R599 Reliability Data

RELIABILITY DATA
LTM4604 / LTM4608
10/25/2007
• OPERATING LIFE TEST
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
DEVICE
HOURS (1)
EQV to +125°C
LGA 9X15
231
0712
0730
231
231
231
• J-STD-020 LEVEL 4 PRECONDITIONING (96 HOURS 30°C/60%RH + 3X IR REFLOW +245°C)
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
DEVICE
HOURS
AT +30°C
LGA 9X15
924
0712
0730
88,704
924
88,704
4
• HUMIDITY BIAS TEST (+85°C / 85% RH) AFTER J-STD-020 LEVEL 4 PRECONDITIONING
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
LGA 15X15
NEWEST
DATE CODE
80
0332
80
• BOARD MOUNT / TEMP CYCLE FROM -40°C to +125°C
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
0714
NEWEST
DATE CODE
DEVICE
CYCLES
360,000
360,000
DEVICE
CYCLES
LGA 9X15
390
0714
0729
548,000
390
548,000
5
• TEMP CYCLE FROM -55°C to +125°C AFTER J-STD-020 LEVEL 4 PRECONDITIONING
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
DEVICE
CYCLES
LGA 9X15
612
0712
0730
648,500
612
648,500
5
• THERMAL SHOCK FROM -55°C to +125°C AFTER J-STD-020 LEVEL 4 PRECONDITIONING
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
DEVICE
CYCLES
NUMBER
OF (2)(3)
FAILURES
0
0
NUMBER
OF
FAILURES
0
0
NUMBER
OF
FAILURES
0
0
NUMBER
OF
FAILURES
0
0
NUMBER
OF
FAILURES
0
0
NUMBER
OF
FAILURES
LGA 9X15
615
0712
0730
622,700
0
615
622,700
0
(1) Assumes Activation Energy = 1.0 Electron Volts
(2) Failure Rate Equivalent to +55°C, Assuming 60% Confidence Level =
7.93 FITS
(3) Mean Time Between Failures (MTBF) =
13,169 Years
(4) Humidity Bias Test derives from generic LGA package 15X15 mm2 result
(5) LTC Dry Packs This Product. Level 4 per J-STD-020 Floor Life is 72 Hours at 30°C/60%RH. If This Time
Limit is Exceeded, Dry Bake is Recommended.
Note: 1 FIT = 1 Failure in One Billion Hours.
PAGE 1
Form: 00-03-6209B. R599
Rev 3
RELIABILITY DATA
LTM4604 / LTM4608
10/25/2007
• HIGH TEMPERATURE BAKE AT +150°C
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
0712
0730
OLDEST
DATE CODE
NEWEST
DATE CODE
LGA 9X15
150
150
• SOLDER SHOCK AT +245°C (1 TIME)
PACKAGE
TYPE
SAMPLE
SIZE
NUMBER
OF
FAILURES
DEVICE
HOURS
AT +150°C
250
250
NUMBER
OF
FAILURES
LGA 9X15
150
0712
0730
150
• MECHANICAL SHOCK (JESD22B104 CONDITION B - PEAK = 1500g)
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
0
0
NUMBER
OF
FAILURES
K DEVICE
CYCLES
LGA 9X15
75
0712
0714
75
• VIBRATION VARIABLE FREQUENCY (JESD22B103 CONDITION A - PEAK ACCELERATION = 20g)
PACKAGE
TYPE
SAMPLE
SIZE
LGA 9X15
75
75
• POWER CYCLE FROM +50°C to +100°C4
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
NEWEST
DATE CODE
0712
0714
OLDEST
DATE CODE
NEWEST
DATE CODE
0
0
DEVICE
CYCLES
(6, 7,
8)
90
0712
0730
4,500,000
90
4,500,000
(6) Board Mount Temp Cycle Meets IPC-9701 / JESD22-A104
(7) Board Mount Temp Cycle Includes Full Electrical Characterization, XRAY & Cross-sections.
(8) Each Board Mounted Vehicle is Cycled up to 2000 Times or More. See Detailed Data on Page 3.
Form: 00-03-6209B. R599
0
0
NUMBER
OF
FAILURES
K DEVICE
CYCLES
LGA 9X15
PAGE 2
0
0
NUMBER
OF
FAILURES
0
0
Rev 3
Linear Technology Confidential TCDATA-LTM4604 FAMILY.xls 10/25/2007
TEMP CYCLE DATA FOR THE LTM4604/4608 FAMILY (Component Level)
PARACATADATE
DEVICE
PKG
SAMPLE
METRIC
STROPHIC
CODE
TYPE
TYPE
SIZE
FAIL
FAIL
0712
LTM4604
LGA
77
0
0
0713
LTM4604
LGA
77
0
0
0714
LTM4604
LGA
76
0
0
0727
LTM4604
LGA
154
0
0
0728
LTM4608
LGA
77
0
0
0729
LTM4608
LGA
75
0
0
0730
LTM4608
LGA
76
0
0
7
LOTS
612
0
CYCLES
ON TC
-55ºC TO
+125ºC
1000
1000
1500
250
1500
1500
1500
0
DEVICE
CYCLES
-55ºC TO
+125ºC
77,000
77,000
114,000
38,500
115,500
112,500
114,000
648,500
THERMAL SHOCK DATA FOR THE LTM4604/4608 FAMILY (Component Level)
DATE
CODE
0712
0713
0714
0727
0728
0729
0730
7
DEVICE
TYPE
LTM4604
LTM4604
LTM4604
LTM4604
LTM4608
LTM4608
LTM4608
LOTS
PKG
TYPE
LGA
LGA
LGA
LGA
LGA
LGA
LGA
SAMPLE
SIZE
76
77
77
154
77
77
77
PARAMETRIC
FAIL
0
0
0
0
0
0
0
CATASTROPHIC
FAIL
0
0
0
0
0
0
0
615
0
0
CYCLES
ON TC
-55ºC TO
+125ºC
1000
1300
1300
250
1500
1500
1000
DEVICE
CYCLES
-55ºC TO
+125ºC
76,000
100,100
100,100
38,500
115,500
115,500
77,000
622,700
LGA MODULE DETAILED BOARD MOUNT TEMP CYCLE DATA
BOARD MOUNT TEMP CYCLE DATA FOR THE LTM4604/08 FAMILY
PARACATADATE DEVICE
PKG
SAMPLE METRIC
STROPHIC
CODE TYPE
TYPE
SIZE
FAIL
FAIL
79
0
0
0714
LTM4604
LGA
79
0
0
0714
LTM4604
LGA
116
0
0
0728
LTM4608
LGA
116
0
0
0729
LTM4608
LGA
4
LOTS
390
0
POWER CYCLE DATA FOR THE LTM4604/08 FAMILY
PARADATE DEVICE
PKG
SAMPLE METRIC
CODE TYPE
TYPE
SIZE
FAIL
15
0
0712
LTM4604
LGA
15
0
0713
LTM4604
LGA
15
0
0714
LTM4604
LGA
15
0
0728
LTM4604
LGA
15
0
0729
LTM4604
LGA
15
0
0730
LTM4604
LGA
6
LOTS
90
0
CYCLES
ON TC
-40ºC TO
+125ºC
2,000
2,000
1,000
1,000
0
CATASTROPHIC
FAIL
0
0
0
0
0
0
0
DEVICE
CYCLES
-40ºC TO
+125ºC
158,000
158,000
116,000
116,000
SOLDER
PASTE
SnPb
PbF
SnPb
PbF
548,000
CYCLES
TCASE
50ºC TO
+100ºC
50,000
50,000
50,000
50,000
50,000
50,000
DEVICE
CYCLES
TCASE
50ºC TO
+100ºC
750,000
750,000
750,000
750,000
750,000
750,000
4,500,000
PbF
PbF
PbF
PbF
PbF
PbF