V-Chip Memory Back-Up Capacitors NEZVN & NEZVL Series FEATURES RoHS • DOUBLE LAYER CONSTRUCTION Compliant • HIGH TEMPERATURE REFLOW (+260°C) includes all homogeneous materials • SURFACE MOUNTABLE V-CHIP STYLE • EXTENDED TEMPERATURE RANGE (UP TO +85°C FOR NEZVL) CHARACTERISTICS Series Operating Temperature Range Rated Capacitance Range Capacitance Tolerance Rated Voltage Range Load Life Test 1,000 hours NEZVN @ +70°C NEZVL @ +85°C ∆ Capacitance Change Less than ±30% of initial measured value Maximum ESR Less than 400% of the specified maximum value Maximum Leakage Current Less than 200% of the specified maximum value ∆ Capacitance Change Less than ±30% of 20°C value Maximum ESR Less than 500% of 20°C value NEZVN @ -25°C ~ +70°C Characteristics at High & Low Temperature NEZVN NEZVL -25°C ~ +70°C -40°C ~ +85°C 0.047F (47,000µF), 0.1F (100,000mF) and 0.22F (220,000µF) +80%/-20% (Z) 5.5VDC Maximum Leakage Current Less than 400% of 20°C value ∆ Capacitance Change Less than ±30% of 20°C value -40°C Maximum ESR NEZVL @ -40°C ~ +85°C Less than 700% of 20°C value -25°C/+85°C Less than 500% of 20°C value Maximum Leakage Current Vibration 10 ~ 55Hz (1 min./sweep) Total Amplitude 1.5mm, 2Hr in XYZ Directon Resistance to Soldering Heat Peak Temp. +260°C (Time over +230°C <30 seconds) Less than 400% of the specified maximum value ∆ Capacitance Change Less than ±10% of initial measured value Maximum ESR Less than initial specified maximum value Maximum Leakage Current Less than initial specified maximum value ∆ Capacitance Change Maximum ESR Maximum Leakage Current Less than ±10% of initial measured value Less than initial specified maximum value Less than initial specified maximum value STANDARD VALUES AND SPECIFICATIONS Capacitance Value (F) Working Voltage (VDC) Holding Voltage (VDC min.) Max. Leakage Current after 30 minutes (mA) Max. ESR @ 1KHz (Ω) 0.047 5.5 4.0 69 30 NEZVN104Z5.5V12.5X8.5TRF 0.1 5.5 4.0 100 30 NEZVN224Z5.5V12.5X8.5TRF 0.22 5.5 4.0 135 30 NEZVL473Z5.5V12.5X10.5TRF 0.047 5.5 4.0 69 45 NEZVL104Z5.5V12.5X10.5TRF 0.1 5.5 4.0 100 45 NEZVL224Z5.5V12.5X10.5TRF 0.22 5.5 4.0 135 45 NIC P/N NEZVN473Z5.5V12.5X8.5TRF CASE DIMENSIONS (mm) Case Size 12.5X8.5 12.5X10.5 Dφ ± 0.5 12.5 12.5 L max. 8.5 10.5 A/B ±0.2 13.0 13.0 I 5.0 5.0 W 1.2 1.2 P 5.0 5.0 + - w Dφ PET Sleeving I I A 0.3mm max. L P B PRECAUTIONS WASHING is NOT RECOMMENDED. Additional precautions can be found at www.niccomp.com/precautions If in doubt or uncertainty, please review your specific application - process details with NIC’s technical support personnel: [email protected] 1 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com V-Chip Memory Back-Up Capacitors LAND PATTERN DIMENSIONS (mm) Case Diameter 12.5 R S T 4.0 6.0 3.2 NEZVN & NEZVL Series COMPONENT OUTLINE T S S R Temperature (see note 1) RECOMMENDED REFLOW PROFILE 230°C 217°C T1 150°C 120°C T2 Pre-heat <150°C 120 sec. max. T3 Time 1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. 2. 2x reflow process maximum. Capacitor should be allowed to return to room temperature before second reflow process. Peak Temperature T1 Time above +230°C T2 Time above +217°C T3 Time above +200°C # of times reflow <+260°C <20 seconds <30 seconds <50 seconds 2 times <+250°C <30 seconds <40 seconds <60 seconds 2 times PART NUMBER SYSTEM NEZVL 224 Z 5.5V 12.5x10.5 TR F Series 2 RoHS Compliant Tape & Reel Size in mm Working Voltage Tolerance Code Z = +80%/-20% Capacitance Code in mF, first 2 digits are significant Third digit is no. of zeros, “R” indicates decimal for values under 10µF NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com V-Chip Memory Back-Up Capacitors NEZVN & NEZVL Series CARRIER TAPE DIMENSIONS (mm) Case Size A ± 0.2 B ± 0.2 D +1/-0 E ± 0.1 F ± 0.1 P ± 0.1 P1 ± 0.1 T1 ± 0.1 T2 ± 0.2 W ± 0.3 Quantity/Reel 12.5 x 8.5 12.5 x 10.5 13.4 11.4 13.4 13.0 1.50 1.50 1.75 1.75 11.5 11.5 4.0 4.0 24.0 24.0 0.5 0.5 9.5 11.0 32.0 32.0 300 250 P 1.5∅ D +0.1/- 1.75 ± - T1 E F B W S + P1 A T2 Feeding REEL DIMENSIONS (mm) Case Diameter 12.5 A max. f322 B min. f80 C ± 0.5 13.0 W 32.0 t 3.0 t C A B W 3 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com