Subcontract Wafer Services Full Turnkey Wafer Processing Services Wafer Mapping / Wafer Inking High volume capacity • Conversion between industry formats • Inking using any electronic wafer map Low volume flexibility for developments and R&D Wafer Thinning • Automated in-feed grinding of wafers • Ability to saw, sort and inspect wafers down to 20 µ 35+ years processing experience Wafer Dicing T INTER N AN NS CO MP TIO LA AL TRAF ON FI TI A LI • ±1 µ tolerance • Wafer sizes up to 12 in. / 300 mm • Custom dicing plans, multi-project wafers, step cutting & yield optimizations ITAR ARMS REG IN U • • • • C Die Plating / Pick & Place AS9100 Rev. C REGISTERED Quality Certifications Automated, virtually contactless handling of singulated die Compatible with all electronic wafer maps Multiple bin / grade die picking Safe handling of sensitive topside & 3D features Visual Inspection • • • • AQL MIL-STD (commercial, military and aerospace grades) Custom visual Inspection via AOI equipment available Customized Output • • • • Sawn wafer on film-frame and ring-frame Waffle tray or Gel-Pak Reconstructed wafer Tape-and-reel (pocket, blister or SurfTape®) July 2014 • Revision 1.4 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Subcontract Wafer Services Global Contacts Micross Orlando Americas 7725 N. Orlando Blossom Trail Orlando, Florida 32810 407.298.7100 [email protected] Mircoss Manchester EMEA & ROW Unit D2, Meadowbank Junction 22 Business Park Oldham OL9 8EH +44 (0)161 683 5236 [email protected] About Micross Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high reliability and state-of-the-art electronics, Micross’ solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish. July 2014 • Revision 1.4 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com