package
Anode
Resin area
Aluminum board
Cathode
(TC measurement point)
2
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
2 , Handling COB LED Package
2-1,
Precaution for taking out from the tray
COB LED package series are supplied by packing tray
which made from electrically conductive polystyrene.
(Figure2) Please be aware to hold edge part of the tray and
transport. (Figure3) If the force applied to the resin area
inside of the tray, the bottom surface of the tray may press
the resin area and have negative impact into the function,
performance and reliability of these products.
■Figure3 The way for Transporting the tray
Correct
■Figure2 Appearance of the packing tray
Wrong
NG
The packing tray is designed stackable without contact and
press this product, in the case trays are stacked on the same
direction by matching the reference surface. (Figure8)
Please be aware to open the tray on a flat surface and treat
the LED package under the clean environment avoiding
dust and particles, which may adhere to the resin area of
the LED package.
In the case the reference surface is set on left bottom side,
Don’t push the tray
the direction of LED package(cathode and Anode electrical
pad) is located like Figure4.
It is strongly recommended to use antistatic gloves for
taking out from the packing tray, and not to handle by
naked finger. (Figure5) In addition, please avoid the sharp
objects like tweezers to catch and hold of LED packages,
because they may affect the wire inside of the resin area to
be disconnection, and it may affect the light break down.
■Figure4 The package part of the packing tray
■Figure5 The recommended way to hand out the production
Anode
Cathode
Reference surface
3
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
2-2,
Precaution for holding
Please be aware to avoid putting mechanical stress on the
LED package especially the resin area. It may affect LED
light break down.
Please handle the LED package with care. It is recommended to wear antistatic gloves to prevent dirt or other
contaminants from adhering to the resin area. They may
affect negative impact to the optical performance of LED
package. Please ensure that any objects don’t attach and
push the resin area.
Please do not use sharp objects like tweezers to catch and
hold of LED packages. The wire inside of the resin part
may be disconnection and it may affect the light break
down.
The recommended way to handle shows in Figure6.
■Figure6 Recommended way to handle
Correct
Strongly recommended
to use antistatic gloves
Wrong
NG
NG
Do not use tweezers
Do not touch the resin area
NG
Do not touch with naked finger
NG
Do not touch the resin area
4
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
2-3,
Precaution for handling
i) The resin part is composed of the light emitting area and white dam erea. Please avoid the sharp objections (Figure7) to press
the resin or stress, rub, attach and contact with. They might be affect the function, performance and reliability of this product to
attack negatively impact.
■Figure7 Prohibitions of press the resin area
Wrong
NG
Screw Driver
NG
NG
Pen
NG
Finger
Tweezer
NG
Screw
ii) Please make sure the resin area should not be attached and contact by any other parts during assembly process. (Figure8)
■Figure8 Prohibition of contact between the resin area and other parts
Correct
Wrong
NG
Assembly part contact the emitting surface.
iii) Please be aware not stack this product, It might occur damage into the LED package such as peeled, clacked, wire disconnected.
(Figure9)
■Figure9 Prohibition of stacking LED packages
Wrong
NG
5
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
3 , Soldering Process
3-1,
3-2-2,
Position of Soldering Lead Wire on the soldering pad
Recommended Soldering process
This product is not adaptable to reflow process. The
conditions below are recommended for soldering.
Please refer the positioning between the lead wire and the
soldering pad at pictures below.(Figure10)
Recommended soldering condition
Out put of soldering iron :
■Figure10 The way for soldering lead wire
Soldering bit temperature shall be 350℃ or less
Heating time : 3.5 seconds or less per land
Correct
Not over the conductive part of wire from soldering pad.
No external force shall be applied to the resin area. In
addition, please ensure that the soldering bit has no contact
with the resin area.
Next process of soldering should be carried out after the
product has returned to ambient temperature.
3-2,
Recommended Soldering Appearance
3-2-1, Appearance Condition of Soldering Lead Wire
Make sure following the items.
1, The soldering fillet is formed.
2, The core part is solderad well.
3, The solder has shiny appearance.
4, There is not the protuberance or extreme raised on
soldering.
5, The lead wire don’t floot up from the pad.
6, The solder covers well around outside and the side
surface of lead wire.
7, There is not attach soldering (e.g. soldering ball, soldering
flux) at out of the designated pad for soldering extremely.
The solder lands on the 2/3 space of pad of LED package
8, board.
The conductive part of lead wire doesn’t land on the
9, outside of the soldering pad.
The height of the conductive part of lead wire and the
10, soldering don’t put over the height of the insulated
plastic part.
Wrong
NG
The conductive part of wire is over from soldering pad.
NG
NG
6
Over at front edge
Over at bottom edge
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
4, Mechanical Assembly
4-1-1,
Reference Assembly1:
M3Screw, Thermal conductivity two sided adhesive sheet
Regarding assembling COB LED package CLL020,
CLL022, CLL030, CLL032, CLL040, CLL042,CLL050,
CLL052, CL-L100 series it is possible to fix on heatsink
directly with M3 screw by using TI M (thermal interface
material). A reference assembly of a lighting system is
showing in Figure11.
It may be applied to mounting screws is 0.6 Newtonmeters.
Please follow the position information of Figure12 for
fixture with M3 screws. It is strongly recommend to
tightening screws on heatsink by second time, at first fix
each side of screw temporarily, and tightening them finally
in order not to put over power of mechanical stress into
LED package.
In order to reduce the thermal resistance at assembly,
please use TIM on whole contact surface of the product. In
the case of using thermal grease as the TIM, it is recommend to apply uniformly on the contact surface of the
product. For using thermal sheet as the TIM, it is recommend to make sure that the product is not strained by stress
when the screws are tightened for assembly.
In addition, regarding assembling COB LED package
CLL010, CLL012, please use the thermal conductivity
two-sided adhesive sheet to fix on heatsink. As a reference
information, we offer the information of TC-20SAS
(Shin-Etsu Chemical Co., Ltd.).
Dielectric voltage withstand test has been conducted on
this product to see any failure after applying voltage
between active pads and aluminum section of the product,
and to pass at least 500V. Please confirm your final
product for electrical safety of your product.
■Figure11 Reference assembly as fixing with M3 screws
M3 screw
Spring washer (≦Φ6mm)
Flat washer (≦Φ6mm)
TIM
Heatsink
■Figure12 Recommended screw location and pitch
46.5
12.8
22.8
18.3
12.8
32.0
18.3
22.8
32.0
CLL020
CLL022
CLL030
CLL032
CLL040
CLL042
CLL050
CLL052
7
CL-L100series
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
4-1-2,
Reference Assembly2 : Connector
A reference assembly of a lighting system using COB LED package shows in Figure13,14.
Connector, COB LED package, TIM, Heatsink are assembled like Figure13.
Please use TIM for better condition of heat dissipation.
There is information about the recommended connector on “8, Solutions” of this application note.
Please follow the specification of each maker’s connector.
■Figure14
■Figure13 Reference Assembly
Assembly image
Connector
COB LED Package
TIM(Thermal Interface Materials)
Heatsink
8
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
4-2,
Precaution for assembly
i) Please be aware to contact the resin area of the COB
LED package during assembly. Please do not use sharp
objects especially finger, screw, screw driver, pen to catch
and hold of LED package. The wire inside of the resin area
may be disconnection and affect the light breakdown.
(Figure15)
ii) In the case of assembling , please be aware to use the
correct way which is followed by the specification of each
products. Besides please do not fix
the product by over torque and put huge stress into the
product. (Figure16)
■Figure16 Prohibit huge stress and over torque
■Figure15 Prohibit using sharp objects
Wrong
Wrong
NG
Finger nail
NG
NG
Over torque
Screw
iii) Please assemble the correct way and not to push the
resin area with any other parts during assembling the
product. (Figure17)
■Figure17 Prohibit incorrect assembly
Wrong
NG
Screw driver
NG
Pen
NG
9
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
5, Thermal Design
5-1,
Significance of the heat dissipation structure
An LED package radiates light and heat according to the
input power. However, the surface area of an LED package
is quite small, and the package itself is expected to release
little heat into the atmosphere. An external radiator such as
a heatsink is thus required. The heat dissipation structure up
to the connection portion of the external radiator uses
mainly heat conduction.
Regarding LED packages, to control the junction temperature of the LED dice Tj is important. The Tj must be kept
from exceeding the absolute maximum rating in the
specifications under any conditions. As direct measurement
of the junction temperature of a LED dice inside a package
is difficult, the temperature of a particular part on the
5-2,
external package (the case temperature) Tc [℃ ] is normally
measured. Tj [ ℃ ] is calculated using the thermal resistance
between the junction and the case Rj-c [ ℃ / W], and the
input power Pi [W] considered as the emitted heat amount.
The heat generated at the LED dice can be conducted to the
external radiator efficiently because the package structure
for the COB LED package minimizes the thermal resistance
Rj-c.
This document describes the detailed heat dissipation
structure of the COB LED package and provides data
necessary for thermal design of the lighting apparatus to
maximize performance.
Package structure and thermal resistance
The cross-sectional structure example, where the COB LED
package is connected to an external heatsink, is shown in
Figure18.The package has a laminated structure of an
aluminum substrate, insulating layers and conductive
cooper foil pad.
A distinctive point is that the LED dice is mounted directly
on the well conductive aluminum substrate not on the
insulating layer, which has low thermal conductivity. Thus,
the heat generated at the LED dice can be efficiently
conducted to the outside of the package.
The aluminum substrate side of the package outer shell is
thermally connected to the heatsink via TIM. As described
above, the heat generated in the junction section of the
LED dice is transferred mainly to the heatsink using heat
conduction, through the LED dice to the adhesive for
diemounting to the aluminum substrate to the TIM. The
thermal resistance between the junction section of the LED
■Figure18 COB LED package
Cross-Section diagram
LED die
TJ
dice and the aluminum substrate side of the package outer
shell is Rj-c, and the specific thermal resistance value of
the package. Therefore, the following formula is used:
Tj = Rj-c ・ Pi + Tc
In addition, the thermal resistance of the TIM outside the
package is R-TIM [ ℃ / W], the thermal resistance with the
heatsink is Rh [ ℃ / W], and the ambient temperature
is Ta [℃].
Figure19 indicates the equivalent thermal resistance along
the cross-sectional diagram in Figure18. As indicated, the
thermal resistances Rj-c, R-TIM, and Rh are connected in
series between the junction
■Figure19
temperature Tj and the
Thermal Resistance Connection
ambient temperature Ta. The
thermal resistances outside the
Tj
Tj
package R-TIM and Rh can be
integrated into the thermal
Rj-c
Rj-c
resistance Rc-a at this point.
Tc
Tc
Thus, the following formula is
R-TIM
Rc-a
also used:
Tc
Aluminum
TIM
Rj-c
R-TIM
Tj = ( Rj-c + Rc-a ) ・ Pi + Ta
Rh
Rh
Ta
Heatsink
Ta
Ta
10
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
6, Electrical Connection
6-1,
Introduction
Prior to driving an LED package, which is a kind of
semiconductor, it is necessary to thoroughly comprehend
its characteristics because it has various elements. For
example, the forward current ‘If’ varies widely with
fluctuation in the forward voltage ‘Vf’. In the case of
Figure20, a 10% rise in Vf results in an increase of If by
more than 40% under constant temperature conditions.
The fluctuations in If have a significant influence on light
emission and heat generation of LED packages. Especially,
strict control of If is required for high-power LED
packages used for lighting because they are driven by large
current. In addition, the measures taken against heat
release by an LED package are a crucial factor as Vf varies
with temperature. When driving our LED packages, please
be sure to read the relevant specifications and application
notes and take appropriate measures according to their
characteristics.
6-2,
■Figure20
Vf-If characteristic
(%)
160
Relat ive If cha nge
140
120
100
80
60
40
80
100
90
120
110
Relat ive Vf cha nge
(%)
Constant current drive system (recommended)
The system that continues to supply a certain current to an
LED package even under the conditions that Vf varies with
heat generation or other factors is said to be a ‘constant
current drive system’. This system allows relatively stable
driving of LED packages even under changing environmental conditions or other parameters.
In general, an LED package has a tendency for Vf, which
applies a certain current to an LED package, to decrease as
the temperature increases. (Figure21)
Citizen Electronics recommends the constant current drive
system to ensure stable light emitting output and reliability.
■Figure21
Tc-Vf characteristic
Relat ive Vf cha nge
(%)
110
105
100
95
90
0
20
40
60
Ca se t empe r at u re Tc
11
80
100
(℃)
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
6-3,
6-4,
Constant voltage drive system
Whereas the constant current drive system continues to
supply a certain current to an LED package, the system
that continues supplying a certain voltage to an LED
package is said to be a ‘constant voltage drive system’. As
described above, an LED package has a tendency for Vf,
which applies a certain current to an LED package, to
decrease as the temperature increases. In the case of
Figure18, when the case temperature Tc is 90°C, the same
amount of current is achieved by approximately 5% lower
Vf than that of the condition in which Tc is 25°C. From
another perspective, when an LED package is operated
with a certain voltage, the more the temperature increases,
the larger the current that flows through the LED package.
In cases of driving with a constant voltage, as shown in
Figure22, temperature changes lead to changes in Vf and
current as the temperature of an LED package is unstable
due to variance in environmental temperature or other
factors. Accordingly, the brightness of an LED package can
be unstable as it depends on current. Thus, when driving
with a constant voltage is employed, an appropriate
measure such as the connection of current control
resistance needs to be implemented based on an assumption of the temperature in actual use.
■Figure22
Precautions for inrush current
When an LED package is connected to capacitive load
such as a capacitor, instantaneous inrush current may occur
during on/off operations. For instance, this includes the
case where the second side of energized power circuit is
turned on/off. Citizen Electronics recommends usage that
avoids the occurrence of inrush current as much as
possible. In cases where the occurrence of inrush current is
unavoidable, please be sure to take measures to prevent
exceeding the absolute maximum rating of the relevant
LED package.
6-5,
Connection between multiple
LED packages
When connecting multiple identical LED package
products, the series connection makes current flowing
through LED packages uniform. Citizen Electronics
recommends series connection to ensure stable lightemitting output and reliability. On the other hand, a
parallel connection should be considered for Vf variation
between LED packages. Some measures, such as the
appropriate current regulation resistor being connected to
each LED package in series based on the temperature
conditions in actual use, are required to apply even current
to each LED package with different Vf characteristics.
Instability due to driving with constant current
Temperature change of LED package
Vf change
Current change
Brightness change
12
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
6-6,
A parallel connection of LED packages
There is the way below for using n LED packages as the parallel connection.
6-6-1, The case of using constant current drive system
The way to prepare the Constant current circuit for each LED package line.(Figure23)
■Figure23
■ If1,Ifn
LP n
LP1
If 1
volt age
sou rce
If n
Current for each LED package
■ CC1,CCn
Constant Current drive
V
CC1
■ LP1,LPn
CCn
LED package
6-6-2, The case of using current-limiting resistor
The equivalence circuit in the case setting current-limiting resistor for each LED package line.(Figure24)
■Figure24
■ If1,
LP n
LP1
constantvoltage
source
If 1
Current for each LED package
■ R1,
If n
Ifn
Rn
Current-limiting resistor
V
Rn
R1
13
■ LP1,
LPn
LED package
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
7, Chemical Incompatibility
The LED pakage contains a silicone to protect the LED dies and the silicone is gas permeable.
Some VOCs(volatile organic compound) and chemicals will cause discoloration, surface damage, crack, erosion.
Table1 is showing the list of harmful materials will damage the silicone. Please do not use them together with the LED package.
If it is necessary to use them together, please consider and test them before use.
■Table1
List of harmful materials that will damage the silicone.
~ Chemical Name ~
hydrochloric acid
sulfuric acid
nitric acid
acetic acid
sodium hydroxide
potassium hydroxide
ammonia
MEK (Methyl Ethyl Ketone)
MIBK (Methyl Isobutyl Ketone)
Toluene
Xylene
Benzene
Gasoline
Mineral spirits
dichloromethane
tetrachloromethane
Castor oil
lard
linseed oil
petroleum
silicone oil
halogenated hydrocarbons (containing F, Cl, Br elements)
rosin flux
14
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
8, Solutions
The short list below shows some commercially available design resources. Citizen Electronics introduce a variety of solutions
(Optical solutions, Thermal solutions, Electrical solutions, Electrical devices, Connectors, Sockets) that may be used to handle and
assemble Citizen Electronics LED package approved or qualified suppliers for customers convenience. It is the responsibility of the
customer to fully qualify and validate luminaire design components and assembly processes to meet all code and regulatory
requirement. Please check the detail at the URL site below. This information contained in URL may be changed without notice.
Top page of solution information
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/index.html
Optical solutions
Introducing manufacturers who provide lenses, reflectors or holders for our LED packages.
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/lens.html
Thermal solutions
Introducing manufacturers who provide heatsink, thermal interface materials for our LED packages.
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/heat.html
Electrical solutions
Introducing manufacturers who provide power supplies, drivers for our LED packages.
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/power.html
Electronic devices
Introducing manufacturers who provide electronic devices for our LED packages.
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/device.html
Connectors
Introducing manufacturers who provide connectors for our LED packages.
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/connector.html
Sockets
Introducing manufacturers who provide Socket for our LED packages.
URL
http://ce.citizen.co.jp/lighting_led/en/technology/solutions/socket.html
15
Copyright © 2010 CITIZEN ELECTRONICS CO., LTD. All Rights reserved.
CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121 http://ce.citizen.co.jp
Ref.CE-P2468 03/13_R1(1213)
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● This technical information or data shall be provided ‘as is’ to users and CITIZEN
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this technical information or data, conformance of this technical information or data to
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● CITIZEN ELECTRONICS CO., LTD. reserves the right to make changes to technical
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CITIZEN ELECTRONICS CO., LTD.
1-23-1, Kamikurechi, Fujiyoshida-shi, Yamanashi, 403-0001, Japan
Tel. +81-555-23-4121
http://ce.citizen.co.jp
Requests / Inquiries
inquiry@ce.citizen.co.jp
Website for LEDs for lighting
http://ce.citizen.co.jp/lighting_led/jp/
Ref.CE-P2468 03/13_R1(1213)