MC-7846 DS - Jmnic.com

DATA SHEET
GaAs MULTI-CHIP MODULE
MC-7846
870 MHz CATV 22 dB POWER DOUBLER AMPLIFIER
DESCRIPTION
The MC-7846 is a GaAs Multi-chip Module designed for use in CATV applications up to 870 MHz. This unit has
low distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low distortion
• High linear gain
GL = 22.0 dB MIN. @f = 870 MHz
• Low return loss
ORDERING INFORMATION
Part Number
MC-7846
Package
7-pin special with heatsink
Supplying Form
50 pcs MAX./Tray
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7846
ABSOLUTE MAXIMUM RATINGS (TA = +25°°C)
Parameter
Symbol
Ratings
Unit
VDD
30
V
Vi
65.0
dBmV
Operating Case Temperature
TC
−30 to +100
°C
Storage Temperature
Tstg
−40 to +100
°C
Supply Voltage
Input Voltage
Note
Note In case of single tone
Caution
The IC must be handled with care to prevent static discharge because its circuit composed of
GaAs MES FET.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. PG10139EJ01V0DS (1st edition)
Date Published April 2002 CP(K)
Printed in Japan
The mark ! shows major revised points.
 NEC Compound Semiconductor Devices 2001, 2002
MC-7846
RECOMMENDED OPERATING CONDITIONS (ZS = ZL = 75 Ω)
Parameter
Supply Voltage
Input Voltage
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
23.5
24.0
24.5
V
−
32.0
35.0
dBmV
−30
+25
+85
°C
MIN.
TYP.
MAX.
Unit
f = 870 MHz
22.0
−
23.0
dB
f = 40 to 870 MHz
0.6
1.0
1.4
dB
f = 40 to 870 MHz, Peak to valley
−
−
0.6
dB
VDD
Vi
110 channel,
10 dB tilted across the band
Operating Case Temperature
TC
ELECTRICAL CHARACTERISTICS (TC = 30 ± 5°°C, VDD = 24 V, ZS = ZL = 75 Ω)
Parameter
Symbol
Linear Gain
GL
Gain Slope
GSlope
Test Conditions
Gain Flatness
GFlatness
Noise Figure 1
NF1
f = 50 MHz
−
−
6.0
dB
Noise Figure 2
NF2
f = 870 MHz
−
−
6.5
dB
Operating Current
IDD
RF OFF
275
−
375
mA
110 channel,
−
−
−60
dBc
Composite Triple Beat
CTB
Cross Modulation
XM
VO = 50 dBmV at 745.25 MHz,
−
−
−55
dBc
10 dB tilted across the band
−
−
−63
dBc
Composite 2nd Order Beat
CSO
Input Return Loss 1
RLi1
f = 40 to 160 MHz
20
−
−
dB
Input Return Loss 2
RLi2
f = 160 to 320 MHz
20
−
−
dB
Input Return Loss 3
RLi3
f = 320 to 640 MHz
19
−
−
dB
Input Return Loss 4
RLi4
f = 640 to 870 MHz
17
−
−
dB
Output Return Loss 1
RLo1
f = 40 to 160 MHz
20
−
−
dB
Output Return Loss 2
RLo2
f = 160 to 320 MHz
20
−
−
dB
Output Return Loss 3
RLo3
f = 320 to 640 MHz
19
−
−
dB
Output Return Loss 4
RLo4
f = 640 to 870 MHz
18
−
−
dB
2
Data Sheet PG10139EJ01V0DS
MC-7846
PACKAGE DIMENSIONS
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
8.1 MAX.
38.1±0.25
φ 4.25–0.35
+0.25
27.5 MAX.
4.0±0.25
14.85 MAX.
3.2 MAX.
45.08 MAX.
19.05±0.38
25.4±0.25
6-32UNC2B
0.51±0.05
10.75±0.25
7 8 9
2.62±0.35
5
12.9 MAX.
1 2 3
21.5 MAX.
4.19±0.13
2.54±0.25
A
2.54±0.38
6.3
0.51±0.05
2.5
0.38.. A
±0.05
PIN CONNECTION
VDD
5
1
9
IN
OUT
2
3
7
8
GND
Data Sheet PG10139EJ01V0DS
3
MC-7846
NOTE ON CORRECT USE
(1)
The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired
stress to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2)
(3)
Recommended torque strength of the screw is 59 to 78 Ncm.
Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering Method
Pin Part Heating
Soldering Conditions
Pin area temperature : less than 350°C
Condition Symbol
Note
Hour : Within 3 sec./pin
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
4
Data Sheet PG10139EJ01V0DS
−
MC-7846
• The information in this document is current as of April, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
Data Sheet PG10139EJ01V0DS
5
MC-7846
SAFETY INFORMATION ON THIS PRODUCT
Caution
GaAs Products
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
Business issue
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: [email protected]
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
FAX: +852-3107-7309
TEL: +852-3107-7303
Taipei Branch Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office
FAX: +82-2-528-0302
TEL: +82-2-528-0301
NEC Electron Devices European Operations
http://www.nec.de/
TEL: +49-211-6503-101 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Technical issue
NEC Compound Semiconductor Devices, Ltd.
http://www.csd-nec.com/
Sales Engineering Group, Sales Division
E-mail: [email protected] FAX: +81-44-435-1918
0110