Environmental Management and Materials Information Product Content Information for: MAX3674ECM+ Links Qualifications Package Description Chemical Composition Summary Detailed Package Component Data Qualifications Top Lead−Free Qualified Yes REACH Yes: 2011−06−20 RoHS Qualified Yes Starting Date Code: 1146+ Green Moisture Sensitivity Level L1 Flammability Meets UL−94 (V−0 Rating) Yes Assembler Qualified Carsem S Package Description Top Package Code C48+3 Package Type TQFP Package Description Thin Quad Flatpack Package Option Standard Footprint Area (mm2) 84.6 Body Size 7x7x1.4 mm Pin Count 48 Unit Weight in Grams 0.20813 Chemical Composition Summary Top Maxim NIA/NIU Substance List (PDF, 24k) Substance CAS Number Aluminum (Al) 7429−90−5 0 0 Antimony (Sb2O3) 1309−64−4 0 0 0 0 0 0 BCB Resin Bromine (Br) 7726−95−6 Amount (grams) % of Unit Weight 1 Carbon (C) 7440−44−0 0 0 Carbon Black 1333−86−4 0 0 Ceramic (BaTiO3) 12047−27−7 0 0 Chromium (Cr) 7440−47−3 0 0 Cobalt (Co) 7440−48−4 0 0 Copper (Cu) 7440−50−8 0.06911 33.20521 Gold (Au) 7440−57−5 0.00255 1.22520 Indium (In) 7440−74−6 0 0 0 0 2e−05 0.00961 Insulator (Polyimide) Iron (Fe) 7439−89−6 FeO2 12411−15−36 0 0 Lead (Pb) 7439−92−1 0 0 Magnesium (Mg) 7439−95−4 0.00011 0.05285 Manganese (Mn) 7439−96−5 0 0 0 0 0.00188 0.90328 NiPdAu 0 0 Nickel−V (NiV) 0 0 MnO3 Nickel (Ni) 7440−02−0 Palladium (Pd) 7440−05−3 0 0 Phosphorus (P) 7723−14−0 0 0 Silica (SiO2) 11126−22−0 0.09672 46.47096 Silicon (Si) 7440−21−3 0.015 7.20703 Silver (Ag) 7440−22−4 0.00162 0.77836 Solder Mask 0 0 Solder Paste 0 0 Spheron Polymer Passivation 0 0 Sulfur (S) 7704−34−9 0 0 Tin (Sn) 7440−31−5 0.00384 1.84500 Titanium (Ti) 7440−32−6 0 0 0 0 Titanium−W (TiW) Tungsten (W) 7440−33−7 0 0 Vanadium (V) 7440−62−2 0 0 Zinc (Zn) 7440−66−6 2e−05 0.00961 ZnO 1314−13−2 0 0 Zirconium (Zr) 7440−67−7 0 0 Detailed Package Component Data Top 2 Bond Wire Components Summary Component Weight 0.00255 Substance Amount (grams) % of Component Weight % of Unit Weight Gold (Au) 0.00255 100.00000 1.22520 0 0 0 Aluminum (Al) Die Attach Epoxy Components Summary Die Attach Material Loctite QMI519 Component Weight 0.00106 % of Component Weight % of Unit Weight 0 0 0 0 0 0 15.09434 0.07688 Functionalized Ester 0 0 Functionalized Urethane 0 0 0 0 0 0 0 0 Polymeric 0 0 Polyoxypropylenediamine 0 0 0 0 0 0.0009 84.90566 0.43242 0 0 0 0 0 Substance Amount (grams) Aromatic Amine Copper (Cu) 0 Diester Epoxy Indium (In) 0.00016 0 Lactone Lead (Pb) Resin Silver Filler (Ag) Tin (Sn) 0 Other Lead Finish/Plating Components Summary Lead Finish Plating 100% Tin Assembly Lead Finish Process Component Weight Substance Lead (Pb) 0.00384 Amount (grams) % of Component Weight % of Unit Weight 0 0 0 3 Tin (Sn) 0.00384 100.00000 1.84500 NiPdAu 0 0 0 Gold (Au) 0 0 0 Nickel (Ni) 0 0 0 Lead Frame Components Summary Lead Frame Material Copper C7025 Component Weight 0.07186 % of Component Weight % of Unit Weight Aluminum (Al) 0 0 Carbon (C) 0 0 0 0 0 0 96.17311 33.20521 0 0 0.02783 0.00961 0 0 0.15308 0.05285 0 0 2.61620 0.90328 Palladium (Pd) 0 0 Phosphorus (P) 0 0 Silicon (Si) 0 0 1.00195 0.34594 Sulfur (S) 0 0 Tin (Sn) 0 0 2e−05 0.02783 0.00961 0 0 0 Substance Chromium (Cr) Amount (grams) ND Cobalt (Co) Copper (Cu) 0.06911 Gold (Au) Iron (Fe) 2e−05 Lead (Pb) Magnesium (Mg) 0.00011 Manganese (Mn) Nickel (Ni) Silver (Ag) Zinc (Zn) Zirconium (Zr) 0.00188 0.00072 Mold Compound Components Summary Mold Material Sumitomo G700L Resin Type Multi−Functional Component Weight Substance 0.11382 Amount (grams) % of Component Weight % of Unit Weight 4 Antimony (Sb2O3) ND 0 0 Bromine (Br) ND 0 0 Carbon Black 0 0 Epoxy 0 0 Epoxy Cresol Novolac 0 0 Metal Hydroxide 0 0 Phenol Novolac 0 0 0.09672 84.97628 46.47096 0.0171 15.02372 8.21602 0 0 Amount (grams) % of Component Weight % of Unit Weight 0.015 100 7.20703 Silica (SiO2) Resin Other Silicon Chip Components Substance Silicon Chip Substrate Components Summary Substrate Weight Substrate Material 0 Substrate Core Material 0 Bromine−Free 0 Amount (grams) % of Component Weight % of Unit Weight Copper 0 0 0 Gold 0 0 0 Nickel 0 0 0 Substrate Core Material 0 0 0 Solder Mask 0 0 0 Triazol 0 0 Other 0 0 Substance 5 Notes: 1. Lead Form: GW − Gull Wing, TH − Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. + Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by date code only. If you need to confirm delivery of Halogen−free product, please contact Customer Service. This part is qualified as lead−free. Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for particular package types qualified as lead−free or in the qualification process). This report was generated on 2012−01−23. For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: http://www.maxim−ic.com/emmi 6