Cots/iPEMS Shortform Guide

Retail+™/COTS/iPEMS
Product Selector Guide
Products Including:
• SDRAM
ƒƒ SDR, DDR, DDR2, DDR3
• SSRAM
ƒƒ Pipelined, Flow-thru & ZBL
• Async SRAM
Benefits
• Non-Volatile
• Off-the-shelf extended environment
products
• Improved costs and performance
• 100% tested/processed to*:
ƒƒ Industrial [IT] -40°C to 85°C
ƒƒ Enhanced [ET]-40°C to 105°C
ƒƒ Extended [XT] -55°C to 125°C
• 100% DC / AC tested*
ƒƒ At voltage corners
ƒƒ At temperature extremes
• Industry standard packages
• Upgradeable families
• RoHS compliant options
*Does not apply to Retail+™ Product Line. See Retail+™
Product Line flyer for details.
7725 N. Orange Blossom Trail
•
Orlando, FL 32810 •
ƒƒ Flash (NAND & NOR), EEPROM & nvSRAM
Micross Components’ long-term experience
and knowledge in product engineering, test and
support of the Hi-Rel community, has lead to the
development of the Retail+™, COTS and iPEM
(integrated Plastic Encapsulated Microcircuit)
device families.
Micross Components’ Retail+™ product line
enables customers to use industry leading
components that were not previously available
for their hi-rel, long life applications. COTS parts
are developed and tested to industrial, extended,
and military temperature ranges, with burn-in
and temperature cycling available as requested.
Reliability is ensured by leveraging off the OEM
supplier’s qualification as a complement to Micross’
own qualification, which is based on 25 years of
experience in manufacturing products to military and other hi-rel specifications.
407.298.7100
•
[email protected]
•
www.micross.com
12 May 2015 • Revision 1.2
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com
Retail+™/COTS /iPEMS
Product Selector Guide
Density Organization
Part Number
Technology
Performance
Volts
Temp. Range
3.3
IT, ET, XT
Package(s)
Synchronous DRAM
SDR
2M x 32
AS4SD2M32DG-xx/tt
8MB
-6, -7, -7.5 (ns)
167, 143, 133 (MHz)
SDR
4M x 16
AS4SD4M16DG-xx/tt
16MB
8M x 16
AS4SD8M16DG-xx/tt
32MB
16M x 16
64MB
TSOP2-86; TSOP2-54
-8, -10 (ns)
125, 100 (MHz)
TSOP2-54
SDR
-7.5, -10 (ns)
100, 133 (MHz)
3.3
IT, ET, XT
TSOP2-54 (DGCR - RoHS
Compliant)
AS4SD16M16DG-xx/tt
SDR
-7.5, -10 (ns)
100, 133 (MHz)
3.3
IT, ET, XT
TSOP2-54 (DGCR - RoHS
Compliant)
32M x 16
AS4SD32M16DG-xx/tt
SDR
-7.5, -10 (ns)
100, 133 (MHz)
3.3
IT, ET, XT
TSOP2-54 (DGCR - RoHS
Compliant)
128MB
16M x 72
AS4DDR16M72PBG-xx/tt
DDR
-6, -7.5, -8, -10 (ns)
333, 266, 250, 200
(Mb/s)
2.5 Core, 2.5 I/O
IT, ET, XT
iPEM* PBGA-219
256MB
32M x 72
AS4DDR32M72PBG-xx/tt
DDR
-6, -7.5, -8, -10 (ns)
333, 266, 250, 200
(Mb/s)
2.5 Core, 2.5 I/O
IT, ET, XT
iPEM* (PBG - PBGA-219)
(PBGR - RoHS Compliant)
32M x 64
AS4DDR232M64PBG-xx/tt
DDR2
-3, -3.8, -5 (ns)
667, 533, 400 (Mb/s)
1.8 Core, 1.8 I/O
IT, ET, XT
32M x 72
AS4DDR232M72PBG-xx/tt
iPEM (PBG - PBGA-255)
(PBGR - RoHS Compliant)
512MB
64M x 72
AS4DDR264M72PBG-xx/tt
DDR2
-3, -3.8, -5 (ns)
667, 533, 400 (Mb/s)
1.8 Core, 1.8 I/O
IT, ET, XT
iPEM (PBG - PBGA-255)
(PBGR - RoHS Compliant)
(PBG1 - PBGA-208*)
1GB
128M x 72
MYX4DDR2128M72PBG-xx/tt
DDR2
-3, -3.8, -5 (ns)
667, 533, 400 (Mb/s)
1.8 Core, 1.8 I/O
IT, ET, XT
PBG1 - PBGA-208*
1Gb
64M x16
MYX4DDR264M16HWBG-187EttRy
DDR2
1.875ns
1066
1.8
C, IT
FPGA - 84 Sn63/Pb37
2Gb
128M x 16
MYX4DDR2128M16PKBG-187EttRy
DDR2
1.875ns
1066
1.8
C, IT
FPGA - 84 Sn63/Pb37
1Gb
64M x 16
MYX4DDR364M16JTBG-15EttRy
DDR3
1.5ns
1333
1.35
C, IT
FPGA - 84 Sn63/Pb37
1Gb
64M x 16
MYX4DDR364M16JTBG-15EttRy
DDR3
1.5ns
1333
1.35
ET
FPGA - 84 Sn63/Pb37
2Gb
128M x 16
MYX4DDR3L128M16JTBG-125ttRy
DDR3
1.25ns
1600
1.35
C, IT
FPGA - 84 Sn63/Pb37
128K x 32
AS5SP128K32DQ-xx/tt
Sync Burst Pipeline
-5, -6, -7.5, -10 (ns)
200, 166, 133, 100
(MHz)
3.3 Core,
3.3/2.5 I/O
IT, ET, XT
TQFP-100
128K x 36
AS5SP128K36DQ-xx/tt
Sync Burst Pipeline
-3, -3.5, -4 (ns)
200, 166, 133 (MHz)
3.3 Core,
3.3/2.5 I/O
IT, ET, XT
TQFP-100
256K x 18
AS5SS256K18DQ-xx/tt
Sync Burst Flow-Thru
-8, -9, -10 (ns)
113, 100, 66 (MHz)
3.3
AS5SP256K36DQ-xx/tt
Sync Burst Pipeline
-3, -3.5, -4 (ns)
200, 166, 133 (MHz)
3.3 Core,
3.3/2.5 I/O
IT, ET, XT
AS5SS256K36DQ-xx/tt
Sync Burst Flow-Thru
-7.5, -8.5, -10 (ns)
117, 100, 66 (MHz)
3.3
IT, XT
512K x 18
AS5SP512K18DQ-xx/tt
Sync Burst Pipeline
-3, -3.5, -4 (ns)
200, 166, 133 (MHz)
3.3 Core, 3.3/2.5 I/O
IT, ET, XT
512K x 36
AS5SP512K36DQ-xx/tt
Sync Burst Pipeline
-3, -3.5, -4 (ns)
200, 166, 133 (MHz)
3.3 Core, 3.3/2.5 I/O
IT, ET, XT
DDR
DDR2
256MB
DDR3
Synchronous SRAM
4Mb
4.5Mb
256K x 36
9Mb
18Mb
TQFP-100
TQFP-100
*Product in development. Advance information.
12 May 2015 • Revision 1.2
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com
Retail+™/COTS /iPEMS
Product Selector Guide
Density Organization
Part Number
Technology
Performance
Volts
Temp. Range
Package(s)
AS5C2568DJ-xx/tt
Asynchronous
-12, -15, -20, -25
5
IT, XT
PSOJ-28, 300mil
-15, -20, -25
5
-10, -12, -15, -20
3.3
IT, XT
PSOJ-32, 400mil
-12, -15, -17, -20, -25, -35, -45
5
-12, -15, -20, -25
3.3
Asynchronous
Ultra Low Power
-55, -70, -85, -100
5
Asynchronous
-12, -15, -20, -25
Asynchronous SRAM
256Kb
1Mb
32K x 8
AS5C1008DJ-xx/tt
128K x 8
Asynchronous
AS5LC1008DJ-xx/tt
AS5C512K8DJ-xx/tt
4Mb
Asynchronous
AS5LC512K8DJ-xx/tt
512K x 8
AS5C4009LLDG-xx/tt
16Mb
AS8S512K32PEC-xx/tt
512K x 32
AS8SLC512K32PEC-xx/tt
PSOJ-36, 400 mil
IT, XT
TSOP2-32
5
3.3
IT, ET, XT
iPEM, PLCC-68
Non-Volatile
16Mb
2M x 8
1M x 16
AS29LV016JBRG-xx/tt
Flash, Bottom Boot Block
AS29LV016JTRG-xx/tt
Flash, Top Boot Block
1Gb
64M x 16
MYX29GL01GS11DPIV2BG-ITRy
1Gb
64M x 16
MYX28F00AM29EWHBG-ITRy
512Mb
512M x 1
64GB
64G x 8
-70, -90, -100
3.3
IT, ET, XT
RG - TSOP1-48
RGR - RoHS Compliant
NOR Flash
-100ns
2.7V - 3.6V
IT
FBGA - 64 Sn63/Pb37
NOR Flash
-100ns
2.7V - 3.6V
IT
FBGA - 64 Sn63/Pb37
MYXN25Q512BG-ttRy
Serial NOR Flash
108MHz (STR)
2.7V - 3.6V
IT, AT
TBGA - 24 Sn63/Pb37
MYXFC64GJDDNBG-ITRy
Parallel NAND Flash +
Controller
52MHz
2.7V - 3.6V
IT
LFBGA - 169 Sn63/Pb37
Temp. Range
Package
Revision
Retail+TM Memory Products
Density
Organization
Part Number
Technology
Performance
Volts
DDR2
1Gb
64M x16
MYX4DDR264M16HWBG-187EttRy
DDR2
1.875ns
1066
1.8
C, IT
FPGA - 84 Sn63/Pb37
H
2Gb
128M x 16
MYX4DDR2128M16PKBG-187EttRy
DDR2
1.875ns
1066
1.8
C, IT
FPGA - 84 Sn63/Pb37
C
DDR3
1Gb
64M x 16
MYX4DDR364M16JTBG-15EttRy
DDR3
1.5ns
1333
1.35
C, IT
FPGA - 84 Sn63/Pb37
J
1Gb
64M x 16
MYX4DDR364M16JTBG-15EttRy
DDR3
1.5ns
1333
1.35
ET
FPGA - 84 Sn63/Pb37
G
2Gb
128M x 16
MYX4DDR3L128M16JTBG-125ttRy
DDR3
1.25ns
1600
1.35
C, IT
FPGA - 84 Sn63/Pb37
K
1Gb
64M x 16
MYX29GL01GS11DPIV2BG-ITRy
NOR Flash
-100ns
2.7 - 3.6
IT
FBGA - 64 Sn63/Pb37
MS4.0
1Gb
64M x 16
MYX28F00AM29EWHBG-ITRy
NOR Flash
-100ns
2.7 - 3.6
IT
FBGA - 64 Sn63/Pb37
A
512Mb
512M x 1
MYXN25Q512A13G12BG-ttRy
Serial NOR Flash
108MHz (STR)
2.7 - 3.6
IT, AT, XT
TBGA - 24 Sn63/Pb37
A
64GB
64G x 8
MYXFC64GJDDNBG-ITRy
Parallel NAND Flash + Cnt'lr
52MHz
2.7 - 3.6
IT
LFBGA - 169 Sn63/Pb37
J = Flash; D = Cnt'l
Non-Volatile
Micross Part # Extension-xxxxttRyzzz (e.g. -25EITR)
• xxxx = Speed Grade: 1 to 4 digits when applicable • R = Retail+
• y = Part Marking Options:
• tt = Temp. Ranges
• Blank = none
Refer to Temp. Range column for specific
• L = Label (default)
temps offered for each part #.
• D = Ink Dot
• C, CT or blank = Commercial (0°C to +70°C)
• A = Laser
• IT = Industrial (-40°C to +85°C)
•
zzz
= Special Custom Characters
• ET = Enhanced (-40°C to +105°C)
options controlled by Micross
• AT = Automotive (-40°C to +125°C)
• XT = Mil (-55°C to +125°C)
12 May 2015 • Revision 1.2
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com
Retail+™/COTS /iPEMS
Product Selector Guide
Memory Product Nomenclature
Prefix
Code
Description
AS
ASI/Micross
MT
ASI/Micross/Micron1
MYX
Micross
SMJ/SM
ASI/Micross/TI2
Sample Part Number
Prefix
1. The MT product line was acquired from Micron Technology.
In most cases, these industry established part numbers have
been retained, but in no way does this indicate or guarantee
a die source.
Device Number
Access Time
MYX4DDR364M16JTBG-15ITRL
2. The SMJ/SM product line was acquired from Texas
Instruments. In most cases, these industry established
part numbers have been retained. This does not indicate
or guarantee a die source. Nomenclature is provided in
separate documentation.
Product Type/Description
Package
Options/Processing
See individual datasheets for exact part number and option
combinations offered.
Product Type/Description
Code
Type
Description
41 & 44
4C
28C
58C
58LC
8E
8ER
8ERLC
28F
29F
29GL
29LV
8F
8FLC
N25Q
PM
80
4DDR
4DDR2
4DDR3
4SD
5C
5LC
8S
8SLC
5SP
5SS
27C
42C
44C
6nvLC
8nvC
8nvLC
DRAM
DRAM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
FLASH
FLASH
FLASH
FLASH
FLASH
FLASH
FLASH
PMIC
Processor
SDRAM
SDRAM
SDRAM
SDRAM
SRAM
SRAM
SRAM
SRAM
SSRAM
SSRAM
UVEPROM
VRAM
VRAM
VRAM
VRAM
VRAM
5V, EPM
5V, FPM
Byte Alterable
Hitachi Die
3.3V
Multi-chip Module
Multi-chip Module, Rad-Tol
3.3V, Multi-chip Module, Rad-Tol
Spansion compatible
MirrorBit® Eclipse™
3.3V
Multi-chip Module
3.3V, Multi-chip Module
Serial NOR
Power Management IC
SoC
2.5V/1.8V, Double Data Rate
2.5V/1.8V, Double Data Rate II
1.5V/1.35V, Double Data Rate III
3.3V, SDR
5V
3.3V
5V, Multi-chip Module
3.3V, Multi-chip Module
Pipelined
Flow-thru
3.3V
5V
3.3V
Package
Code
Access Time
Description
Code
Options/Processing
ns
BG, BG1, BGM1
FBGA
10
10 or 100
C
DIP
3
3.0
CN
Narrow DIP
11
CW
Wide DIP
CZ, SV, SVM
ZIP
DCG
Code
Description
AT
-40°C to +125°C
110
CT
0°C to +70°C
12
12 or 120
D
Orange Dot
15
15 or 150
FP Gullwing (Formed)
15E
1.5
E
Epi Die
DCJ
SOJ (Formed)
17
17
DG
TSOPII
ET
-40°C to +105°C
20
20 or 200
DJ
PSOJ
25 or 250
IT
-40°C to +85°C
EC, FE, HMM
25
LCC
ECA
450 x 550 LCC
25E
2.5
L
2V Data Retention or Label
ECG
Gullwing LCC
30
30 or 300
35
Ultra Low Power
SOJ (Attached)
35
LL
ECJ
ECN
Narrow LCC
45
45
ECW
Wide LCC
55
55
F, FN, HKD, HR, HK
Flat pack
60
60
FNC
LCC
70
70
J, JD, JDD, JDM
Side Brazed DIP
75
7.5 or 75
P
PGA
85
85
PBG, PBG1
PBGA
90
90
Q
CQFP (Gullwing)
100
100
Q1
CQFP (w/special lead)
107
1.07
Q2, Q3, SQ
CQFP
120
QB
CQFP (w/Tie Bar)
QN
QFN
QJ
CQFP (J-lead)
QT
CQFP (Thin)
QW
CQFP (1.56” sq.)
RG
TSOPI
SF
Flat pack (Rad-Tol)
SOJ, HJM
SOJ
SQB
CQFP (Rad-Tol)
M or XT -55°C to +125°C
MIL
MIL-STD-883 equivalent processing
compliant to paragraph 1.2.2 -55°C to
+125°C
Q
QML
R
Retail+
SPACE
MIL-STD-883, Method 5004, Class
Equivalent
120
ZZZ
Special Flow
125
1.25
150
150
883C
MIL-STD-883 (previously listed as “M”)
187E
1.87
Formoreinformationregardingourproducts
andservices,pleasevisitwww.micross.comor
[email protected]
12 May 2015 • Revision 1.2
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com