Environmental Management and Materials Information Product Content Information for: DS3106LN+ Links Qualifications Package Description Chemical Composition Summary Detailed Package Component Data Qualifications Top Lead−Free Qualified Yes REACH Yes: 2011−06−20 RoHS Qualified Yes Starting Date Code: 0515+ Green Moisture Sensitivity Level L3 Flammability Meets UL−94 (V−0 Rating) No Assembler Qualified Amkor Korea Package Description Top Package Code C64+8 Package Type LQFP Package Description Low Quad Flatpack Package Option Standard Footprint Area (mm2) 148.8 Body Size 10x10x1.4mm Pin Count 64 Unit Weight in Grams 0.357 Chemical Composition Summary Top Maxim NIA/NIU Substance List (PDF, 24k) Substance CAS Number Aluminum (Al) 7429−90−5 0 0 Antimony (Sb2O3) 1309−64−4 0 0 0 0 0 0 BCB Resin Bromine (Br) 7726−95−6 Amount (grams) % of Unit Weight 1 Carbon (C) 7440−44−0 0 0 Carbon Black 1333−86−4 0.001089 0.30504 Ceramic (BaTiO3) 12047−27−7 0 0 Chromium (Cr) 7440−47−3 0.000293 0.08207 Cobalt (Co) 7440−48−4 0 0 Copper (Cu) 7440−50−8 0.097094 27.19720 Gold (Au) 7440−57−5 0.00199 0.55742 Indium (In) 7440−74−6 0 0 0 0 Insulator (Polyimide) Iron (Fe) 7439−89−6 0 0 FeO2 12411−15−36 0 0 Lead (Pb) 7439−92−1 0 0 Magnesium (Mg) 7439−95−4 0 0 Manganese (Mn) 7439−96−5 0 0 0 0 0 0 NiPdAu 0 0 Nickel−V (NiV) 0 0 MnO3 Nickel (Ni) 7440−02−0 Palladium (Pd) 7440−05−3 0 0 Phosphorus (P) 7723−14−0 0 0 Silica (SiO2) 11126−22−0 0.191655 53.68487 Silicon (Si) 7440−21−3 0.030404 8.51653 Silver (Ag) 7440−22−4 0.003869 1.08375 Solder Mask 0 0 Solder Paste 0 0 Spheron Polymer Passivation 0 0 Sulfur (S) 7704−34−9 0 0 Tin (Sn) 7440−31−5 0.003737 1.04678 Titanium (Ti) 7440−32−6 0 0 0 0 Titanium−W (TiW) Tungsten (W) 7440−33−7 0 0 Vanadium (V) 7440−62−2 0 0 Zinc (Zn) 7440−66−6 0.000196 0.05490 ZnO 1314−13−2 0 0 Zirconium (Zr) 7440−67−7 0 0 Detailed Package Component Data Top 2 Bond Wire Components Summary Component Weight 0.00199 Substance Amount (grams) % of Component Weight % of Unit Weight Gold (Au) 0.001990 100.00000 0.55742 0 0 0 Aluminum (Al) Die Attach Epoxy Components Summary Die Attach Material 8361J Component Weight 0.002936 % of Component Weight % of Unit Weight 0 0 0 0 0 0 9.09401 0.07479 Functionalized Ester 0 0 Functionalized Urethane 0 0 0 0 0 0 0 0 Polymeric 0 0 Polyoxypropylenediamine 0 0 0 0 0 0.002669 90.90599 0.74762 0 0 0 0 0 Substance Amount (grams) Aromatic Amine Copper (Cu) 0 Diester Epoxy Indium (In) 0.000267 0 Lactone Lead (Pb) Resin Silver Filler (Ag) Tin (Sn) 0 Other Lead Finish/Plating Components Summary Lead Finish Plating 100% Tin Assembly Lead Finish Process Component Weight Substance Lead (Pb) 0.003492 Amount (grams) % of Component Weight % of Unit Weight 0 0 0 3 Tin (Sn) 0.003492 100.00000 0.97815 NiPdAu 0 0 0 Gold (Au) 0 0 Nickel (Ni) 0 0 Lead Frame Components Summary Lead Frame Material Copper EFTEC64T Component Weight 0.099028 % of Component Weight % of Unit Weight Aluminum (Al) 0 0 Carbon (C) 0 0 0.29588 0.08207 0 0 98.04702 27.19720 Gold (Au) 0 0 Iron (Fe) 0 0 Lead (Pb) 0 0 Magnesium (Mg) 0 0 Manganese (Mn) 0 0 Nickel (Ni) 0 0 Palladium (Pd) 0 0 Phosphorus (P) 0 0 Silicon (Si) 0 0 1.21178 0.33613 0 0 Substance Chromium (Cr) Amount (grams) 0.000293 Cobalt (Co) Copper (Cu) Silver (Ag) 0.097094 0.001200 Sulfur (S) Tin (Sn) 0.000245 0 0 Zinc (Zn) 0.000196 0.19792 0.05490 0 0 0 Zirconium (Zr) Mold Compound Components Summary Mold Material Sumitomo G700L Resin Type Multi−Functional Component Weight Substance 0.21779 Amount (grams) % of Component Weight % of Unit Weight 4 Antimony (Sb2O3) 0 0 Bromine (Br) 0 0 0.50002 0.30504 Epoxy 0 0 Epoxy Cresol Novolac 0 0 Metal Hydroxide 0 0 Phenol Novolac 0 0 Carbon Black 0.001089 Silica (SiO2) 0.191655 87.99991 53.68487 Resin 0.025046 11.50007 7.01569 0 0 Substance Amount (grams) % of Component Weight % of Unit Weight Silicon Chip 0.030404 100 8.51653 Other Silicon Chip Components Substrate Components Summary Substrate Weight Substrate Material 0 Substrate Core Material Bromine−Free % of Component Weight % of Unit Weight Copper 0 0 Gold 0 0 Nickel 0 0 Substrate Core Material 0 0 Solder Mask 0 0 Triazol 0 0 Other 0 0 Substance Amount (grams) 5 Notes: 1. Lead Form: GW − Gull Wing, TH − Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. + Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by date code only. If you need to confirm delivery of Halogen−free product, please contact Customer Service. This part is qualified as lead−free. Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for particular package types qualified as lead−free or in the qualification process). This report was generated on 2012−01−23. For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: http://www.maxim−ic.com/emmi 6