MAX3671ETN+ RELIABILITY REPORT FOR MAX3671ETN+ (MAX3673) PLASTIC ENCAPSULATED DEVICES June 8, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5 MAX3671ETN+ Conclusion The MAX3671ETN+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX3671/ MAX3763 are low-jitter frequency synthesizers that accepts two reference clock inputs and generates nine phase-aligned outputs. The device features 40kHz jitter transfer bandwidth, 0.3psRMS (12kHz to 20MHz) integrated phase jitter, and best-in-class power-supply noise rejection (PSNR), making it ideal for jitter cleanup, frequency translation, and clock distribution in Gigabit Ethernet applications. The MAX3671 / MAX3673 operate from a single +3.3V supply and typically consumes 400mW. The IC is available in an 8mm x 8mm, 56-pin TQFN package, and operates from -40°C to +85°C. Maxim Integrated Products. All rights reserved. Page 2/5 MAX3671ETN+ II. Manufacturing Information A. Description/Function: Low-Jitter Frequency Synthesizer with Selectable Input Reference B. Process: MB3 C. Number of Device Transistors: D. Fabrication Location: California E. Assembly Location: UTL Thailand F. Date of Initial Production: January 31, 2009 III. Packaging Information A. Package Type: 56-pin TQFN 8x8 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive Epoxy E. Bondwire: Au (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 3 J. Single Layer Theta Ja: 35°C/W K. Single Layer Theta Jc: 0.6°C/W L. Multi Layer Theta Ja: 21°C/W M. Multi Layer Theta Jc: 0.6°C/W IV. Die Information A. Dimensions: 111 X 111 mils B. Passivation: BCB C. Interconnect: 2 x Aluminum/Cu (Cu = 0.5%), top layer 100% Cu D. Backside Metallization: None E. Minimum Metal Width: 0.35 um F. Minimum Metal Spacing: 0.35 um G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Saw Maxim Integrated Products. All rights reserved. Page 3/5 MAX3671ETN+ V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows: = 1 MTTF = 1.83 169007 x 1555 x 2 (Chi square value for MTTF upper limit) (where 1555 = Temperature Acceleration factor assuming an activation energy of 0.7eV and 169007 = Device Hrs at Stress, 135°C) -9 = 2.3 x 10 = 2.3 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/. Current monitor data for the MB3HT Process results in a FIT Rate of 0.7 @ 25C and 11.5 @ 55C (0.7 eV, 60% UCL) B. Moisture Resistance Tests The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The HT59 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500 V per JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250 mA, 1.5x VCCMax Overvoltage per JESD78. Maxim Integrated Products. All rights reserved. Page 4/5 MAX3671ETN+ Table 1 Reliability Evaluation Test Results MAX3671ETN+ TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 466 0 DC Parameters & functionality 77 0 DC Parameters & functionality 77 0 Time = mixed hrs Moisture Testing (Note 2) 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. Mechanical Stress (Note 2) -65°C/150°C Temperature 1000 Cycles Cycle Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5