Multilayer Chip Diplexers NGD_C Series FEATURES • LOW INSERTION LOSS • HIGH ATTENTUATION • LOW COST LTCC CONSTRUCTION • SURFACE MOUNTABLE CONSTRUCTION • TAPED AND REELED FOR AUTOMATIC INSERTION RoHS Compliant includes all homogeneous materials *See Part Number System for Details CHARACTERISTICS Case Code 0603 0805 1210 Low Frequency Range (Min.) 2400 ~ 2500 MHz High Frequency Range (Max.) 9800 ~ 11800 MHz Refer to Part Number Table 1650 ~ 2200 MHz Operating Temperature Range 900 ~ 1450 MHz -40°C ~ +85°C Impedance 50Ω Resistance to Solder Heat +260°C for 10 seconds DIMENSIONS (mm) LAND PATTERNS DIMENSIONS Case Code NGD0603C A B 1.6 ± 0.1 0.8 ± 0.1 NGD0805C 2.0 ± 0.15 1.2 ± 0.15 NGD1210C 3.2 ± 0.2 2.5 ± 0.2 C D E F G H I J K 0.6 ± 0.1 0.15 ± 0.1 0.2 ± 0.1 0.5 ± 0.1 0.3 0.55 0.25 0.5 - 0.2 ± 0.1 0.3 ± 0.15 0.65 ± 0.1 0.75 0.5 0.35 0.65 - 0.3 ± 0.2 0.55 ± 0.2 1.0 ± 0.1 1.6 0.95 0.6 - 0.35 0.95 ± 0.1 0.8 ± 0.1 1.5 ± 0.1 LAND PATTERNS COMPONENT LAYOUT A E (3) (2) (1) (4) (5) (6) J C B K G F D H I Refer to Part Number Table for PIN Layout PART NUMBER SYSTEM NGD 0805C 2R450 G1 TR F RoHS Compliant Packaging: TR = Tape & Reel Layout Code Frequency Code (Ghz): “R” indicates decimal Size Code (see dimensions table for details) Series ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 1 Multilayer Chip Diplexers NGD_C Series NGD0603C Size Multilayer Chip Diplexers NGD_C Series NGD0805C Size Standard Values - Case Size 0603 (1.6 x 0.8 x 0.6mm) Part Number Frequency Range Impedance (Ω) Low NGD0603C2R450G1TRF 50 High Low NGD0603C2R450G2TRF 50 High PIN (1) NGD0603C2R450G1TRF High NGD0603C2R450G2TRF Low (2) Ground (3) Low High Standard Values - Case Size 0805 (2.0 x 1.2 mm) Frequency (MHz) Max. IL in BW @ 25°C (dB) Ripple in BW @ 25°C (dB) Max. VSWR in BW @ 25°C (dB) Min. Attenuation @ 25°C (dB) Part Number Frequency Range Impedance (Ω) Max. IL in BW @ 25°C (dB) Ripple in BW @ 25°C (dB) Max. VSWR in BW @ 25°C (dB) Min. Attenuation @ 25°C (dB) 2400 ~ 2500 1.0 0.5 2.0 - 824 ~ 960 0.6 0.3 2.0 - 4800 ~ 6000 - - - 18 1710 ~ 1880 1.0 0.5 2.0 - 7200 ~ 7500 - - - 18 1880 ~ 1990 1.5 0.7 2.0 - 2400 ~ 2500 - - - 18 2400 ~ 2500 - - - 15 4900 ~ 5900 1.6 1.0 2.0 - 9800 ~ 11800 - - - 15 2400 ~ 2500 1.0 0.5 2.0 - 4800 ~ 6000 - - - 18 7200 ~ 7500 - - - 18 2400 ~ 2500 - - - 18 4900 ~ 5900 1.6 1.0 2.0 - 9800 ~ 11800 - - - 15 (4) Ground (5) (6) Common (3) (2) (1) (4) (5) (6) NGD0805C2R450G1TRF (C: 0.95 ± 0.1 mm) Low 50 High Low NGD0805C2R450G2TRF (C: 0.95 ± 0.1 mm) 50 High Ground Low NGD0805C2R450G3TRF (C: 0.8 ± 0.1 mm) 50 High Low NGD0805C2R450G4TRF (C: 0.8 ± 0.1 mm) 50 High PIN (1) NGD0805C2R450G1TRF High NGD0805C2R450G2TRF High NGD0805C2R450G3TRF Low NGD0805C2R450G4TRF High (2) Ground Ground (3) Low Low High Low 824 ~ 1990 - - - 20 2400 ~ 2500 2.0 1.0 2.0 - 2400 ~ 2500 0.7 0.3 2.0 - 4800 ~ 6000 - - - 18 7200 ~ 7500 - - - 18 4900 ~ 5900 1.0 0.5 2.0 19 1800 ~ 2500 - - - 10300 ~ 10700 - - - 25 824 ~ 915 - - - 28 1545 ~ 1610 - - - 28 1710 ~ 1990 - - - 24 2110 ~ 2170 - - - 18 2400 ~ 2500 2.4 - 2.0 - 4800 ~ 5000 - - - 27 7200 ~ 7500 - - - 20 1545 ~ 1610 - - - 25 2400 ~ 2500 - - - 25 5150 ~ 5850 1.2 - 2.0 - 10300 ~ 11700 - - - 20 824 ~ 915 - - - 28 1545 ~ 1610 - - - 28 1710 ~ 1990 - - - 24 2110 ~ 2170 - - - 18 2400 ~ 2500 2.4 - 2.0 - 4800 ~ 5000 - - - 27 7200 ~ 7500 - - - 20 1545 ~ 1610 - - - 25 2400 ~ 2500 - - - 25 5150 ~ 5850 1.2 - 2.0 - 10300 ~ 11700 - - - 20 (4) (5) (6) Ground Common Ground (3) (2) (1) Ground Common Ground (4) (5) (6) ® ® 2 Frequency (MHz) NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 3 Multilayer Chip Diplexers NGD_C Series Multilayer Chip Diplexers NGD_C Series NGD1210C Size Standard Values - Case Size 1210 (3.2 x 2.5 x 1.8mm) Part Number Frequency Range Impedance (Ω) Low NGD1210C2R200G1TRF 50 High Frequency (MHz) Max. IL in BW @ 25°C (dB) Ripple in BW @ 25°C (dB) Max. VSWR in BW @ 25°C (dB) Case Size Min. Attenuation @ 25°C (dB) NGD0603C 900 ~ 1450 2.2 1.6 2.0 - NGD0805C 1425 ~ 1450 - 0.3 - - NGD1210C 1450 ~ 1475 - 1.0 - - 1650 ~ 2200 - - - 27 1800 - - - 30 900 ~ 1450 - - - 27 1300 - - - 30 1625 ~ 1650 - 1.0 - - 1650 ~ 1675 - 0.3 - - 1650 ~ 2200 2.2 1.6 2.0 - CARRIER TAPING DIMENSIONS (mm) AND REEL QUANTITY Tape Ao Bo Paper 1.00 1.80 1.42 2.25 2.75 3.45 Embossed 1.75mm ±0.1 Po So Co 4.0 2.0 ±0.05 3.5 ± 0.1 PIN (1) (2) (3) (4) (5) (6) Ground Common Ground High Ground Low (6) (5) (4) (1) (2) (3) t 0.75 max. - 1.14 max. 4.0mm ±0.1 So W Qty 4,000 8.0 ± 0.3 0.27 max. 1.80 max. 4,000 2,000 1.5mm ± 0.1 t Co Bo Ao NGD1210C2R200G1TRF Ko W Ko Po (Paper) Tape Width Ko (Embossed) REEL DIMENSIONS (mm) A(mm) B(mm) D(mm) 9.0 ± 1.5 58 ± 2.0 178 ± 2.0 NGD0603C NGD0805C NGD1210C B D A REFLOW SOLDERING PROFILE ® ® 4 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 5