The
DDX File Format
A review of ES59008-6-1
and IEC 62258 Part 2
ES59008 & IEC62258 are now available
from BSI Publications
Alun Jones
www.micross.com
Background
• GOOD-DIE project established under ESPRIT to
co-ordinate European efforts on die information
• Project task to review current standards for die
• Requirements noted for technical data on die
products, its availability, exchange and use in
CAD systems
• Current standards were not seen as adequate for
all needs
• ENCAST project continuing on the standards
development.
Acknowledgements
• The project participants are grateful for financial
support from the European Commission under
the ESPRIT 4th Framework initiative
• Other organisations who have contributed to
the work include :
– IMEC, Alcatel, Philips Semiconductors AG, SAAT Technology Ltd, Micross
Components Ltd., TS2 Ltd., Mintech Semiconductors, Austin Semiconductors
Ltd., Eltek Semiconductors Ltd, Codus Ltd, Lucas Aerospace, Infineon, Die
Products Consortium, Hitachi, British Standards Institution, CENELEC, National
Semiconductor, Chip Supply Inc, MCC, Micronas, GEC-Plessey Semiconductors,
Temic, VDE, University of Manchester UK,
Data requirements for
semiconductor die –
ES 59008
•
•
•
•
•
•
Part 1
General requirements
Part 2
Vocabulary
Part 3
Mechanical, material and connectivity requirements
Part 4
Specific requirements and recommendations
– Part 4-1 Test and quality
– Part 4-2 Handling, assembly and storage
– Part 4-3 Thermal
– Part 4-4 Electrical simulation
Part 5
Particular requirements and recommendations for die types
– Part 5-1 Bare die
– Part 5-2 Bare die with added connection structures
– Part 5-3 Minimally-packaged die
Part 6
Exchange data formats and data
– Part 6-1 Data exchange - DDX
– Part 6-2 Data dictionary
IEC 62258
Minimum requirements for the procurement and
use of semiconductor die products
•
•
•
•
•
•
•
•
•
•
Part 1:
Requirements for procurement and use
Part 2:
Exchange data formats
Part 3:
Recommendations for good practice in handling, packing and
storage (Technical Report)
Part 4:
Questionnaire for die users and suppliers (Technical Report)
Part 5:
Requirements for information concerning electrical simulation
Part 6:
Requirements for information concerning thermal simulation
Part 7:
XML schema for data exchange (Technical Report)
Part 8:
EXPRESS model schema for data exchange (Technical
Report)
Part 9:
Visual inspection (Technical Report)
Part 10:
Die data sheets (Technical Report)
Exchange data formats - DDX
• Defines the format required for the transfer of data
by electronic media -
Device Data eXchange format … DDX
• Contains fundamental Geometric and Electrical
interconnect data
• File contents purely textual / ASCII
– Totally readable
Exchange data formats – DDX
AIMs and GOALs
• Simple textual structure allows :
– Easily read, adjusted and understood
• can be created by a text editor or spreadsheet
– Simple and tolerant syntax
• case and space insensitive for key parameters
• easily written by engineers and non-engineers !!
• simple parsing requirements for CAD systems.
– Simple BLOCK structure
• may be used as a component or project library file
– Small file size
• containing only the bare essentials
– Permits reference to external data / simulation files
– Flexibility, permitting additional component types
Exchange data formats - DDX
Fundamentals
• Data types
– Textual String
– Textual Name (limited ASCII set for O/S)
– Real Numeric
– Integer Numeric
– Date (ISO 8601:1988 format compliant)
• Parameters
– Parameter = Value ; …… That’s it !!!
• Structures
– Main Block structure for a specific device & form.
– Structures for
• Terminals
• Terminal types
Exchange data formats - DDX
Fundamentals : Block Structure
• Typical DEVICE Block Structure :
DEVICE SN7400AJ bare_die {
relevant data for device “SN7400AJ” as a bare die..
}
DEVICE PAL22V10CEP bare_die {
relevant data for device “PAL22V10CEP” as a bare die..
}
DEVICE PAL22V10CEP bumped_die {
relevant data for device “PAL22V10CEP” as a bumped die..
}
• Current Device forms :
–
–
–
–
bare_die
bumped_die
mpd (minimally packed device)
lead_framed_die
Exchange data formats - DDX
Parameters
•
Text data
– Device Version, Manufacturer, Function, Mask, Mask revision, materials
– DDX file version, data source
•
Geometric data
– Dimension Units, Geometric View, Geometric Origin
– Size, Thickness and dimensional tolerances
– Terminal shapes, sizes, location & orientation
•
Interconnect & Electrical data
– Terminal names, I/O properties & function, substrate connections
– Fabrication Technology. Operational Temperature & Power Dissipation
– Data specific to external Simulation model files
•
Additional data
– Device & technology specific details. Delivery form data.
– Fiducial details and graphic links. Additional material details.
Exchange data formats - DDX
Parameters : The TERMINAL_TYPE structure
•
Single TERMINAL_TYPE declaration :
TERMINAL_TYPE Terminal_type_name = Terminal_shape_type, Co-ordinates.,,,;
•
Multiple TERMINAL_TYPE declaration :
TERMINAL_TYPE {
Terminal_type_name = Terminal_shape_type, Co-ordinates .,,,;
Terminal_type_name = Terminal_shape_type, Co-ordinates .,,,;
Terminal_type_name = Terminal_shape_type, Co-ordinates .,,,;
}
Where ...
Terminal_type_name
Unique name for the Terminal Type.
Terminal_shape_type
Single character indicating the shape, as Rectangle, Circle, Ellipse, Polygon.
Co-ordinates .,,,;
A series of X & Y co-ordinates required to determine the Terminal Type shape.
Notes …
The origin for placement is defined as (0,0) relative to the given co-ordinates.
Exchange data formats - DDX
Parameters : The TERMINAL structure
•
Single TERMINAL declaration :
TERMINAL T_n = conn_N, Term_type_name, X-co., Y-co., orient., Term_name, IO_type;
•
Multiple TERMINAL declaration :
TERMINAL {
T_n = conn_N, Term_type_name, X-co., Y-co., orient., Term_name, IO_type;
T_n = conn_N, Term_type_name, X-co., Y-co., orient., Term_name, IO_type;
T_n = conn_N, Term_type_name, X-co., Y-co., orient., Term_name, IO_type;
}
Where ...
T_n
conn_N
Term_type_name
X-co, Y-co, orient
Term_name
IO_type
Unique Terminal number.
Non-unique connection number (may be used to indicate multiple pin connections)
Name of Terminal Type, as previously declared
X and Y co-ordinates and orientation for the placement of the Terminal
Non-unique name, used as placement text, only used for user reference and graphic display.
Single character electrical function descriptor, e.g.
I … digital Input,
O … digital Output
V … Supply, may be any supply type,
G … Ground, etc.
Exchange data formats - DDX
An example (part 1)
• The BLOCK Header with with block and device
history.
DEVICE Reindeer1 bare_die {
# A hash indicates the remaining line is ignored
BLOCK_CREATION_DATE = “1997-12-25”;
BLOCK_VERSION = 1.0;
MANUFACTURER
= “Santa Claus Logic Ltd.”;
DATA_SOURCE
= “GOOD-DIE Project database”;
VERSION
= “1.2.0”;
• Declaration of geometric view, units, size etc.,
GEOMETRIC_UNITS
GEOMETRIC_VIEW
SIZE
SIZE_TOLERANCE
THICKNESS
THICKNESS_TOLERANCE
GEOMETRIC_ORIGIN
=
=
=
=
=
=
=
millimetre;
“top”;
1.312, 1.050;
0.00, 0.0005, 0.00 0.0005;
0.360;
0.00, 0.0007;
0,0;
Exchange data formats - DDX
An example (part 2)
• Additional details of Die type and usage.
MASK_REVISION
MAX_TEMP
POWER_RANGE
DIE_SEMICONDUCTOR_MATERIAL
IC_TECHNOLOGY
DIE_SUBSTRATE_CONNECTION
DIE_TERMINAL_MATERIAL
DIE_PASSIVATION_MATERIAL
=
=
=
=
=
=
=
=
“Mask 1.0”;
280;
0.500;
“Silicon”;
“bipolar”;
“CONN”,”Ground”;
“Al”;
“Polyimide”
• Delivery details.
DIE_BACK_DETAIL
DIE_DELIVERY_FORM
WAFER_SIZE
= “Back-Lapped”;
= “Die, Wafer”;
= “4 inch”;
Exchange data formats - DDX
An example (part 3)
• Definition of the number of bond pad types, bond pads and
connections.
TERMINAL_TYPE_COUNT
TERMINAL_COUNT
CONNECTION_COUNT
= 5;
= 8;
= 14;
• Definition of the bond pad shapes and dimensions.
TERMINAL_TYPE
PADR1
PADR2
PADR3
PADC1
PADP1
=
=
=
=
=
{
Rectangle,
Rectangle,
Rectangle,
Circle,
Polygon,
}
0.144, 0.104;
0.264, 0.104;
0.084, 0.084;
0.100;
(-0.0175,-0.042),(-0.042,-0.0175),
(-0.042, 0.0175),(-0.0175, 0.042),
( 0.0175, 0.042),( 0.042, 0.0175),
( 0.042,-0.0175),( 0.0175,-0.042);
Exchange data formats - DDX
An example (part 4)
•
Bond pad placement, naming, orientation and connectivity
details.
TERMINAL {
}
T_1
T_2
T_3
T_4
T_5
T_6
T_7
T_8
=
=
=
=
=
=
=
=
1 ,PADC1,-0.550, 0.416,
3 ,PADP1,-0.502, 0.190,
4 ,PADP1,-0.502,-0.192,
7 ,PADC1,-0.399,-0.442,
8 ,PADR2, 0.498,-0.442,
11,PADR3, 0.511,-0.171,
12,PADR3, 0.511, 0.171,
14,PADR1, 0.558, 0.416,
0,VCCA
,P;
0,INPUTA ,I;
0,INPUTB ,I;
0,GNDA
,G;
0,GNDB
,G;
0,OUTPUTA,O;
0,OUTPUTB,O;
0,VCCB
,P;
• Details of a reference fiducial, supplied as a JIF graphic file
FIDUCIAL_TYPE fiduc1 = “Xmas.JIF”, 0.072, 0.055;
FIDUCIAL F1 = fiduc1, -0.612, 0.470, 0;
Exchange data formats - DDX
An example (part 5)
•
•
•
Details of a supplied pSpice simulation model.
SIMULATOR_SPICE_MODEL_FILE
= “Rudolph.MOD”;
SIMULATOR_SPICE_MODEL_FILE_DATE
= “1997-09-17”;
SIMULATOR_SPICE_NAME
= “pSpice”;
SIMULATOR_SPICE_VERSION
= “4.0.1”;
SIMULATOR_SPICE_COMPLIANCE
= “2G6”;
Details of a supplied Spectre simulation model.
SIMULATOR_SPECTRE_MODEL_FILE
= “Prancer.S”;
SIMULATOR_SPECTRE_MODEL_FILE_DATE
= “1998-11-05”;
SIMULATOR_SPECTRE_NAME
= “Spectre”;
SIMULATOR_SPECTRE_VERSION
= “4.2.1, 1992”;
SIMULATOR_SPECTRE_COMPLIANCE
= “2G6, Level-3”;
End of the block
}
Exchange data formats - DDX
• XML model File (.XML) example available
– courtesy of Dr. Donald Radley, ENCASIT
• EXPRESS Model available
– courtesy of
• Prof. Hilary Kahn and Dr. Alan Williams
• University of Manchester, UK
• STEP Physical File (SPF) example available
– courtesy of Dr. Donald Radley, ENCASIT
IEC 62258
• Part 2 includes DDX Format version at
1.3.0 as of 1st Maintenance issue, Oct 2008
• Full XML model in Part 7
• Full EXPRESS model in Part 8
• STEP Physical File example included
• Additional parameters
• Enhanced explanatory annexes.
Partial parameter listing (1)
–
BLOCK_CREATION_DATE
–
SIZE_TOLERANCE
–
BLOCK_VERSION
–
THICKNESS_TOLERANCE
–
VERSION
–
TERMINAL_COUNT
–
DEVICE_FORM
–
TERMINAL_TYPE_COUNT
–
DEVICE_NAME
–
CONNECTION_COUNT
–
DIE_MASK_REVISION
–
TERMINAL_TYPE
–
MANUFACTURER
–
TERMINAL
–
DIE_NAME
–
IC_TECHNOLOGY
–
DIE_PACKAGED_PART_NAME
–
DIE_SEMICONDUCTOR_MATERIAL
–
DIE_SUBSTRATE_MATERIAL
–
DIE_SUBSTRATE_CONNECTION
–
DIE_PASSIVATION_MATERIAL
–
DIE_TERMINAL_MATERIAL
–
DIE_BACK_DETAIL
–
WAFER_SIZE
–
MAX_TEMP
–
POWER_RANGE
–
FUNCTION
–
DATA_SOURCE
–
DATA_VERSION
–
GEOMETRIC_UNITS
–
GEOMETRIC_VIEW
–
SIZE
–
THICKNESS
–
GEOMETRIC_ORIGIN
Partial parameter listing (2)
–
TEMPERATURE_RANGE
–
FIDUCIAL_TYPE
–
Simulator MODEL FILE
–
FIDUCIAL
–
Simulator MODEL FILE DATE
–
TEST_AND_QUALITY
–
Simulator NAME
–
TEST_YIELD_CODE
–
Simulator VERSION
–
TEST_FLOW
–
Simulator COMPLIANCE
–
TEST_TEMP
–
DIE_DELIVERY_FORM
–
TEST_SCREEN
–
PACKING_CODE
–
TEST_RELIABILITY
–
BUMP_MATERIAL
–
BUMP_HEIGHT
–
BUMP_HEIGHT_TOLERANCE
–
MPD_PACKAGE_MATERIAL
–
MPD_PACKAGE_STYLE
–
MPD_DELIVERY_FORM
–
MPD_CONNECTION_TYPE
–
MPD_CONNECTION_MATERIAL