RENESAS 3803

8
-bit MICROCOMPUTER 38000 Series
- Differences Between The 3803L Group/3803H Group/3803 Group -
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
ROM
size
RAM
size
Mask
ROM ver.
M38039MFL-XXXSP/HP/KP/WG
(*1)
60 K
2048
M38039FFLSP/HP/KP/WG (*1)
60 K
RAM
size
M38034M4-XXXSP/FP/HP (*2)
16 K
640
M38037M6-XXXSP/FP/HP (*2)
24 K
1024
M38037M8-XXXSP/FP/HP (*2)
32 K
M38039MC-XXXSP/FP/HP (*2)
48 K
M38039MF-XXXSP/FP/HP (*2)
60 K
M38039FFSP/FP/HP (*2)
60 K
Mask ROM ver.
Flash
Memory
ver.
2
©2008. Renesas Technology Corp., All rights reserved.
2048
Flash
Memory
ver.
ROM
size
Mask ROM ver.
*1: 3803L features
- Reduced current consumption in 32 kHz(low-speed) wait mode
(Flash memory version)
- Reduced EMI (unwanted radiation) noise level
3803 Group Part Number
ROM
size
RAM
size
M38039G4H-XXXHP/KP
16 K
2048
M38039G6H-XXXHP/KP
24 K
M38039G8H-XXXHP/KP
32 K
M38039GCH-XXXHP/KP/WG
48 K
M38039G4HSP/HP/KP
16 K
M38039G6HSP/HP/KP
24 K
M38039G8HSP/HP/KP
32 K
M38039GCHSP/HP/KP/WG
48 K
M38034M4H-XXXSP/FP/HP/KP (*2)
16 K
640
M38037M6H-XXXSP/FP/HP/KP (*2)
24 K
1024
M38037M8H-XXXSP/FP/HP/KP (*2)
32 K
M38039MCH-XXXSP/FP/HP/KP (*2)
48 K
M38039MFH-XXXSP/FP/HP/KP/WG
(*2)
60 K
M38039FFHSP/FP/HP/KP/WG (*2)
60 K
3803H Group Part Number
QzROM ver.
3803L Group Part Number
Flash
Memory
ver.
3803L/3803H/3803Groups
GroupsProducts
Products
3803L/3803H/3803
*2: Recommended to replace. Please refer to page 22.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
2048
2048
3803L/3803H/3803Groups
GroupsPin
PinConfiguration
Configuration(SP)
(SP)
3803L/3803H/3803
Completely
Completely
PinCompatible
Compatible
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
M3803XMXH-XXXSP
M38039MFL-XXXSP
M3803XMX-XXXSP
M38039FFHSP
M38039FFLSP
M38039FFSP
M38039GXHSP
V CC
V REF
AV SS
P6 7 /AN 7
P6 6 /AN 6
P6 5 /AN 5
P6 4 /AN 4
P6 3 /AN 3
P6 2 /AN 2
P6 1 /AN 1
P6 0 /AN 0
P5 7 /INT 3
P5 6 /PWM
P5 5 /CNTR 1
P5 4 /CNTR 0
P5 3 /S RDY2
P5 2 /S CLK2
P5 1 /S OUT2
P5 0 /S IN2
P4 7 /S RDY1 /CNTR 2
P4 6 /S CLK1
P4 5 /T X D 1
P4 4 /R X D 1
P4 3 /INT 2
P4 2 /INT 1
CNV SS
V PP
RESET
P4 1 /INT 00 /X CIN
P4 0 /INT 40 /X COUT
X IN
X OUT
V SS
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P3 0 /DA 1
P3 1 /DA 2
P3 2
P3 3
P3 4 /R X D 3
P3 5 /T X D 3
P3 6 /S CLK3
P3 7 /S RDY3
P0 0 /AN 8
P0 1 /AN 9
P0 2 /AN 10
P0 3 /AN 11
P0 4 /AN 12
P0 5 /AN 13
P0 6 /AN 14
P0 7 /AN 15
P1 0 /INT 41
P1 1 /INT 01
P1 2
P1 3
P1 4
P1 5
P1 6
P1 7
P2 0 (LED 0 )
P2 1 (LED 1 )
P2 2 (LED 2 )
P2 3 (LED 3 )
P2 4 (LED 4 )
P2 5 (LED 5 )
P2 6 (LED 6 )
P2 7 (LED 7 )
Outline SP: PRDP0064BA-A (64P4B) (1.78 mm pitch)
3
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
33
34
35
36
37
39
38
40
42
41
43
45
44
Note: KP for 3808H/3803L Groups only.
FP for 3803/3803H Groups
(Mask/Flash memory versions) only.
32
31
49
50
51
52
53
54
55
56
30
16
20
19
18
17
15
14
13
12
11
9
10
8
7
29
28
27
26
25
24
23
22
21
P20(LED0)
P21(LED1)
P22(LED2)
P23(LED3)
P24(LED4)
P25(LED5)
P26(LED6)
P27(LED7)
VSS
XOUT
XIN
P40/INT40/XCOUT
P41/INT00/XCIN
RESET
CNVSS VPP
P42/INT1
P54/CNTR0
P53/SRDY2
P52/SCLK2
P51/SOUT2
P50/SIN2
P47/SRDY1/CNTR2
P46/SCLK1
P45/TXD1
P44/RXD1
P42/INT2
6
5
3
P62/AN2
P61/AN1
P60/AN0
P57/INT3
P56/PWM
P55/CNTR1
4
57
58
59
60
61
62
63
64
2
M3803XMXH-XXXFP/HP/KP
M38039MFL-XXXHP/KP
M3803XMX-XXXFP/HP
M38039FFHFP/HP/KP
M38039FFLHP/KP
M38039FFFP/HP
M38039GXH-XXXHP/KP
M38039GXHHP/KP
1
P37/SRDY3
P36/SCLK3
P35/TXD3
P34/RXD3
P33
P32
P31/DA2
P30/DA1
VCC
VREF
AVSS
P67/AN7
P66/AN6
P65/AN5
P64/AN4
P63/AN3
46
48
Completely
Completely
PinCompatible
Compatible
Pin
47
P00/AN8
P01/AN9
P02/AN10
P03/AN11
P04/AN12
P05/AN13
P06/AN14
P07/AN15
P10/INT41
P11/INT01
P12
P13
P14
P15
P16
P17
3803L/3803H/3803Groups
GroupsPin
PinConfiguration
Configuration(FP/HP/KP)
(FP/HP/KP)
3803L/3803H/3803
Outline KP: PLQP0064GA-A (64P6U-A) (0.8 mm pitch, 14 mm square, 1.7 mm mounting height)
FP: PRQP0064GA-A (64P6N-A) (0.8 mm pitch, 14 mm square, 3.05 mm mounting height)
HP: PLQP0064KB-A (64P6Q-A) (0.5 mm pitch, 10 mm square, 1.7 mm mounting height)
4
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803L/3803HGroups
GroupsPin
PinConfiguration
Configuration(WG)
(WG)
3803L/3803H
Completely
Completely
PinCompatible
Compatible
Pin
(TOP view)
8
A
B
C
D
E
50
46
44
41
40
32
31
30
P10/INT41
P25 (LED0)
P21 (LED1)
P22 (LED2)
P36/SCLK3
7
51
P35/TxD3
6
5
4
42
P06/AN14
39
P11/INT01
27
29
P25 (LED5)
P23 (LED3)
28
52
48
43
38
37
26
25
P00/AN8
P05/AN13
P12
P13
P26 (LED6)
P27 (LED7)
56
55
54
49
33
36
35
34
P30/DA1
P31/DA2
P32
P37/SRDY3
P17
P14
P15
P16
64
58
59
57
24
22
23
VREF
AVss
VCC
VSS
XIN
4
7
14
21
1
60
62
2
P61/AN1
A
P63/AN3
61
P66/AN6
63
5
P64/AN4
3
P57/INT3 P54/CNTR0
8
P47/SRDY1/CNTR2
10
P45/TxD1
6
9
C
D
30
7
5
Package top view
4
XOUT
20
13
3
P41/INT40/XCIN
17
P42/INT1
19
2
RESET
11
15
16
18
P50/SIN2
P44/RxD1
P43/INT2
CNVSS
E
F
G
H
P22 (LED2)
The pin number
corresponds to
the flat package.
6
P40/INT40/XCOUT
P56/PWM P53/SRDY2 P51/SOUT2 P46/SCLK1
P60/AN0 P55/CNTR1 P52/SCLK2
B
12
8
P24 (LED4)
P34/RxD3
P65/AN5
1
45
P03/AN11
H
P33
P67/AN7
2
47
P01/AN9
G
53
P62/AN2
3
P02/AN10 P04/AN12 P07/AN15
F
1
M38039GCH
-XXXWG
M38039GCHWG
M38039MFH
-XXXWG
M38039MFL
-XXXWG
M38039FFHWG
M38039FFLWG
Outline WG: PTLG0064JA-A (64F0G) (6 mm square FLGA package, 1.05 mm height)
5
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
DifferencesBetween
Between3803L/3803H/3803
3803L/3803H/3803Groups
Groups(1)
(1)
Differences
3803L Group
Mask ROM ver.
3803H Group
Flash Memory ver.
Mask ROM ver.
3803 Group
Flash Memory ver.
QzROM ver.
Mask ROM ver.
Flash Memory ver.
Program Memory
Mask ROM
Flash memory
Mask ROM
Flash memory
QzROM
Mask ROM
Flash memory
Program Memory
/RAM size
60K/2K
60K/2K
16K/640, 24K/1K,
32K/1K, 48K/2K,
60K/2K
60K/2K
16K/2K, 24K/2K,
32K/2K, 48K/2K
16K/640, 24K/1K,
32K/1K, 48K/2K,
60K/2K
60K/2K
Package
SP, HP, KP, WG
SP, HP, KP, WG
SP, FP, HP, KP,
WG
SP, FP, HP, KP, WG
SP, HP, KP, WG
SP, FP, HP
SP,FP,HP
Operating Power
Source Voltage
1.8 to 5.5 V
2.7 to 5.5 V
1.8 to 5.5 V
2.7 to 5.5V
1.8 to 5.5 V
2.7 to 5.5 V
4.0 to 5.5V
Power Source Voltage 2.0 to 5.5 V
(8-bit A/D mode)
When using A/D
2.2 to 5.5 V
Converter
(10-bit A/D mode)
2.7 to 5.5 V
(8-bit A/D mode)
2.7 to 5.5 V
(10-bit A/D mode)
2.0 to 5.5 V
(8-bit A/D mode)
2.2 to 5.5 V
(10-bit A/D mode)
2.7 to 5.5V
(8-bit A/D mode)
2.7 to 5.5 V
(10-bit A/D mode)
2.0 to 5.5 V
(8-bit A/D mode)
2.2 to 5.5 V
(10-bit A/D mode)
2.7 to 5.5 V
(8-bit A/D mode)
2.7 to 5.5 V
(10-bit A/D mode)
4.0 to 5.5V
(8-bit A/D mode)
4.0 to 5.5 V
(10-bit A/D mode)
Flash Memory ID
Code
–
Addresses FFD4 to
FFDAh
–
Addresses FFD4 to
FFDAh
–
–
–
Flash Memory ROM
Code Protect
–
Address FFDBh
–
Address FFDBh
–
–
–
QzROM ROM Code
Protect
–
–
–
–
Address FFDBh
–
–
Flash Memory Control
Register
–
Flash Memory control
registers 0 to 2
Addresses 0FE0h to
0FE2h
–
Flash Memory control
registers 0 to 2
Addresses 0FE0h to
0FE2h
–
–
Flash Memory control
register Address 0FFEh
Flash command register
Address 0FFFh
Program/Erase
Power Source
(Program-only for
QzROM ver.)
–
Single power source
(Vcc = 2.7 to 5.5 V)
–
Single power source
(Vcc = 2.7 to 5.5 V)
Dual power source
–
(Vcc = 2.7 V to 5.5 V,
Vpp = 7.9 V ± 0.1 V)
Dual power source
(Vcc = 5 V ± 0.5 V,
Vpp = 11.7 to 12.6 V)
Program/Erase Mode
(Program-only for
QzROM ver.)
–
CPU Rewrite Mode
Parallel I/O Mode
Standard serial I/O Mode
–
CPU Rewrite Mode
Parallel I/O Mode
Standard serial I/O
Mode
Serial I/O mode
CPU Rewrite Mode
Parallel I/O Mode
Standard serial I/O Mode
6
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
–
DifferencesBetween
Between3803L/3803H/3803
3803L/3803H/3803Groups
Groups(2)
(2)
Differences
3803L Group
Mask ROM ver.
3803H Group
Flash Memory ver.
Mask ROM ver.
Flash Memory ver.
3803 Group
QzROM ver.
Mask ROM ver.
Flash Memory ver.
A/D Converter
Bit 4 of AD Conversion
Register 2
0 when reading
(*1)
0 when reading
Same as bit 4 of
AD Conversion
Register 2 (*1)
0 when reading
0 when reading
(*1)
0 when reading
0 when reading
Time until Flash Memory
can Operate after
Returning from Stop Mode
Not needed
Needed: 100 μsec
Not needed
Needed: 100 μsec
Not needed
Not needed
Not needed
Power Source Circuit
Characteristics
Internal Power Source
Stable Time at Power-on
: td (P-R)
Not needed
Needed
Not needed
Needed
Not needed
Not needed
Not needed
Electrical Characteristics
Recommended Operating
Conditions
The power source current of the Flash memory version differs between the Groups. Also, the operating conditions differs according to different operating
voltages.
For details, refer to the corresponding datasheet.
*1: Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
7
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Improvementin
in3803H
3803H(L)
(L)&&3803
3803Groups
GroupsOperating
OperatingFrequency
FrequencyCharacteristics
Characteristics
Improvement
Flash memory version
Mask & QzROM versions
f (Xin)
f (Xin)
High-speed mode
16.8 MHz
16.8 MHz
12.5 MHz
12.5 MHz
8.4 MHz
4.2 MHz
2.1 MHz
8.4 MHz
Spec.H
Spec.L
f (Xin)
4.0 V 4.5 V 5.5 V
Middle-speed mode
16.8 MHz
2.7 V
Vcc
4.0 V 4.5 V 5.5 V
Vcc
Middle-speed mode
f (Xin)
16.8 MHz
12.5 MHz
8.4 MHz
6.3 MHz
Spec.H
Standard
Spec.L
Standard
2.0 V 2.2 V 2.7 V
12.5 MHz
©2008. Renesas Technology Corp., All rights reserved.
Spec.H
Spec.L Standard
Standard
Spec.H
Spec.L
1.8 V 2.2 V 2.7 V
8
High-speed mode
4.0 V 4.5 V 5.5 V
REJ99B0048-0401
Vcc
Rev.4.01
2.7 V
Date: Jul.02.08
4.0 V 4.5 V 5.5 V
Vcc
DifferencesBetween
BetweenMemory
MemoryMaps
Mapsof
of3803L/3803H/3803
3803L/3803H/3803Groups
Groups
Differences
SFR area
004016
RAM
RAM size
XXXX
640
02BF
1024
043F
2048
083F
010016
XXXX16
000016
004016
004016
004016
010016
010016
010016
Qz-ROM version
Zero page
Mask ROM version
000016
Flash memory version
Flash memory version
3803 Group
3803L, 3803H Group
000016 SFR area
SFR area
000016
SFR area
083F16
Not used
Not used
0FE016 SFR (incl. Reservation)
0FF616
0FE016
SFR (incl. Reservation)
0FF616
YYYY16 Reserved ROM area
ZZZZ16
YYYY16
083F16
Not used
083F16
Not used
Not used
0FE016 SFR (incl. Reservation)
0FF616 Not used
0FF016 SFR (incl. Reservation)
0FFF16
Reserved ROM area
100016
100016
ZZZZ16
ZZZZ16
ZZZZ16
FF0016
FF0016
FF0016
FFD416
FFD416
Not used
Not used
ROM
ROM size YYYY ZZZZ
C000 C080
24576
A000
A080
32768
8000
8080
49152
4000
4080
61440
1000
1080
FF0016
FFD416
FFDA16
FFDB16
FFDC16 Interrupt vector area
FFFE16 Reserved ROM area
FFFF16
9
©2008. Renesas Technology Corp., All rights reserved.
Special page
16384
FFDA16
FFDB16 Protect address
FFDC16 Interrupt vector area
FFFE16
FFFF16 Reserved ROM area
REJ99B0048-0401
Rev.4.01
FFD416
ID code
FFDA16
Protect address
FFDB16
FFDC16 Interrupt vector area
FFFE16 Reserved ROM area
FFFF16
Date: Jul.02.08
FFDA16
FFDB16
FFDC16 Interrupt vector area
FFFE16
Reserved ROM area
FFFF16
ReplacementNotes
Notes(1)
(1)
Replacement
According to the differences in the specifications shown in P.6 and 7, the following notes are suggested.
Please also refer to P.6 and 7.
1. Program Memory
Depending on the memory type, program/erase specifications as well as applicable programmers and adaptors differ.
Confirm the programmer applicable for your product.
2. Program Memory/ RAM Sizes
- As for the combination of the program memory and RAM sizes, the RAM of the QzROM version is 2K regardless of the program
memory size. Even with the same program memory size, the RAM size may differ between the QzROM/Mask ROM versions.
- In the QzROM version, 60K program memory is not available.
3. Packages
- In the QzROM version, the SP-package product is not available for programming before shipment.
- The WG-package product is available only with 60K program memory version in the 3803H/3803L Groups.
- In the 3803H Group QzROM version and the 3803L Group, the FP-package product is not available, but the thin KP package
product is available for 0.8 mm-pitch.
Even if the FP package product is available in other products, the KP package is recommended as 0.8 mm-pitch, because of its
excellence in thinness, heat radiation, and stress characteristics.
Confirm the mounting pad design standards of FP package and KP package on Renesas Surface Mount Package User's
Manual (Document No.: REJ11K0001)
4. Operating Power Source Voltage
- The operating power source voltage for the 3803H Group Mask ROM/QzROM versions and the 3803L Group Mask ROM version
ranges from 1.8 to 5.5V.
This range differs for other products, so confirm the operating power source voltage for your product.
5. Power Source Voltage when Using A/D Converter
- As the operating power source differs, the power source voltage range when using an A/D converter also differs.
Confirm the voltage when using an A/D converter for your product.
- In the 3803H Group Mask ROM/QzROM versions and the 3803L Group Mask ROM version, the power source voltage ranges from
2.0 to 5.5 V for 8-bit A/D mode, and 2.2 to 5.5 V for 10-bit A/D mode.
10
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
ReplacementNotes
Notes(2)
(2)
Replacement
6. Flash Memory ID code and ROM Code Protect
In the 3803H/3803L Groups Flash memory version, ID codes are assigned to addresses FFD to FFDA16, and ROM code protect is
assigned to address FFDB16. Please note that these addresses are included in the user ROM area. The data of these addresses must be
set to programming data before programming.
7. QzROM ROM Code Protect
In the QzROM version, ROM code protect is assigned to address FFDB16. If you select write to protect bit with a serial programmer or
select programming by Renesas Technology before shipment to enable protect, “0016” (all area protected) or “FE16” (protect area 1
protected) is written into this address. Otherwise, “FF16” is written to this address. The address cannot be used by user programs.
8. Flash Memory Control Registers
- In the 3803H/3803L Group Flash memory version, Flash Memory control registers 0 to 2 are assigned to addresses 0FE0 to 0FE216.
- In the 3803 Group Flash memory version, Flash Memory control register is assigned to address 0FFE16 and Flash command register is
assigned to address 0FFF16.
- In the Mask ROM/QzROM versions, nothing is allocated to these addresses, so writing can be performed to them.
When read, their values are undefined.
9. Program/Erase Power Source
The program/erase power source voltage as well as the absolute maximum ratings of the pins differ for each product. Ensure that the
specified programmer is connected to your product to prevent a voltage that exceeds the ratings from being applied to the pins.
10. Program/Erase Mode
In the QzROM version, only serial I/O mode is available in program/erase mode. When requesting off-board programming, please prepare
a separate board for that purpose. MCU units for serial programming may also be available from the programmer manufacturer.
11. Time until Flash Memory can Operate after Returning from Stop Mode
In the 3803H/3803L Group Flash memory version, the internal power supply circuit is switched to low power consumption mode for
reducing consumption current during STP instruction. Although the internal power supply circuit is automatically switched to the normal
operation mode when returning from the STP instruction, a certain time is required until the flash memory can operate after the power
supply restarts. Therefore, set 100 μsec or more by the oscillation stabilization time setting function after the STP instruction which uses
timer 1 is released.
11
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
ReplacementNotes
Notes(3)
(3)
Replacement
12. Internal Power Source Stable Time at Power-on
In the 3803H/3803L Group Flash memory version, input to the RESET pin at power-on (power-on reset) in the following procedure.
(1) Input “L” level to RESET pin.
(2) Increase the power source voltage to 2.7 V.
(3) Wait for td(P-R) (*1) until internal power source has stabilized.
(4) Input clock for 16 cycles or more to XIN pin.
(5) Input “H” level to RESET pin.
(*1) td(P-R): Internal power source stable time at power-on. Refer to Power Source Circuit timing Characteristics in the data sheet.
13. Oscillation Circuit Constants
The oscillation circuit structure differs between the 3803, 3803H, and 3803L Groups.
This also applies between the 3803H Group Mask ROM/Flash memory versions and the QzROM version.
Furthermore, the XIN-XOUT and XCIN-XCOUT oscillation circuit constants differ from product to product.
Contact the oscillator manufacturer to select an appropriate oscillator and oscillation circuit constants
so that the product used for mass production will obtain an stable operating clock with your system and conditions.
Additional consideration is required when the voltage range or the temperature range is wide.
Also, we recommend considering the wiring patterns of the feedback resistors, the damping resistors, and
the load capacity beforehand when designing circuits.
14. Differences between Mask ROM, Flash Memory, and QzROM Versions
The Flash memory, Mask ROM, and QzROM versions differ in their manufacturing processes and mask
patterns because of the different ROM types used. This also applies when the ROM type is the same but
the memory capacities differ. Because of these differences, characteristics values, operation margins,
noise immunity, noise radiation, and oscillation circuit constants may vary.
When developing application products, perform careful system evaluations for each product.
Additional care is required when replacing products (for example, replacing a Mask ROM version with a QzROM version).
Careful system evaluations should be performed with replacement products before the mass production phase of
application products.
12
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Programchange
changeatatreplacing
replacing(1)
(1)
Program
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product.
Note: Program checksum
When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation.
When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and
calculated values of the checksum are also undefined.
(1) Standard mask ROM version Æ Spec. L mask ROM version
Basically, to change a program is not necessary. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E
Rev.2.00).
(2) Standard flash memory version Æ Spec. L flash memory version
1. When using the addresses FFD4h to FFDAh, check the followings:
The codes written in these addresses are the ID codes of the Spec. L flash memory version when using a serial programmer. To input
this code is necessary as the ID code for flash memory reprogramming by a serial programmer. Check the above only when using a
serial programmer because the addresses can be executed as an instruction.
2. The bits 7 to 2 of the address FFDBh are the protect set bits of the Spec. L flash memory version when using a parallel programmer.
When the set condition is not unexpected, to change a program is necessary. Since the protect set bits do not affect when using a
serial programmer, there is no problem. This address can be executed as an instruction same as the addresses FFD4h to FFDAh.
3. When accessing the addresses 0FE0h to 0FEFh, to change a program not to access these addresses is necessary.
4. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. L flash memory version. To change a program is not necessary
even if programming in standard flash memory version is performed.
5. To change a program is necessary when the oscillation stabilization time after the STP instruction is released is less than 100 μ sec in
stop mode. Set 100 μ sec or more by the oscillation stabilization time setting function after the STP instruction which uses timer 1 is
released.
6. When using CPU rewrite mode, to change general processes regarding CPU rewrite mode is necessary.
(3) Spec. H mask ROM version Æ Spec. L mask ROM version
Basically, to change a program is not necessary. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E
Rev.2.00).
13
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Programchange
changeatatreplacing
replacing(2)
(2)
Program
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product.
Note: Program checksum
When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation.
When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and
calculated values of the checksum are also undefined.
(4) Spec. H flash memory version Æ Spec. L flash memory version
To change a program is not necessary.
(5) Standard mask ROM version Æ Spec. H QzROM version
1. QzROM version does not have the ROM 60 Kbytes version.
2. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect
address. Set this address FFh on a user program.
3. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
(6) Standard flash memory version Æ Spec. H QzROM version
1. QzROM version does not have the ROM 60 Kbytes version.
2. When using the first 128 bytes and last 2 bytes of ROM area, to change a program is necessary. Since the first 128 bytes and last 2
bytes of ROM area for QzROM version are reserved areas for the product inspection, those area cannot be used by a user program.
3. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect
address. Set this address FFh on a user program.
4. When accessing the addresses 0FE3h to 0FEFh, to change a program not to access these addresses is necessary.
5. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. H QzROM version. To change a program is not necessary even if
programming in standard flash memory version is performed.
6. When using CPU rewrite mode, delete processes regarding CPU rewrite mode.
7. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
14
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Programchange
changeatatreplacing
replacing(3)
(3)
Program
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product.
Note: Program checksum
When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation.
When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and
calculated values of the checksum are also undefined.
(7) Spec. H/L mask ROM version Æ Spec. H QzROM version
1. QzROM version does not have the ROM 60 Kbytes version.
2. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect
address. Set this address FFh on a user program.
3. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
(8) Spec. H/L flash memory version Æ Spec. H QzROM version
1. QzROM version does not have the ROM 60 Kbytes version.
2. When using the first 128 bytes and last 2 bytes of ROM area, to change a program is necessary. Since the first 128 bytes and last 2
bytes of ROM area for QzROM version are reserved areas for the product inspection, those area cannot be used by a user program.
3. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect
address. Set this address FFh on a user program.
4. Although the ID code (addresses FFD4h to FFDAh) does not have any functions in Spec. H QzROM version, to change a program is
not necessary.
5. Nothing is assigned on the addresses 0FE0h to 0FE2h of Spec. H QzROM version. To change a program is not necessary even if
programming in Spec. H/L flash memory version is performed.
6. When using CPU rewrite mode, delete processes regarding CPU rewrite mode.
7. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
15
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Reference:M38039FFH
M38039FFH(L)
(L)and
andM38039GXH
M38039GXHSerial
SerialRewriting
RewritingCircuit
Circuit
Reference:
whenUsing
UsingaaSuisei
SuiseiElectronics
ElectronicsSystem
SystemSerial
SerialUnit
Unit
when
Flash Memory ver.
M38039FFH
M38039FFL
The pin number indicates
the flat package version.
Differences
Note:
QzROM ver.
M38039GXH
(QzROM Programming Mode)
(Standard serial I/O Mode 1)
T_VDD
*2
T_TXD
T_SCLK
57
T_VDD
Vcc
*3
15
RXD (P44/RXD1)
T_SCLK
13
T_RXD
T_PGM/OE/MD
Vcc
N.C. 15 RXD (P44/RXD1)
13
ESCLK (P46/SCLK1)
Note: T_BUSY is not needed.
SCLK (P46/SCLK1)
Note: T_VPP is not needed.
T_BUSY
57
T_PGM/OE/MD
12
12
4.7 kΩ
BUSY (P47/SRDY1/CNTR2)
T_TXD*1
T_RXD
14 TXD (P45/TXD1)
T_VPP
18 CNVSS
14
18
ESPGMB
(P47/SRDY1/CNTR2)
ESDA (P45/TXD1)
CNVSS
4.7 kΩ
T_RESET
T_RESET
USER RST
GND
19 RESET(RESET)
24 Vss
XIN
RESET(RESET)
USER RST
GND
XOUT
Perform the same pin processing as in single chip mode.
19
24 Vss
XIN
XOUT
Perform the same pin processing as in single chip mode.
z As programming specifications differ for each product, specify the part number before programming.
z As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash Memory versions.
*1: For the QzROM version, connect both the serial unit’s T_TXD and T_RXD to TxD pin, and leave RxD pin open.
*2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer.
*3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for
other than the MCU), supply the VDD from the user.
16
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Reference:M38039FF
M38039FFand
and M38039FFH
M38039FFH(L)
(L)Serial
SerialRewriting
RewritingCircuit
Circuit
Reference:
whenUsing
UsingaaSuisei
SuiseiElectronics
ElectronicsSystem
SystemSerial
SerialUnit
Unit
when
The pin number indicates
the flat package version.
M38039FF
(Standard serial I/O Mode 1)
(Standard serial I/O Mode)
T_VDD
T_TXD *1
T_RXD
T_SCLK
T_PGM/OE/MD
T_BUSY
*3
57
15
13
49
12
N.C. 14
T_VPP
M38039FFH
M38039FFL
Differences
Note:
18
Vcc
T_VDD
SDA (P44/RXD1)
T_TXD
SCLK (P46/SCLK1)
T_SCLK
OE (P37/SRDY3)
*2
T_BUSY
BUSY (P47/SRDY1 /CNTR2)
T_RXD
TXD (P45/TXD1)
VPP (CNVSS)
T_PGM/OE/MD
57
15
13
12
Vcc
RXD (P44/RXD1)
SCLK (P46/SCLK1)
BUSY (P47/SRDY1/CNTR2)
14 TXD (P45/TXD1)
18
CNVSS
Note: T_VPP is not needed.
T_RESET
19
USER RST
24
GND
T_RESET
RESET(RESET)
Vss
USER RST
GND
XIN XOUT
Perform the same pin processing as in single chip mode.
19
24
RESET(RESET)
Vss
XIN
XOUT
Perform the same pin processing as in single chip mode.
z As programming specifications differ for each product, specify the part number before programming.
z As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash memory versions.
*1: For the standard version, connect both the serial unit’s T_TXD and T_RXD to SDA (RxD pin), and leave TxD pin open.
*2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer.
*3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for
other than the MCU), supply the VDD from the user.
17
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Renesas
Renesas
3803L/3803H/3803Groups
GroupsDevelopment
DevelopmentSupport
SupportTools
Tools
3803L/3803H/3803
Except programmers, development support tools are common to the Groups.
Development Support Tool
Part Number
Assembler package
M3T-SRA74
(Simulator debugger incl. Integrated Development Environment with HEW)
M3T-ICC740
(Simulator debugger incl. Integrated Development Environment with HEW)
Compiler Package
Simulator Debugger
M3T-SRA74, M3T-ICC740 or M3T-PD38SIM accessory (discontinued)
On-chip Debugging Emulator
(3803L Group)
E8a
(incl. HEW, 740 E8a emulator debugger, M3T-SRA74 free evaluation version,
M3T-ICC740 free evaluation version, FDT free evaluation version, and more)
M38000T2-CPE
(incl. 740 Compact emulator debugger, M3T-ICC740 (with HEW), and
M3T-SRA74 (with HEW) )
Compact
Emulator
System
Compact Emulator
Emulator MCU
PC4701
Emulator
System
(Discontinued
Product)
M38049RLSS
Emulator Debugger
740 PC4701 emulator debugger or M3T-PD38 (discontinued)
Emulator
PC4701U (emulator debugger license bundled)
Emulation Pod
M38000TL2-FPD (low voltage operation supported) (discontinued)
Emulator MCU
M38049RLSS
RSK (Renesas Starter Kit for 3803L)
Accessory
R0K338039S001BR
Package Converter
(Refer to the next page)
Pin processing board
18
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
M38007T-ADS (pin processing board for Emulator MCU)
Rev.4.01
Date: Jul.02.08
ConnectingEmulator
Emulatorand
andTarget
TargetSystem
System
Connecting
Compact emulator system
PC4701 System (discontinued)
Emulation Pod
M38000TL2-FPD
(discontinued)
Compact emulator
M38000T-CPE
*Emulator Pod Probe type
30-pin narrow pitch connector x 1
M3T-28DP-WS *1
*1. This converter is included in Emulator Pod Package.
*2. These 3 parts are as one set.
*3. These 4 parts are as one set.
*4. Available from Tokyo Eletech Corporation.
* The z mark indicates the location of No.1 pin.
M3T-28DP-WT
RSS type emulator MCU
M38049RLSS
FP/KP package boardmounted evaluation
M38007T-PRB
M3T-64LCC-QSD
64-pin SDIP socket
(SP package)
YQSOCKET064SDF2
(Sold Separately) *4
YQPACK064SD
(Sold Separately) *4
HP package sample
Board-mounted evaluation
HQPACK064SD
(Sold Separately) *4
©2008. Renesas Technology Corp., All rights reserved.
*2
FP package :
HQPACK064SA
(Sold Separately) *4
KP package :
HQPACK064SA160
*3 (Sold Separately) *4
HP package version
M3T-64LCC-QSD
64-pin 0.5 mm pitch QFP
NQPACK064SD-ND (Sold Separately) *4
(HP package)
64-pin 0.5 mm pitch QFP
(HP package)
19
M3T-64DIP-DMS
REJ99B0048-0401
FP/KP package version
M3T-DUMMY64
M3T-FLX-64NSA
64-pin 0.8 mm pitch QFP
64pin
(FP package)
0.8 mm pitch QFP/LQFP
(FP/KP package)
Rev.4.01
Date: Jul.02.08
3803H/3803LGroups
Groups
3803H/3803L
SuiseiElectronics
ElectronicsSystem
SystemFlash
FlashMemory/QzROM
Memory/QzROMProgrammers
Programmers
Suisei
Main unit
Serial/Parallel Unit
On-board reprogramming/programming
M38039FFH
M38039FFL
Flash memory version
(Serial programming)
EFP-S2V
EFP-S2
in common
EFP-I
M38039GXH
QzROM version
(Serial
programming)
EF1SRP-01US2
EF1CNT-96P
+
EF1SRP-01U
EF1CNT-96P
+
EF1SRP-05U
EF1SRP-01U
EF1SRP-05U
Off-board reprogramming/programming
M38039FFH
M38039FFL
Flash memory version
(Parallel programming)
M38039GXH
QzROM version
(Serial programming +
MCU unit for programming)
EF1CNT-96P
+ Parallel unit
EF3803F-64H (for HP)
EF3803F-64F (for FP)
EF3803F-64U (for KP)
EF3803F-64S (for SP)
EF3803F-64FL (for WG)
EF1SRP-01US2
(or EF1CNT-96P
+ EF1SRP-05U)
+ MCU unit
MS3803-64H (for HP)
MS3803-64U (for KP)
MS3803-64S (for SP)
Parallel unit
EF3803F-64H (for HP)
EF3803F-64F (for FP)
EF3803F-64U (for KP)
EF3803F-64S (for SP)
EF3803F-64FL (for WG)
EF1SRP-05U
+ MCU unit
MS3803-64H (for HP)
MS3803-64U (for KP)
MS3803-64S (for SP)
EF1CNT-96P: Connector converter unit
Each unit for EFP-I can be connected to EFP-S2 or EFP-S2V by EF1CNT-96P.
As a Renesas Flash memory/QzROM programmer, the Flash Development Toolkit (FDT) and the E8 can be
used together for on-board programming. (IC socket boards are required for the QzROM on-board programming.)
20
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803Group
GroupProgrammers
Programmers
3803
Tools
3803 Group Products
RENESAS
Programming Adapter
PCA4738HF-64 (for 0.5 mm-pitch LQFP package)
PCA4738FF-64 (for 0.8 mm-pitch QFP package)
PCA4738SF-64 (for 1.778 mm-pitch SDIP package)
EFP-I for Serial Interface
Available from Suisei Electronics System Co., Ltd.
R4945, R4945A for Parallel Interface
Available from ADVANTEST Corp.
(RENESAS Programming Adapter required)
AF9709, AF9708, AF9723 for Standard Parallel Interface
Available from Flash Support Group, Inc.
(RENESAS Programming Adapter required)
Flash Memory Programmer
21
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Recommended3803
3803Group
GroupReplacements
Replacements
Recommended
The following 3803 Group products are recommended to
replace with the products shown as below.
Please consider these replacements when adopting the
applicable products to a new system.
(*1): If requesting writing by Renesas, M38039MFL-XXXSP in the
3803L Group mask ROM version is recommended as replacement.
Please refer to the Differences between the 3803L/3803H/3803
Groups (P.6 and 7).
22
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803H Group
M38034M4H-XXXSP
M38034M4H-XXXFP
M38034M4H-XXXHP
M38034M4H-XXXKP
M38037M6H-XXXSP
M38037M6H-XXXFP
M38037M6H-XXXHP
M38037M6H-XXXKP
M38037M8H-XXXSP
M38037M8H-XXXFP
M38037M8H-XXXHP
M38037M8H-XXXKP
M38039MCH-XXXSP
M38039MCH-XXXFP
M38039MCH-XXXHP
M38039MCH-XXXKP
M38039MFH-XXXSP
M38039MFH-XXXFP
M38039MFH-XXXHP
M38039MFH-XXXKP
M38039MFH-XXXWG
M38039FFHSP
M38039FFHFP
M38039FFHHP
M38039FFHKP
M38039FFHWG
Replacement product
3803L Group
M38039G4HSP (*1)
M38039G4H-XXXKP
M38039G4H-XXXHP
M38039G6HSP (*1)
M38039G6H-XXXK
M38039G6H-XXXHP
M38039G8HSP (*1)
M38039G8H-XXXKP
M38039G8H-XXXHP
M38039GCHSP (*1)
M38039GCH-XXXKP
M38039GCH-XXXHP
M38039MFL-XXXSP
M38039MFL-XXXKP
M38039MFL-XXXHP
M38039FFLSP
M38039FFLKP
M38039FFLHP
3803H Group
3803H Group
M38034M4-XXXSP
M38034M4-XXXFP
M38034M4-XXXHP
M38037M6-XXXSP
M38037M6-XXXFP
M38037M6-XXXHP
M38037M8-XXXSP
M38037M8-XXXFP
M38037M8-XXXHP
M38039MC-XXXSP
M38039MC-XXXFP
M38039MC-XXXHP
M38039MF-XXXSP
M38039MF-XXXFP
M38039MF-XXXHP
M38039FFSP
M38039FFFP
M38039FFHP
Replacement product
3803L Group
3803 Group
Applicable Products
Applicable Products
M38039G4HSP (*1)
M38039G4H-XXXKP
M38039G4H-XXXHP
M38039G4H-XXXKP
M38039G6HSP (*1)
M38039G6H-XXXKP
M38039G6H-XXXHP
M38039G6H-XXXKP
M38039G8HSP (*1)
M38039G8H-XXXKP
M38039G8H-XXXHP
M38039G8H-XXXKP
M38039GCHSP (*1)
M38039GCH-XXXKP
M38039GCH-XXXHP
M38039GCH-XXXKP
M38039MFL-XXXSP
M38039MFL-XXXKP
M38039MFL-XXXHP
M38039MFL-XXXKP
M38039MFL-XXXWG
M38039FFLSP
M38039FFLKP
M38039FFLHP
M38039FFLKP
M38039FFLWG
REVISION HISTORY
Rev.
Date
Page
4.00
May 08, 2008
1
Title revised
Page 2 to 4 in the previous version (Rev.3.03) deleted
2
Table layout revised
2 to 5
Jun. 16, 2008
(1) added at end of the page title
Program/erase power supply of QzROM version: Vcc revised
7
Page added because of new items
9
Newly added
10
(1) Added at end of the page title
11
Page title added
Item 7: Values to be written for protection added
Item 11, 12: Added
12
Page title added
Item No. revised according to additions
Newly added
18
On-chip debugging emulator added
Renesas Starter Kit for 3803L: Part number added
19
PC4701 system: “(discontinued)” added
Part number revised: NQPACK064SD Æ NQPACK064SD-ND
Version revised: Flash memory version Æ HP package version, FP/KP package version
20
3803L Group Flash memory version: Marks (**) for under development products deleted
22
Replacements QzROM version SP package products: Note added
9
ROM size in table changed: ZZZZ 1000 Æ 1080
10
Item 3: Information about mounting pad added
7,13,14,15
23
3803L Group Flash memory version: Marks (**) for under development products deleted
6
13 to 15
4.01
Summary
©2008. Renesas Technology Corp., All rights reserved.
Spec.H QzROM version: “Refer to the technical update, Note on 3803 Group A/D Converter (TN-380A067B/E).” added
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
©2008. Renesas Technology Corp., All rights reserved.
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1.
2.
3.
4.
5.
6.
7.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”:
8.
9.
10.
11.
12.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.