Ceramic Memory Shortform Guide

Standard Ceramic Memory
Product Selector Guide
Product Line Overview
Memory
SRAM, DRAM, SDRAM, VRAM, UVEPROM, EEPROM & Flash
Micross Components has been supplying high-reliability
memory products for over twenty-five years. As a QML supplier
fully certified to AS9100:2009 and ISO 9001:2008, Micross
Components meets and exceeds the demands of the military,
aerospace, transportation, industrial-embedded, and medical
diagnostic markets.
Benefits
• Off-the-shelf standard products in full
hermetic ceramic packages.
• SMD 5962 listed
• Industry standard packages
• Upgradeable families
Quality Levels & Programs
• DSCC QML
• MIL-PRF-38534, class H
(class K in process)
• MIL-PRF-38535, class Q
• MIL-PRF-38535, class V
(Assembly Only)
• Laboratory suitability (MIL-STD-883)
• SMD, M level and Q level
• NSTS 5300.4
• Capabilities for class S manufacturing
• AS9100:2009, ISO 9001:2008 certified
• Customer specific, Source Control
Drawing (SCD)
7725 N. Orange Blossom Trail
•
Orlando, FL 32810 •
As the first, non-OEM QML supplier to be certified by DSCC,
Micross Components is certified to MIL-PRF-38535 class Q and
MIL-PRF-38534 class H.
Micross encourages customers to engage on special
requirements, and will work with customers with changes to
standard specifications as needed to suit their application. At
Micross, specification revision control is key, and is managed
by our Quality organization. All manufacturing operations and
qualification tests are performed at Micross’ facility in Orlando.
Micross has over 1600 part numbers listed with DSCC, on
various SMDs. Our standard package offerings include:
•
•
•
•
•
•
•
•
•
•
Ceramic 400/600 mil DIP
SOJ
2 and 4-sided LCC
ZIP
Gull-Wing
CQFP
CPGA
Flat Pack
Formed Lead Flat Pack
Metal Can
It is our goal to continue providing our customers with a full
service solution, while upholding to our pedigree and tradition of
strict quality and reliability standards.
407.298.7100
•
sales.americas@micross.com
•
www.micross.com
13 May 2015 • Revision 5.5
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Standard Ceramic Memory
Product Selector Guide
Density Config.
(KB)
Features
Part #
5V, /CE1, /CE2, /OE, Fast ASYNC
Access, Low Power
AS4C1259
SMD
5962-
Speed
(ns)
Package Types/Pin Counts
PGA
CQFP
FP
LCC
DIP
CSOJ
ZIP
Gull Wing
DRAM
256
256K x 1
256K x 4
1,048
SMJ44C256
100-150
90617
5V, Enhanced Page Mode
1M x 1
HK/20
FQ/20
SMJ4C1024
5V, Fast Page Mode
4M x 1
JD/20
80-150
HJ/20
JD/18
MT4C4001J
1M x 4
4,194
EC/18
70-120
ECN/20
C & CN/20
90847
5V, Enhanced Page Mode
SMJ44400
5V, Fast Page Mode
MT4C1004J
80-120
HR/20
90622
70-120
96743
70-80
HKD/50
SMJ416400
92312
70-100
HKB/28
SMJ626162
97545
12-20
HKD/50
89497
100-120
JD/20
CN/18
SMJ416160
1M x16
16,777
5V, Enhanced Page Mode
4M x 4
SMJ418160
FNC/28
SV/24
SDRAM
16,384
1M x16
3.3V, Bank Interleaving, Pipelined
256K x 4
5V, FPM, Dual Port, Block Write
VRAM
MT42C4256
1,024
SMJ44C251B
EC/28
C/28
DCJ/28
HMM/28
JDM/28
HJM/28
EC &
ECA/32
C&
CW/32
DCJ &
SOJ/32
SVM/28
SRAM
128K x 8
5V, /CE1, /CE2, /OE, Fast ASYNC
Access, Low Power
MT5C1008
89598
12-70
5V, Single /CE, Fast ASYNC Access, Low Power
MT5C1009
89598 &
96691
15-70
MT5C1005
91612
15-20
MT5C1001
92316
20-70
5V, MCM, Byte Selectable Fast SRAM
AS8S128K32
93187 &
95595
15-45
3.3V, MCM, Byte Selectable, ASYNC Fast SRAM
AS8SLC128K32
5V, Revolutionary Pin-out
AS5C512K8
1,024
256K x 4
F/32
C/28
5V, /CE, /OE, Fast ASYNC Access, Low Power
1M x 1
128K x 32
4,096
95600 &
95613
P/66
Q/68
12-55
ECJ/36
AS5LC512K8
5V/CE/OE, Evolutionary Pin-out
AS5C4008
95600 &
95613
12-45
5V/CE/OE, Slow, Ultra Low Power
AS5C4009LL
95613
55-120
5V, MCM, High Speed, Low Power
AS8S512K32
94611 &
95624
17-55
P/66
Q, Q1, Q2 &
BQFP/68
3.3V, MCM, /CE,/OE, High Speed, Low Power
AS8SLC512K32
10-20
P/66
Q & Q1/68
512K x 32
DCJ/32
P & PN/66 Q & Q1/68
3.3V, Low Power, High Speed
512K x 8
16,384
10-25
F/32
F/36
EC/36
F/32
EC/32
12-20
CW/32
ECJ/32
13 May 2015 • Revision 5.5
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Standard Ceramic Memory
Product Selector Guide
Density Config.
(KB)
Features
Part #
SMD
5962-
Speed
(ns)
Package Types/Pin Counts
PGA
CQFP
FP
LCC
DIP
CSOJ
ZIP
Gull Wing
UVEPROM
256
32K x 8
5V, UV Erasable ROM
AS27C256
86063
55-300
ECA/32
J/28
512
64K x 8
5V UV Erasable ROM
SMJ27C512
87648
12-25
ECA/32
J/28
1,024
128K x 8
5V, UV Erasable ROM
SMJ/AS27C010A
89614
120-200
ECA/32
J/32
4,096
512K x8
5V, UV Erasable ROM
SMJ27C040
91752
12-15
5V, Byte Alterable
AS28C010
J/32
EEPROM
12-25
F/32
CW/32
38267
1,048
128K x 8
5V, 128 Byte Page Mode, radiation tolerant
AS58C1001
150-250
3.3V, 128 Byte Page Mode, radiation tolerant
AS58LC1001
250-300
5V, Byte Selectable, Page Mode
AS8E128K32
F & SF/32
150-300 P & PN/66 Q & Q3/68
94585
5V, radiation tolerant, w/shielded
package, >100K RADS
AS8ER128K32
150-250
3.3V, radiation tolerant, w/shielded
package, >100K RADS
AS8ERLC128K32
250-300
5V,CE/OE, Even Sectored
AS29F010
96690
60-150
5V, Even Sectored, Legacy Product
SMJ28F010B
90899
120-200
512K x 8
5V, CE/OE, Erase Suspend/Resume
AS29F040
96692
55-150
128K x 32
5V, MCM, Even Sectored, Byte Selectable
AS8F128K32
94716
60-150
16,384
512K x 32
5V MCM, Even Sectored, Byte Selectable
AS8F512K32
94612
70-150
5V, MCM, Even Sectored, Byte Selectable
AS8F1M32
32,768
1M x 32
3.3V. Boot Sector, Bottom = B
AS8FLC1M32B
5V, Uniform Sector
AS8F2M32
3.3V, Boot Sector, Bottom=B, Top=C
AS8FLC2M32B
5V, Mixed MCM,128Kx16 SRAM
& 512Kx16 FLASH
AS8SF384K32
4,096
128K x 32
DCJ/32
SQ, SQB,
Q&
QB/68
Flash
1,024
F/32
CW/32
SOJ/32
DCG/32
128K x 8
F/32
FE/32
JDD/32
ECA/32
CW/32
DCG/32
4,096
65,528
Q & Q1/68
P/66
Q & Q1/68
90-150
09205
70-120
QT/68
P/66
90-150
Q/68
QT/68
2M x 32
08245
70-120
P/66
Q/68
SRAM & Flash
10,240
640K x 16
35
QT/68
Other Ceramic Products
Linear/Mixed Signal Digital
Voltage Regulators, Operational Amps, Voltage Comparators, ADC &
DAC Devices, Switches, Multiplexers, Supervisory Circuits
Radiation Tolerant
Linear, Mixed-signal, Memory, Interface, Discrete, Digital
13 May 2015 • Revision 5.5
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Standard Ceramic Memory
Product Selector Guide
Prefix
Code
Memory Product Nomenclature
Description
AS
ASI/Micross
MT
ASI/Micross/Micron1
MYX
Micross
SMJ/SM
ASI/Micross/TI2
Sample Part Number
Device Number
Prefix
1. The MT product line was acquired from Micron Technology.
In most cases, these industry established part numbers have
been retained, but in no way does this indicate or guarantee
a die source.
Access Time
M Y X 5 C 1 0 0 8 C - 3 5 L / 8 8 3 C
2. The SMJ/SM product line was acquired from Texas
Instruments. In most cases, these industry established
part numbers have been retained. This does not indicate
or guarantee a die source. Nomenclature is provided in
separate documentation.
Product Type/Description
Package
Options/Processing
See individual datasheets for exact part number and option
combinations offered.
Product Type/Description
Code
Type
Package
Description
Code
Description
Access Time
Code
ns
5V, FPM
BG, BG1, BGM1
FBGA
10
10 or 100
5V, EPM
C
DIP
12
12 or 120
3.3V, SDR
CN
Narrow DIP
15
15 or 150
CW
Wide DIP
17
17
CZ, SV, SVM
ZIP
20
DCJ
SOJ (Formed)
DCG
FP Gullwing (Formed)
3.3V
DG
5V, Multi-chip Module
8SLC
5SP
4C
41 & 44
DRAM
4SD
4DDR
SDRAM
CT
0°C to +70°C
IT
-40°C to +85°C
20 or 200
ET
-40°C to +105°C
25
25 or 250
M or XT
-55°C to +125°C
30
30 or 300
TSOPII
35
35
L
2V Data Retention
DJ
PSOJ
45
45
LL
Ultra Low Power
3.3V, Multi-chip Module
EC, FE, HMM
LCC
55
55
E
Epi Die
Pipelined
ECA
450 x 550 LCC
60
60
Q
QML
Flow-thru
ECG
Gullwing LCC
70
70
ECJ
SOJ (Attached)
75
7.5 or 75
883C
MIL-STD-883 (previously listed
as “M”)
ECN
Narrow LCC
85
85
ECW
Wide LCC
90
90
SPACE
MIL-STD-883, Method 5004,
Class Equivalent
F, FN, HKD, HR, HK
Flat pack
100
100
FNC
LCC
120
120
MIL
150
150
MIL-STD-883 equivalent processing compliant to paragraph
1.2.2 -55°C to +125°C
2.5V/1.8V, Double Data Rate
5C
5V
8S
5SS
42C
44C
SSRAM
VRAM
58C
Hitachi Die
58LC
3.3V
28C
Byte Alterable
J, JD, JDD, JDM
Side Brazed DIP
Multi-chip Module
P
PGA
8ER
Multi-chip Module, Rad-Tol
PBG, PBG1
PBGA
8ERLC
3.3V, Multi-chip Module, Rad-Tol
Q
CQFP (Gullwing)
QB
CQFP (w/Tie Bar)
Spansion compatible
QJ
CQFP (J-lead)
3.3V
Q1
CQFP (w/special lead)
Q2, Q3, SQ
CQFP
SQB
CQFP (Rad-Tol)
QT
CQFP (Thin)
QW
CQFP (1.56” sq.)
8E
27C
EEPROM
UVEPROM
29F
29LV
28F
FLASH
8F
Multi-chip Module
8FLC
3.3V, Multi-chip Module
6nvLC
3.3V
RG
TSOPI
5V
SF
Flat pack (Rad-Tol)
3.3V
SOJ, HJM
SOJ
8nvC
VRAM
8nvLC
Description
-40°C to +125°C
2.5V/1.8V, Double Data Rate II
SRAM
Code
AT
4DDR2
5LC
Options/Processing
For more information regarding our products and
services, please visit www.micross.com
or call +44 (0) 1603788967.
13 May 2015 • Revision 5.5
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com